JPH0619546Y2 - 加熱硬化装置 - Google Patents

加熱硬化装置

Info

Publication number
JPH0619546Y2
JPH0619546Y2 JP1989106355U JP10635589U JPH0619546Y2 JP H0619546 Y2 JPH0619546 Y2 JP H0619546Y2 JP 1989106355 U JP1989106355 U JP 1989106355U JP 10635589 U JP10635589 U JP 10635589U JP H0619546 Y2 JPH0619546 Y2 JP H0619546Y2
Authority
JP
Japan
Prior art keywords
gas
heating
sample member
heat
partition plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989106355U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0345937U (enrdf_load_stackoverflow
Inventor
武 木本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP1989106355U priority Critical patent/JPH0619546Y2/ja
Publication of JPH0345937U publication Critical patent/JPH0345937U/ja
Application granted granted Critical
Publication of JPH0619546Y2 publication Critical patent/JPH0619546Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP1989106355U 1989-09-11 1989-09-11 加熱硬化装置 Expired - Lifetime JPH0619546Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989106355U JPH0619546Y2 (ja) 1989-09-11 1989-09-11 加熱硬化装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989106355U JPH0619546Y2 (ja) 1989-09-11 1989-09-11 加熱硬化装置

Publications (2)

Publication Number Publication Date
JPH0345937U JPH0345937U (enrdf_load_stackoverflow) 1991-04-26
JPH0619546Y2 true JPH0619546Y2 (ja) 1994-05-25

Family

ID=31655086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989106355U Expired - Lifetime JPH0619546Y2 (ja) 1989-09-11 1989-09-11 加熱硬化装置

Country Status (1)

Country Link
JP (1) JPH0619546Y2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023530706A (ja) * 2020-06-18 2023-07-19 クリック アンド ソッファ インダストリーズ、インク． ダイアタッチシステム、フリップチップボンディングシステム、クリップアタッチシステムなどの装置のためのオーブンおよびその関連方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3156500B2 (ja) * 1994-05-11 2001-04-16 松下電器産業株式会社 キュア装置
JP4562231B2 (ja) * 2000-03-07 2010-10-13 日立化成工業株式会社 熱硬化性樹脂組成物硬化製品の製造装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5992539A (ja) * 1982-11-19 1984-05-28 Hitachi Ltd ワイヤボンデイング方法
JPS61185990U (enrdf_load_stackoverflow) * 1985-05-08 1986-11-20
JPS63239957A (ja) * 1987-03-27 1988-10-05 Nec Corp 半導体装置製造方法
JPS63316443A (ja) * 1987-06-19 1988-12-23 Hitachi Electronics Eng Co Ltd 銀ペ−ストキュア装置
JPS63316444A (ja) * 1987-06-19 1988-12-23 Hitachi Electronics Eng Co Ltd 銀ペ−ストキュア装置における加熱装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023530706A (ja) * 2020-06-18 2023-07-19 クリック アンド ソッファ インダストリーズ、インク． ダイアタッチシステム、フリップチップボンディングシステム、クリップアタッチシステムなどの装置のためのオーブンおよびその関連方法

Also Published As

Publication number Publication date
JPH0345937U (enrdf_load_stackoverflow) 1991-04-26

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