JPH06209147A - Printed-wiring board - Google Patents
Printed-wiring boardInfo
- Publication number
- JPH06209147A JPH06209147A JP215993A JP215993A JPH06209147A JP H06209147 A JPH06209147 A JP H06209147A JP 215993 A JP215993 A JP 215993A JP 215993 A JP215993 A JP 215993A JP H06209147 A JPH06209147 A JP H06209147A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- insulator
- tongue
- hole
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はリードフレームを介して
マザーボード上に実装されるサブボード用のプリント配
線基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board for a sub board mounted on a mother board via a lead frame.
【０００２】パソコン等の情報処理装置を初めとして近
年の電子機器は高機能化と共に小型化および軽量化が厳
しく要求されており、それを実現する手段の一つとして
各種の電子部品が実装されてなるサブボードを更にマザ
ーボード上に実装している。In recent years, electronic devices such as information processing devices such as personal computers are strictly required to be highly functional and to be small and lightweight, and various electronic parts are mounted as one means for realizing the demand. The sub-board is also mounted on the motherboard.
【０００３】かかる実装方法において例えばソケットや
コネクタを介してサブボードをマザーボード上に実装す
る場合もあるが、軽量化や信頼性を考えるとリードフレ
ームを介してサブボードをマザーボードに半田付けする
方法が最も優れている。In such a mounting method, the sub board may be mounted on the mother board via a socket or a connector, for example, but in consideration of weight reduction and reliability, a method of soldering the sub board to the mother board via a lead frame is available. The best.
【０００４】しかし、通常のプリント配線基板は絶縁体
と銅箔の接着強度が弱く振動等によって応力が印加され
ると剥離しやすい。そこで振動等によって応力が印加さ
れても銅箔が絶縁体から剥離し難いプリント配線基板の
開発が要望されている。However, in a usual printed wiring board, the adhesive strength between the insulator and the copper foil is weak and the printed wiring board is easily peeled off when stress is applied by vibration or the like. Therefore, there is a demand for the development of a printed wiring board in which the copper foil is difficult to separate from the insulator even when stress is applied by vibration or the like.
【０００５】[0005]
【従来の技術】図３は従来のプリント配線基板を示す分
割斜視図である。図において従来のサブボードは２個の
舌状端子部11、12を具えたリードフレーム１がプリント
配線基板２に嵌着され、プリント配線基板２は各種樹脂
からなる絶縁体21の両面に舌状端子部11、12を半田付け
する電極22が形成されている。2. Description of the Related Art FIG. 3 is a divided perspective view showing a conventional printed wiring board. In the figure, a conventional sub-board has a lead frame 1 having two tongue-shaped terminal portions 11 and 12 fitted on a printed wiring board 2, and the printed wiring board 2 is tongue-shaped on both sides of an insulator 21 made of various resins. An electrode 22 for soldering the terminal portions 11 and 12 is formed.
【０００６】リードフレーム１はプリント配線基板２の
下面に当接する舌状端子部11がリード端子部13に対し直
角に折り曲げられ、プリント配線基板２の上面に当接す
る舌状端子部12がリード端子部13に対して鋭角をなし中
間に屈曲部14を具えている。In the lead frame 1, a tongue-shaped terminal portion 11 that abuts the lower surface of the printed wiring board 2 is bent at a right angle to the lead terminal portion 13, and a tongue-shaped terminal portion 12 that abuts the upper surface of the printed wiring board 2 is a lead terminal. The portion 13 has an acute angle and a bent portion 14 in the middle.
【０００７】側面から視ると舌状端子部11の先端は下方
に屈曲し上方に屈曲した舌状端子部12の先端とで開口部
が形成されており、プリント配線基板２に嵌着する際は
かかる開口部をプリント配線基板２の側面と対向せしめ
所定の位置まで圧入する。When viewed from the side, an opening is formed by the tip of the tongue-shaped terminal portion 11 being bent downward and the tip of the tongue-shaped terminal portion 12 bent upward, so that the tongue-shaped terminal portion 11 is fitted to the printed wiring board 2 when fitted. The opening is made to face the side surface of the printed wiring board 2 and press-fitted to a predetermined position.
【０００８】リードフレーム１を所定の位置まで圧入す
ると舌状端子部11、12はそれぞれプリント配線基板２の
電極22に当接し、舌状端子部11、12をそれぞれ電極22に
半田付けすることによってリードフレーム１はプリント
配線基板２に接続される。When the lead frame 1 is press-fitted to a predetermined position, the tongue-shaped terminal portions 11 and 12 come into contact with the electrodes 22 of the printed wiring board 2, and the tongue-shaped terminal portions 11 and 12 are soldered to the electrodes 22 respectively. The lead frame 1 is connected to the printed wiring board 2.
【０００９】[0009]
【発明が解決しようとする課題】セラミック等の絶縁体
に銅箔を被着した配線基板は絶縁体と銅箔の接着強度が
強く振動等で銅箔が剥離することはない。それに対し絶
縁体が各種樹脂からなるプリント配線基板の場合は絶縁
体と銅箔の接着強度が1/3 〜1/2 程度しかない。In a wiring board in which an insulator such as a ceramic is coated with a copper foil, the insulator and the copper foil have a strong adhesive strength, and the copper foil does not peel off due to vibration or the like. On the other hand, in the case of a printed wiring board whose insulator is made of various resins, the adhesive strength between the insulator and the copper foil is only about 1/3 to 1/2.
【００１０】その結果、プリント配線基板にリードフレ
ームが半田付けされてなるサブボードに振動等によって
応力が印加されると、リードフレームに半田付けされた
電極が絶縁体から剥離し導体パターンに断線が生じると
いう問題があった。As a result, when stress is applied to the sub-board in which the lead frame is soldered to the printed wiring board by vibration or the like, the electrodes soldered to the lead frame are peeled from the insulator and the conductor pattern is broken. There was a problem that it would occur.
【００１１】本発明の目的は振動等によって応力が印加
されても銅箔が絶縁体から剥離し難いプリント配線基板
を提供することにある。An object of the present invention is to provide a printed wiring board in which the copper foil is difficult to peel off from the insulator even when stress is applied by vibration or the like.
【００１２】[0012]
【課題を解決するための手段】図１は本発明になるプリ
ント配線基板を示す側断面図である。なお全図を通し同
じ対象物は同一記号で表している。FIG. 1 is a side sectional view showing a printed wiring board according to the present invention. Note that the same object is denoted by the same symbol throughout the drawings.
【００１３】上記課題は少なくとも周縁部に嵌着された
リードフレームを半田付けする電極が絶縁体の両面に形
成され、リードフレームの２個の舌状端子部がそれぞれ
電極に半田付けされるプリント配線基板において、絶縁
体31と絶縁体31の両面に形成され舌状端子部11、12を半
田付けする電極32とを貫通する貫通孔33を有し、貫通孔
33の内壁面に沿ってスルーホールめっき層34が形成され
てなる本発明のプリント配線基板によって達成される。The above-mentioned problem is a printed wiring in which electrodes for soldering the lead frame fitted at least to the peripheral portion are formed on both surfaces of the insulator, and two tongue-shaped terminal portions of the lead frame are respectively soldered to the electrodes. The board has a through hole 33 penetrating the insulator 31 and the electrodes 32 formed on both surfaces of the insulator 31 for soldering the tongue-shaped terminal portions 11 and 12, and the through hole 33 is formed.
This is achieved by the printed wiring board of the present invention in which the through hole plating layer 34 is formed along the inner wall surface of 33.
【００１４】[0014]
【作用】図１において絶縁体と絶縁体の両面に形成され
舌状端子部を半田付けする電極とを貫通する貫通孔を設
けると共に、貫通孔の内壁面に沿ってスルーホールめっ
き層を形成することによって舌状端子部の半田付け時に
貫通孔に半田が流入し、リードフレームが有する２個の
舌状端子部の間が流入した半田で接続され絶縁体と銅箔
の接着強度が補強される。即ち、振動等によって応力が
印加されても銅箔が絶縁体から剥離し難いプリント配線
基板を実現することができる。In FIG. 1, a through hole is formed through the insulator and an electrode formed on both surfaces of the insulator to solder the tongue-shaped terminal portion, and a through hole plating layer is formed along the inner wall surface of the through hole. Thus, when the tongue-shaped terminal portion is soldered, the solder flows into the through hole, and the two tongue-shaped terminal portions of the lead frame are connected by the inflowing solder, and the adhesive strength between the insulator and the copper foil is reinforced. .. That is, it is possible to realize a printed wiring board in which the copper foil is difficult to separate from the insulator even when stress is applied by vibration or the like.
【００１５】[0015]
【実施例】以下添付図により本発明の実施例について説
明する。なお図２は本発明の他の実施例を示す側断面図
である。Embodiments of the present invention will be described below with reference to the accompanying drawings. 2 is a side sectional view showing another embodiment of the present invention.
【００１６】図１において本発明になるプリント配線基
板３は絶縁体31の両面に舌状端子部11、12を半田付けす
る電極32が形成され、絶縁体31と両面に形成された電極
32とを貫通する貫通孔33の内壁面にはスルーホールめっ
き層34が形成されている。In FIG. 1, the printed wiring board 3 according to the present invention has electrodes 32 for soldering the tongue-shaped terminal portions 11 and 12 formed on both sides of an insulator 31, and electrodes formed on the insulator 31 and both sides.
A through-hole plating layer 34 is formed on the inner wall surface of the through-hole 33 that penetrates the through hole 32.
【００１７】リードフレーム１はプリント配線基板３の
下面に当接する舌状端子部11がリード端子部13に対し直
角に折り曲げられ、プリント配線基板３の上面に当接す
る舌状端子部12がリード端子部13に対して鋭角をなし中
間に屈曲部14を具えている。In the lead frame 1, a tongue-shaped terminal portion 11 that contacts the lower surface of the printed wiring board 3 is bent at a right angle to the lead terminal portion 13, and a tongue-shaped terminal portion 12 that contacts the upper surface of the printed wiring board 3 is a lead terminal. The portion 13 has an acute angle and a bent portion 14 in the middle.
【００１８】側面から視ると舌状端子部11の先端は下方
に屈曲し上方に屈曲した舌状端子部12の先端とで開口部
が形成されており、プリント配線基板３に嵌着する際は
かかる開口部をプリント配線基板３の側面と対向せしめ
所定の位置まで圧入する。When viewed from the side, an opening is formed by the tip of the tongue-shaped terminal portion 11 being bent downward and the tip of the tongue-shaped terminal portion 12 bent upward, so that when it is fitted on the printed wiring board 3, The opening is made to face the side surface of the printed wiring board 3 and press-fitted to a predetermined position.
【００１９】リードフレーム１を所定の位置まで圧入す
ると舌状端子部11、12はそれぞれプリント配線基板３の
電極32に当接し、舌状端子部11、12をそれぞれ電極32に
半田付けすることによってリードフレーム１はプリント
配線基板３に接続される。When the lead frame 1 is pressed into a predetermined position, the tongue-shaped terminal portions 11 and 12 come into contact with the electrodes 32 of the printed wiring board 3, and the tongue-shaped terminal portions 11 and 12 are soldered to the electrodes 32, respectively. The lead frame 1 is connected to the printed wiring board 3.
【００２０】リードフレーム１を半田付けする際に半田
４が舌状端子部11、12と電極32の間に介在する空間を埋
めると同時に、スルーホールめっきされた貫通孔33の内
部にも流入し絶縁体31と電極32の接着強度は流入した半
田４によって補強される。At the time of soldering the lead frame 1, the solder 4 fills the space interposed between the tongue-shaped terminal portions 11 and 12 and the electrode 32, and at the same time, flows into the through hole 33 plated by through hole. The adhesive strength between the insulator 31 and the electrode 32 is reinforced by the inflowing solder 4.
【００２１】このように絶縁体と絶縁体の両面に形成さ
れ舌状端子部を半田付けする電極とを貫通する貫通孔を
設けると共に、貫通孔の内壁面に沿ってスルーホールめ
っき層を形成することによって舌状端子部の半田付け時
に貫通孔に半田が流入し、リードフレームが有する２個
の舌状端子部の間が流入した半田で接続され絶縁体と銅
箔の接着強度が補強される。即ち、振動等によって応力
が印加されても銅箔が絶縁体から剥離し難いプリント配
線基板を実現することができる。As described above, the through hole is formed so as to penetrate the insulator and the electrodes for soldering the tongue-shaped terminal portions formed on both surfaces of the insulator, and the through hole plating layer is formed along the inner wall surface of the through hole. As a result, when the tongue-shaped terminal portion is soldered, the solder flows into the through hole, and the two tongue-shaped terminal portions of the lead frame are connected by the inflowing solder to reinforce the adhesive strength between the insulator and the copper foil. . That is, it is possible to realize a printed wiring board in which the copper foil is difficult to separate from the insulator even when stress is applied by vibration or the like.
【００２２】本発明の他の実施例は図２に示す如くリー
ドフレーム１を嵌着したとき舌状端子部12の屈曲部14が
嵌入可能な位置に、絶縁体31と両面に形成された電極32
とを貫通し内壁面にスルーホールめっき層34が形成され
た貫通孔33を設けている。In another embodiment of the present invention, as shown in FIG. 2, when the lead frame 1 is fitted, the insulator 31 and the electrodes formed on both surfaces of the tongue-shaped terminal portion 12 can be fitted into the bent portion 14. 32
A through hole 33 is provided which penetrates through and has a through hole plating layer 34 formed on the inner wall surface.
【００２３】このようにリードフレーム１を嵌着したと
き舌状端子部12の屈曲部14が嵌入可能な位置に貫通孔33
を設けることで、リードフレーム１をプリント配線基板
３に嵌着する際のリードフレーム１の位置決めを極めて
容易にすることができる。When the lead frame 1 is thus fitted, the through hole 33 is provided at a position where the bent portion 14 of the tongue-shaped terminal portion 12 can be fitted.
By providing, the positioning of the lead frame 1 when the lead frame 1 is fitted on the printed wiring board 3 can be extremely facilitated.
【００２４】なお、舌状端子部11、12が貫通孔33を塞い
でいるように見えるが貫通孔33の直径が舌状端子部11、
12の幅より大きく、リードフレーム１を電極32に半田付
けする際に舌状端子部11、12が貫通孔33への半田４の流
入を妨げることはない。Although the tongue-shaped terminal portions 11 and 12 appear to close the through-hole 33, the diameter of the through-hole 33 is such that
The width is larger than the width of 12, and the tongue-shaped terminal portions 11 and 12 do not prevent the solder 4 from flowing into the through hole 33 when the lead frame 1 is soldered to the electrode 32.
【００２５】[0025]
【発明の効果】上述の如く本発明によれば振動等によっ
て応力が印加されても銅箔が絶縁体から剥離し難いプリ
ント配線基板を提供することができる。As described above, according to the present invention, it is possible to provide a printed wiring board in which the copper foil is difficult to peel off from the insulator even when stress is applied by vibration or the like.
【図１】 本発明になるプリント配線基板を示す側断面
図である。FIG. 1 is a side sectional view showing a printed wiring board according to the present invention.
【図２】 本発明の他の実施例を示す側断面図である。FIG. 2 is a side sectional view showing another embodiment of the present invention.
【図３】 従来のプリント配線基板を示す分割斜視図で
ある。FIG. 3 is a divided perspective view showing a conventional printed wiring board.
１ リードフレーム ３ プリント配線基板 ４ 半田 11、12 舌状端子部 13 リード端子部 14 屈曲部 31 絶縁体 32 電極 33 貫通孔 34 スルーホールめっ
き層1 Lead Frame 3 Printed Wiring Board 4 Solder 11, 12 Tongue Terminal 13 Lead Terminal 14 Bend 31 Insulator 32 Electrode 33 Through Hole 34 Through Hole Plating Layer
Claims (2)
レームを半田付けする複数の電極が絶縁体の両面に形成
され、該リードフレームの２個の舌状端子部がそれぞれ
両面の該電極に半田付けされるプリント配線基板におい
て、 絶縁体(31)と該絶縁体(31)の両面に形成され舌状端子部
(11,12) を半田付けする電極(32)とを貫通する貫通孔(3
3)を有し、該貫通孔(33)の内壁面に沿ってスルーホール
めっき層(34)が形成されてなることを特徴とするプリン
ト配線基板。1. A plurality of electrodes for soldering a lead frame fitted to at least a peripheral portion are formed on both surfaces of an insulator, and two tongue-shaped terminal portions of the lead frame are soldered to the electrodes on both surfaces, respectively. In a printed wiring board to be attached, an insulator (31) and tongue-shaped terminal portions formed on both surfaces of the insulator (31)
The through hole (3) that penetrates the electrode (32) for soldering (11, 12)
A printed wiring board having 3), wherein a through hole plating layer (34) is formed along the inner wall surface of the through hole (33).
端子部(12)の屈曲部(14)が嵌入可能な位置に貫通孔(33)
が設けられ、且つ、該貫通孔(33)の直径が該舌状端子部
(11,12) の幅より大きい請求項１記載のプリント配線基
板。2. A through hole (33) at a position where the bent portion (14) of the tongue-shaped terminal portion (12) can be fitted when the lead frame (1) is fitted.
Is provided, and the diameter of the through hole (33) is the tongue-shaped terminal portion.
The printed wiring board according to claim 1, wherein the printed wiring board is larger than the width (11, 12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP215993A JPH06209147A (en) | 1993-01-11 | 1993-01-11 | Printed-wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP215993A JPH06209147A (en) | 1993-01-11 | 1993-01-11 | Printed-wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06209147A true JPH06209147A (en) | 1994-07-26 |
Family
ID=11521581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP215993A Withdrawn JPH06209147A (en) | 1993-01-11 | 1993-01-11 | Printed-wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06209147A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003031889A (en) * | 2001-07-16 | 2003-01-31 | Hamamatsu Photonics Kk | Semiconductor laser assembly |
-
1993
- 1993-01-11 JP JP215993A patent/JPH06209147A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003031889A (en) * | 2001-07-16 | 2003-01-31 | Hamamatsu Photonics Kk | Semiconductor laser assembly |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4851614A (en) | Non-occluding mounting hole with solder pad for printed circuit boards | |
| US6295210B1 (en) | Chassis grounding ring for a printed wiring board mounting aperture | |
| US8115110B2 (en) | Printed circuit board minimizing undesirable signal reflections in a via and methods therefor | |
| CN101296556B (en) | Flexible circuit board | |
| JP2003100371A (en) | Wiring board with terminal | |
| US6512185B2 (en) | Printed-wiring board | |
| CN101325840A (en) | Anti-oxidization printed circuit board and gold finger thereof as well as method for manufacturing the printed circuit board | |
| JP2001068907A (en) | Fpc cable and connector for fpc cable | |
| JPH10233564A (en) | Flexible board | |
| JP2004327645A (en) | Printed wiring board | |
| JP2006295078A (en) | Structure for connecting main board with flexible print, and its connecting method | |
| JPH06209147A (en) | Printed-wiring board | |
| JPH1041605A (en) | Electronic component mounting structure | |
| JPH11346036A (en) | Electric board and electrical mounting installation method | |
| JP2019134120A (en) | Mounting structure, structural component, and manufacturing method of mounting structure | |
| JPH02214191A (en) | Connection structure of flexible printed wiring board | |
| JP2002299780A (en) | Printed wiring board | |
| US6655018B2 (en) | Technique for surface mounting electrical components to a circuit board | |
| JP2926956B2 (en) | Printed board | |
| JPH0752790B2 (en) | Parent-child board mounting method | |
| JPS6188471A (en) | Connector | |
| JP2006319013A (en) | Single-sided printed wiring board | |
| JP3111227B2 (en) | Printed wiring board for IC card | |
| JP2613952B2 (en) | Printed wiring board connection method | |
| JPS63237495A (en) | Composite circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20000404 |