JP2006295078A - Structure for connecting main board with flexible print, and its connecting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a structure for connecting a main board with a flexible printed board which can improve strength for connecting the main board with the flexible printed board opposed to a stress of the main board from the outside direction, and can reduce a production cost. <P>SOLUTION: First, a solder printing is carried out using a metal mask etc., a solder 10 is mounted on a land 4 of the main board 1, and a solder 11 is mounted on a land 5. Next, an FPC 2 is mounted on the main board 1 using a mounter so that the land 5 of the main board 1 and the through-hole 8 of the FPC 2 overlap each other, and a reinforcing material 9 is mounted on the FPC 2 to cover the through-hole 8. Next, the solder 10 and the solder 11 are melted using a reflow apparatus etc. and by hardening the solder 10 and the solder 11, the land 4 and a land 7 are connected through the solder 10, and the land 5 and the reinforcing material 9 are connected through the solder 11. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a connection structure between a rigid main board and a flexible flexible printed circuit board and a connection method thereof.

  Generally, a flexible printed circuit board is made of polyimide, copper foil, or the like and is thin, and therefore, a soldering land provided on a main board and a land provided on a flexible printed circuit board (hereinafter referred to as FPC (Flexible Printed Circuit)). If the FPC is bent after connecting the two, stress may be applied to the connecting portion and the FPC may be torn.

In view of this, it has been considered to cover the connecting portion between the main board and the FPC with a resin or the like from above the FPC, or to fix both ends of the FPC to the main board using a rivet or the like.
However, when the connecting portion between the main board and the FPC is covered with resin or the like from above the FPC, or when both ends of the FPC are fixed to the main board with rivets, the connecting portion is applied from the inner side of the main board. Although it is strong against the stress, it is weak against the stress applied to the connecting portion from the outer side of the main substrate, so that the FPC may be torn by the stress.

  Therefore, by sandwiching the FPC between the main substrate and the reinforcing member between the end portion of the main substrate and the connecting portion of the main substrate and the FPC, the stress applied to the connecting portion from the outside of the main substrate is It is considered to relax (see, for example, Patent Document 1 and Patent Document 2).

  FIG. 4A is a view showing an example of a connection structure between the main board and the FPC using the reinforcing member, and FIG. 4B is a view showing a cross section along A1-A2 of FIG. 4A. . FIG. 4C is a view showing another example of the connection structure between the main board and the FPC using the reinforcing member, and FIG. 4D is a cross-sectional view taken along the line B1-B2 of FIG. FIG.

  In the connection structure shown in FIGS. 4A and 4B, the land 42 at the tip of the wiring pattern 41 provided on the main board 40 and the land 45 at the tip of the wiring pattern 44 provided on the FPC 43 are soldered (not shown). ) Is connected through. A land 46 is provided between the end of the main board 40 and the land 42, and a land 47 is provided around a through hole provided between the wiring pattern 44 and the wiring pattern 44 of the FPC 43.

  First, the FPC 43 is placed on the main substrate 40 and the rod-shaped reinforcing member 48 is placed on the through hole of the FPC 43 so that the land 46 of the main substrate 40 and the through hole of the FPC 43 overlap. Next, the land 46, the land 47, and the reinforcing member 48 are connected by the solder 49.

Thereby, the FPC 43 can be sandwiched between the main substrate 40 and the reinforcing member 48 between the end portion of the main substrate 40 and the connection portion between the main substrate 40 and the FPC 43.
4C and 4D, the lands 42 of the main board 40 and the lands 45 of the FPC 43 are connected to each other through the solder, in addition to the lands 45 of the main board 40 and the FPC 43. Holes 50 are respectively provided at both ends of the. Further, both ends of the plate-like reinforcing member 51 are respectively inserted into the holes 50, and both ends of the reinforcing member 51 are bent at the back surface of the main board 40.

Thus, the FPC 43 can be sandwiched between the main board 40 and the reinforcing member 52 in the vicinity of the connection portion between the land 42 and the land 45.
JP-A-2-209788 (Page 4, FIGS. 10, 11) JP-A-4-340291 (Page 3, Fig. 1)

  However, in the connection structure shown in FIGS. 4A and 4B, since the land 47 and the reinforcing member 48 are connected via the solder 49, the outer direction of the main board 40 (FIG. The stress from the a) arrow C direction) is concentrated and received by the broken line D, and the FPC 42 may tear at the broken line D.

  In the connection structure shown in FIGS. 4A and 4B and the connection structure shown in FIGS. 4C and 4D, after the land 42 and the land 45 are connected via solder, Since the reinforcing member 48 and the reinforcing member 51 are mounted on the main board 40 and the FPC 43, there is a problem in that the number of reinforcing member mounting steps increases and the production cost increases accordingly. Further, if stress is applied to the FPC 43 due to a handling error or the like after the land 42 and the land 45 are connected and before the reinforcing member 48 and the reinforcing member 51 are attached to the main board 40 and the FPC 43, the land 42 and the land 45 are connected. There is a possibility that the FPC 42 may be torn at the connecting portion.

  Therefore, in the present invention, the connection structure between the main board and the flexible printed circuit board, which can improve the connection strength between the main circuit board and the flexible printed circuit board against the stress from the outer side of the main circuit board, and can reduce the production cost, and the An object is to provide a connection method.

In order to solve the above problems, the present invention adopts the following configuration.
That is, in the connection structure between the main board and the flexible printed board according to the present invention, the main board-side conduction land connected to the wiring pattern for configuring the electric circuit is formed on the inner side from the end, and the main board side A main board in which a reinforcing land is formed between the end portion and the main board side conduction land, and an FPC side conduction land connected to the main board side conduction land via solder are the main board. A flexible printed circuit board formed at a position facing the side conduction land and a through hole formed at a position facing the main board side reinforcing land, and a surface of the flexible printed circuit board on which the main board is provided; A reinforcing member provided on the opposite surface and connected to the main board-side reinforcing land via solder passing through the through hole, and the reinforcing member includes the flexible print The same or larger than the width of the substrate, and is characterized in that it is the same or larger than the diameter of the through hole.

  Accordingly, the flexible printed board can be sandwiched between the main board and the reinforcing member between the end portion of the main board and the main board side conduction land, and the stress applied to the flexible printed board from the outer side of the main board can be strengthened. The stress can be relaxed by the reinforcing member. Therefore, the connection strength between the main board and the flexible printed circuit board against the stress from the outer side of the main board can be improved.

  Further, since the main board side reinforcing land and the reinforcing member of the main board are connected by solder, the main board side reinforcing land is connected within the process of connecting the main board side conductive land and the FPC side conductive land. The land and the reinforcing member can be connected. Therefore, the reinforcing member mounting step can be omitted compared to the case where the reinforcing member is mounted on the main board and the flexible printed circuit board after the main board side conducting land and the FPC side conducting land are connected. Production costs can be reduced.

  Further, in the connection structure between the main board and the flexible printed board according to the present invention, since the reinforcing member larger than the portion covers the end portion side of the main board of the through hole, FIG. Compared with the case where the reinforcing member covers a part near the center of the through hole of the flexible printed circuit board and the flexible printed circuit board and the reinforcing member are connected as in the connection structure shown in FIG. The portion for receiving the stress applied to the flexible printed circuit board from the outside direction can be increased, and the connection strength can be improved accordingly.

  Further, the solder may be configured to be thicker than at least the thickness of the flexible printed board when the flexible printed board is distorted by the weight of the reinforcing member.

Thereby, since the minimum amount of solder that can connect the main board side reinforcing land and the reinforcing member can be used, an increase in production cost can be suppressed.
Further, in the connection structure between the main board and the flexible printed board, an FPC side reinforcing land is formed around the through hole of the flexible printed board, and the reinforcing member and the FPC side reinforcing land are connected via solder. May be configured to be connected.

  Thereby, since the play between the flexible printed circuit board and the reinforcing member after connecting the main board side reinforcing land and the reinforcing member can be eliminated, the connection strength between the main printed circuit board and the flexible printed circuit board can be further improved. it can.

  Further, in the connection structure between the main board and the flexible printed circuit board, an end part of the main board among end parts of the reinforcing member is bent in an L shape in the main board direction, and the reinforcing member is You may comprise so that the said flexible printed circuit board may be pressed down.

  Even if comprised in this way, since the backlash between the flexible printed circuit board and the reinforcing member after connecting the main board side reinforcing land and the reinforcing member can be eliminated, the connection strength between the main printed circuit board and the flexible printed circuit board can be reduced. Further improvement can be achieved.

  Further, the connection structure between the main board and the flexible printed circuit board is formed by bending an end of the reinforcing board on the end side of the main board in an L shape in a direction opposite to the main board direction. May be.

Thereby, even if a flexible printed circuit board is bent in the direction opposite to a main substrate direction, the stress concerning the contact part of a flexible printed circuit board and a reinforcement member can be relieved.
The connection structure between the main board and the flexible printed board may be configured by providing a convex portion at a position where the reinforcing member enters the through hole.

As a result, the amount of solder can be further reduced, so that the production cost can be reduced accordingly.
Further, in the connection structure between the main board and the flexible printed board, an FPC outside reinforcing land is formed at a position of the main board not facing the flexible printed board, and the reinforcing member is used for reinforcing the FPC outside via solder. You may comprise so that it may be connected with a land.

Thereby, the connection strength between the main board and the reinforcing member can be improved.
Further, according to the connection structure between the main board and the flexible printed board of the present invention, the main board-side conduction land connected to the wiring pattern for configuring the electric circuit is formed on the inner side from the end, and the FPC outside reinforcement A main board formed between the end portion and the main board side conduction land, and an FPC side conduction land connected to the main board side conduction land via solder is the main board side. A flexible printed circuit board formed at a position facing the conductive land, and solder provided at a position on the opposite side of the surface of the flexible printed circuit board from which the main board is disposed, and not facing the flexible printed circuit board And a reinforcing member connected to the FPC external reinforcing land.

  Thereby, the connection strength between the main board and the flexible printed circuit board can be improved and the production cost can be reduced as in the connection structure between the main board and the flexible printed circuit board of the present invention.

  In the connection method of the present invention, the main board-side conduction land connected to the wiring pattern for constituting the electric circuit is formed on the inner side from the end, and the FPC-side conduction land is the main board. A connection method with a flexible printed circuit board formed at a position facing a side conduction land, wherein a main board side reinforcing land is previously placed between an end of the main board and the main board side conduction land. And forming a through hole at a position facing the main board side reinforcing land of the flexible printed circuit board, and placing solder on the main board side conducting land and the main board side reinforcing land, respectively. The flexible printed circuit board is placed on the main board so that the board-side reinforcing land and the through hole overlap, and the reinforcing member is placed forward so that the through hole and the reinforcing member overlap. The main board side conduction land and the FPC side conduction land are connected via the solder by placing on a flexible printed board and melting the solder, and the main board side reinforcing land via the solder. A land is connected to the reinforcing member.

  ADVANTAGE OF THE INVENTION According to this invention, while being able to improve the connection strength of the main board | substrate and a flexible printed circuit board with respect to the stress from the outer side of a main board | substrate, production cost can be reduced.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Fig.1 (a) is a figure which shows the connection structure of the main board | substrate 1 and FPC (flexible printed circuit board) 2 of embodiment of this invention, FIG.1 (b) is E1-E2 of Fig.1 (a). It is a figure which shows a cross section.

  As the main substrate 1 shown in FIGS. 1A and 1B, for example, a glass epoxy substrate or an aluminum substrate can be considered. Further, a wiring pattern 3 for constituting an electric circuit is provided on the surface of the main board 1, and a soldering land 4 (main board side conduction land) is connected to the tip of the wiring pattern 3. Has been. Also, between the land 4 and the end of the main board 1 (showing the end of the main board 1 in the longitudinal direction of the FPC 2 when the main board 1 and the FPC 2 are connected, the same applies hereinafter) and the land 4 Soldering lands 5 (main board side reinforcing lands) are provided.

  The FPC 2 is a sheet-like flexible board, and is a copper foil wiring for electrically connecting the wiring pattern 3 of the main board 1 and a wiring pattern (not shown) of a board other than the main board 1. The pattern 6 extends to the tip of the FPC 2, and a soldering land 7 (FPC side conduction land) is connected to the tip of the wiring pattern 6. For example, the cross-sectional structure (thickness) of the FPC 2 is “polyimide (25 μm)” — “adhesive (28 μm)” — “copper (copper foil constituting the wiring pattern 6) (35 μm)” — “adhesive (16 μm)” "-" Polyimide (25 μm) ". Further, the FPC 2 is provided with a through-hole 8 between the wiring pattern 6 and the wiring pattern 6 and at a position facing the land 5 when connected to the main substrate 1. The shape of the through hole 8 is not particularly limited, such as a circle or a quadrangle.

  Further, the reinforcing member 9 is made of a plate-like metal, and for example, a plate-like copper formed by nickel plating, tin plating, or gold plating can be considered. The shape and material of the reinforcing member 9 are not particularly limited. The length F of the reinforcing member 9 in the longitudinal direction is preferably longer than the length G in the direction perpendicular to the longitudinal direction of the FPC 2 (the end portion where the land 7 of the FPC 2 is provided). Thereby, almost the stress applied to the FPC 3 from the outside direction of the main substrate 1 (arrow C in FIG. 1A) can be received at the end H of the reinforcing member 9, so that the stress is sufficiently relieved by the reinforcing member 9. Can be made.

  Further, as shown in FIG. 1B, the land 4 of the main board 1 and the land 7 of the FPC 2 are connected via solder 10. Further, the land 5 of the main substrate 1 and the reinforcing member 9 are connected via the solder 11. The upper and lower limits of the thickness of the solder 11 when the solder 11 is placed on the land 5 are not particularly limited, but the upper limit of the thickness of the solder 11 is, for example, 500 μm. Further, it is desirable that the thickness of the solder 11 when the solder 11 is placed on the land 5 is larger than at least the thickness of the FPC 2 when the FPC 2 is distorted by the weight of the reinforcing member 9. As a result, a minimum amount of solder 11 capable of connecting the land 5 and the reinforcing member 9 can be used, and an increase in production cost can be suppressed.

Next, an example of a method for connecting the main board 1 and the FPC 2 using the reinforcing member 9 will be described.
First, solder printing is performed using a metal mask or the like, and the solder 10 is placed on the land 4 of the main substrate 1 and the solder 11 is placed on the land 5. The solder 10 and the solder 11 at this time may be cream solder, for example.

  Next, using a mounter or the like, the FPC 2 is placed on the main board 1 so that the land 5 of the main board 1 and the through hole 8 of the FPC 2 corresponding to the land 5 overlap, and the through hole 8 is covered. Thus, the reinforcing member 9 is placed on the FPC 2. Thus, the FPC 2 and the reinforcing member 9 can each be one of the mount parts.

Next, the solder 10 and the solder 11 are melted using a reflow apparatus or the like.
Then, when the solder 10 and the solder 11 are hardened, the land 4 and the land 7 are connected via the solder 10, and the land 5 and the reinforcing member 9 are connected via the solder 11. In this way, the electrical connection between the land 4 and the land 7 and the reinforcement of the connecting portion between the main board 1 and the FPC 2 by the reinforcing member 9 can be performed simultaneously.

  Accordingly, the connection structure shown in FIGS. 1A and 1B can sandwich the FPC 2 between the end portion of the main board 1 and the land 4 between the main board 1 and the reinforcing member 9. Since the stress applied to the FPC 2 from the outside direction of the substrate 1 can be received by the reinforcing member 9, the stress can be relaxed by the reinforcing member 9. Therefore, the connection strength between the main board 1 and the FPC 2 against the stress from the outer side of the main board 1 can be improved.

  Further, since the connection structure shown in FIGS. 1A and 1B is configured to connect the land 5 of the main substrate 1 and the reinforcing member 9 with the solder 11, the land 4 and the land 7 are connected. In the process, the land 5 and the reinforcing member 9 can be connected. Therefore, compared with the connection structure shown in FIGS. 4C and 4D, the reinforcing member mounting step can be omitted, and thus the production cost can be reduced accordingly.

  Moreover, since the connection structure shown in FIG. 1A and FIG. 1B is formed such that the length F in the longitudinal direction of the reinforcing member 9 is larger than the length G in the direction perpendicular to the longitudinal direction of the FPC 2. The stress applied to the FPC 2 from the outside direction of the main substrate 1 can be received by the entire outline of the FPC 2 in the longitudinal direction. Further, the length F of the reinforcing member 9 in the longitudinal direction is the same as or larger than the width (length G) of the FPC 2, and the length in the longitudinal direction of the reinforcing member 9 is the same as the diameter of the through hole 8. Or you may form larger than it. Thereby, the stress can be sufficiently relieved by the reinforcing member 9. Further, when the reinforcing member 9 is made of metal, the reinforcing member 9 can be formed at a low cost.

The FPC 2 and the reinforcing member 9 may have various forms other than the above embodiment.
2A to 2D show cross-sectional views of the connection structure between the main substrate 1 and the FPC 2, respectively. FIG. 2A shows a modification of the FPC 2, and FIGS. d) each shows a modification of the reinforcing member 9. In addition, the same code | symbol is attached | subjected to the structure same as the structure of the said embodiment among the structures shown to Fig.2 (a)-(d).

The FPC 2 shown in FIG. 2A is provided with soldering lands 12 (FPC side reinforcing lands) around the through holes 8.
Thereby, since the land 12 and the reinforcing member 9 can be connected via the solder 11, the play between the FPC 2 and the reinforcing member 9 after connecting the land 5 and the reinforcing member 9 can be eliminated. The connection strength between the substrate 1 and the FPC 2 can be further improved.

Further, the reinforcing member 9 shown in FIG. 2B has an end on the end side of the main substrate 1 bent in an L shape in the direction of the main substrate 1.
Thereby, since the FPC 2 can be pressed against the main board 1 by the end portion of the reinforcing member 9, the play between the FPC 2 and the reinforcing member 9 after connecting the land 5 and the reinforcing member 9 can be eliminated. The connection strength between the main substrate 1 and the FPC 2 can be further improved.

Further, the reinforcing member 9 shown in FIG. 2C has an end portion on the end side of the main substrate 1 bent in an L shape in a direction opposite to the main substrate 1 direction.
Accordingly, when the FPC 2 is bent in the direction opposite to the main substrate 1 direction, the FPC 2 bends along the L-shaped portion of the reinforcing member 9, so that the stress applied to the contact portion between the FPC 2 and the reinforcing member 9 Can be relaxed.

Further, the reinforcing member 9 shown in FIG. 2D is provided with a convex portion 13 at a position facing the through hole 8 of the FPC 2.
Thereby, since the quantity of the solder 11 can further be reduced, the production cost can be reduced accordingly.

The connection structure between the main board 1 and the FPC 2 according to the present invention may have various forms other than the above embodiment.
FIG. 3A is a view showing a connection structure between the main board 1 and the FPC 2 according to another embodiment of the present invention, and FIG. 3B is a view showing a cross section taken along line J1-J2 of FIG. It is. In addition, the same code | symbol is attached | subjected to the structure same as the structure of the said embodiment among the structures shown to Fig.3 (a) and FIG.3 (b).

  The connection structure between the main board 1 and the FPC 2 shown in FIGS. 3A and 3B is formed at a position where the solder connecting land 14 (land for reinforcing FPC) does not face the FPC 2 of the main board 1. Besides the land 5 and the reinforcing member 9 being connected via the solder 11, the land 14 and the reinforcing member 9 are connected via the solder 15. Here, the “position not facing the FPC 2” indicates an area outside the FPC 2 in the area of the reinforcing member 9.

  Thereby, since the connection strength between the main board 1 and the reinforcing member 9 can be improved as compared with the connection structure shown in FIGS. 1A and 1B, the connection strength between the main board 1 and the FPC 2 can be further increased. Can be improved.

  FIG. 3C is a view showing a connection structure between the main substrate 1 and the FPC 2 according to still another embodiment of the present invention, and FIG. 3D is a cross-sectional view taken along the line K1-K2 of FIG. FIG. In addition, the same code | symbol is attached | subjected to the structure same as the structure of the said embodiment among the structures shown in FIG.3 (c) and FIG.3 (d).

  The connection structure between the main board 1 and the FPC 2 shown in FIGS. 3C and 3D is formed at a position where the land 14 does not face the FPC 2 of the main board 1, and the main board 1 is connected to the main board 1 only through the solder 15. The reinforcing member 9 is connected. Here, the “position not facing the FPC 2” also indicates the outside area of the FPC 2 within the area of the reinforcing member 9.

  Even if comprised in this way, the connection strength of the main board | substrate 1 and FPC2 can be improved. In addition, production costs can be reduced. The reinforcing member 9 used in the connection structure shown in FIGS. 3C and 3D is preferably made of a hard material such as metal.

  Moreover, although the main board | substrate 1 and FPC2 of the said embodiment are each comprised with the single layer board | substrate, you may comprise with a multilayer board | substrate. When the FPC 2 is configured with a multilayer substrate, it is desirable to adjust the thickness of the solder 11 according to the thickness of the multilayer FPC 2.

  In the above embodiment, the through hole 8 is provided between the wiring pattern 6 and the wiring pattern 6, but the through hole 8 may be provided in the wiring pattern 6. When configured in this way, the through hole 8 may be used as a through hole of the FPC 2 formed of a multilayer substrate.

  Moreover, in the said embodiment, although it is the structure which covers the whole through-hole 8 with the reinforcement member 9, it comprises so that at least the edge part side of the main board 1 of the through-hole 8 may be covered with the reinforcement member 9 larger than the part. Also good.

  In the connection structure configured in this way, the portion that receives the stress applied to the FPC 2 from the outside direction of the main substrate 1 can be made larger than at least the portion D shown in FIG. ) And the connection structure shown in FIG.

  In addition, although the said patent document 2 is a structure which reinforces the connection part of the main board | substrate 40 and FPC43 using the plate-shaped reinforcement member 51, the stress from the outer side of the main board | substrate 40 is concentrated in the hole 50 vicinity. Therefore, the FPC 43 may tear near the hole 50. Therefore, even if a configuration in which the above-mentioned Patent Document 1 is combined with the above-mentioned Patent Document 2, it is difficult to come up with a connection structure between the main substrate 1 and the FPC 2 of the present invention.

It is a figure which shows the connection structure of the main board | substrate and flexible printed circuit board of embodiment of this invention. It is a figure which shows the modification of FPC, and the modification of a reinforcement member. It is a figure which shows the connection structure of the main board | substrate and flexible printed circuit board of other embodiment of this invention. It is a figure which shows the connection structure of the conventional main board | substrate and a flexible printed circuit board.

Explanation of symbols

1 Main board 2 Flexible printed circuit board (FPC)
DESCRIPTION OF SYMBOLS 3 Wiring pattern 4 Land 5 Land 6 Wiring pattern 7 Land 8 Through-hole 9 Reinforcing member 10 Solder 11 Solder 12 Land 13 Convex part 14 Land 15 Solder

Claims (9)

A main board side conduction land connected to a wiring pattern for constituting an electric circuit is formed inside the end, and a main board side reinforcing land is formed between the end and the main board side conduction land. A main substrate formed between,
An FPC-side conduction land connected to the main board-side conduction land via solder is formed at a position facing the main board-side conduction land, and a through hole is opposed to the main board-side reinforcement land. A flexible printed circuit board formed at a position to
A reinforcing member provided on a surface opposite to the surface on which the main substrate of the flexible printed circuit board is provided, and connected to the main substrate-side reinforcing land through solder passing through the through hole;
With
The reinforcing member is formed to be equal to or larger than the width of the flexible printed circuit board and equal to or larger than the diameter of the through hole.
A connection structure between a main board and a flexible printed board. A connection structure between the main board and the flexible printed board according to claim 1,
The solder is at least thicker than the thickness of the flexible printed circuit board when the flexible printed circuit board is distorted by the weight of the reinforcing member,
A connection structure between a main board and a flexible printed board. A connection structure between the main board and the flexible printed board according to claim 1,
An FPC side reinforcing land is formed around the through hole of the flexible printed circuit board,
The reinforcing member and the FPC side reinforcing land are connected via solder.
A connection structure between a main board and a flexible printed board. A connection structure between the main board and the flexible printed board according to claim 1,
Of the end portions of the reinforcing member, the end portion on the end portion side of the main substrate is bent in an L shape toward the main substrate, and the reinforcing member presses the flexible printed circuit board.
A connection structure between a main board and a flexible printed board. A connection structure between the main board and the flexible printed board according to claim 1,
Of the end portions of the reinforcing member, the end portion on the end portion side of the main substrate is bent in an L shape in a direction opposite to the main substrate direction,
A connection structure between a main board and a flexible printed board. A connection structure between the main board and the flexible printed board according to claim 1,
A convex portion is provided at a position where the reinforcing member enters the through hole.
A connection structure between a main board and a flexible printed board. A connection structure between the main board and the flexible printed board according to claim 1,
FPC external reinforcement land is formed at a position not facing the flexible printed circuit board of the main board,
The reinforcing member is connected to the FPC outer reinforcing land through solder.
A connection structure between a main board and a flexible printed board. A main board side conduction land connected to a wiring pattern for constituting an electric circuit is formed on the inner side from the end, and an FPC outer reinforcing land is between the end and the main board side conduction land. A main substrate formed on
A flexible printed circuit board formed at a position where an FPC side conduction land connected to the main board side conduction land via solder faces the main board side conduction land;
A reinforcing member provided on a surface opposite to the surface on which the main substrate of the flexible printed circuit board is provided, and connected to the FPC external reinforcing land via solder at a position not facing the flexible printed circuit board;
A connection structure between a main board and a flexible printed board characterized by comprising: The main board-side conduction land connected to the wiring pattern for constituting the electric circuit is formed on the inner side from the end, and the FPC-side conduction land is located at a position facing the main board-side conduction land. A method for connecting to a formed flexible printed circuit board,
The main board side reinforcing land is formed in advance between the end of the main board and the main board side conducting land, and the through hole is opposed to the main board side reinforcing land of the flexible printed board. Formed into
Solder is placed on each of the main board side conduction lands and the main board side reinforcement lands,
The flexible printed circuit board is placed on the main board so that the main board side reinforcing land and the through hole overlap, and the reinforcing member is placed on the flexible printed circuit board so that the through hole and the reinforcing member overlap. ,
By melting the solder, the main board-side conduction land and the FPC-side conduction land are connected via the solder, and the main board-side reinforcement land and the reinforcing member are connected via the solder. Connect,
A method for connecting a main board and a flexible printed board.