JPH06186416A - Color filter and its production - Google Patents

Abstract

PURPOSE:To provide the color filter which obviates blurring of picture elements and can be produced at a low cost and the process for production of such color filter. CONSTITUTION:Partition walls 2 are provided in patterns arranged with the picture elements in stripe forms on the main surface of a glass substrate 1. Color ink 4 of R, G, B are put in prescribed arrangement and the pricture elements in stripe forms are formed in recessed parts 3 enclosed by these partition walls 2. The surface of the partition walls 2 is formed of a material (for example, composite plating, etc.) into which a fluorine compd. (for example, PTFE) is dispersed and incorporated at 1 to 3Owt.% to have an ink repulsive property. The colored ink 4 does not remain on the partition wall 2 even if the colored ink 4 sticks onto the partition walls 2. The blurring of the picture elements is thus prevented. This color filter is easily produced at a low cost by utilizing electroplating, electroless plating or electrodeposition coating.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a color filter mainly used for liquid crystal display, and a method for manufacturing the color filter.

[0002]

2. Description of the Related Art A color filter used for a liquid crystal display basically has three primary colors (R (red), G (green)) of additive color mixture on a main surface of a substrate such as glass having a light transmitting property. , B
A large number of picture elements each having a set of (blue) pixels are arranged. In addition, a light-shielding region (generally black and referred to as a black matrix) having a predetermined width is provided between each pixel in order to enhance display contrast.

As a method for arranging each pixel (picture element) in a predetermined pattern on the main surface of a light-transmissive substrate, conventionally, in addition to electrophotography and electrodeposition, thermal transfer is used as a low-cost manufacturing method. There is a printing method or an inkjet method.

Among the conventional manufacturing methods, in the printing method and the inkjet method which can manufacture a color filter at a low cost, colored ink is applied to an area where each pixel is formed, that is, an area surrounded by a black matrix, and an inkjet nozzle is used. At this time, in order to realize highly accurate coloring by preventing ink bleeding due to ink flowing into the area forming other pixels or ink remaining on the black matrix at this time. It is required to adjust the thickness of the black matrix according to the amount of ink to be inserted, and to make the upper surface of the black matrix ink-repellent so that the color ink can be contained in the target area. . As for the thickness of the black matrix, the black matrix may be formed to a thickness that prevents the ink from flowing into other regions if the amount of ink to be filled in the regions where the pixels are formed is determined. On the other hand, as a technique for forming the upper surface of the black matrix to be ink repellent, for example, the applicant of the present application has proposed a technique disclosed in Japanese Patent Laid-Open No. 4-195102.

In this method, first, a light-shielding thin film is formed in a predetermined pattern on the main surface of a transparent substrate, and a photosensitive resin layer and a silicone rubber layer are applied in that order on the entire surface of the substrate to form a substrate. The photosensitive resin layer and the silicone rubber layer are partially removed by exposing and developing from the lower surface, and an area for containing ink surrounded by the photosensitive resin layer and the silicone rubber layer is formed, and a dyeable medium is formed in the area. Is applied, and the ink is put in to color the dyeable medium, then exposed from the main surface of the substrate and developed to remove the photosensitive resin layer and silicone rubber layer used to prevent ink bleeding. is there. According to this method, by forming a concave region for containing ink in the partition with the silicone rubber layer on the upper surface, the upper surface of the partition becomes ink-repellent. Even if ink is attached, the ink is repelled and bleeding of the ink is prevented.

[0006]

However, the conventional example having such a structure has the following problems. That is, the above-mentioned method using the silicone rubber layer for preventing ink bleeding requires a number of complicated treatment steps, and thus there is a problem that the manufacturing cost cannot be reduced.

Further, since the silicone rubber layer is not sufficiently removed as in the photosensitive resin layer in the developing step after exposure, it is necessary to carry out post-treatment, and there is a problem that the manufacturing cost is high.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a color filter which is free from pixel bleeding and can be manufactured at low cost, and a manufacturing method thereof.

[0009]

The present invention has the following constitution in order to achieve such an object. That is, the invention according to claim 1 is that a plurality of partition walls are provided in a predetermined pattern on the main surface of the translucent substrate, and a plurality of color inks of a predetermined color are placed in the recesses surrounded by the partition walls. In the color filter in which pixels are formed, the upper surface of the partition wall is
The partition wall is formed of a material containing 1 to 30% by weight of a fluorine compound.

The invention according to claim 2 is characterized in that partition walls are provided in a predetermined pattern on the main surface of the translucent substrate, and
In a method of manufacturing a color filter in which a plurality of pixels are formed by putting a color ink of a predetermined color in a concave portion surrounded by the partition wall, a conductive thin film is formed on the main surface of the substrate according to a partition wall pattern to be formed. And depositing a composite plating containing 1 to 30% by weight of a fluorine compound dispersed therein by electroplating on the formed thin film to form the partition wall, and forming the partition wall in the recess surrounded by the partition wall. The color inks are put in a predetermined arrangement.

According to a third aspect of the present invention, partition walls are provided in a predetermined pattern on the main surface of the transparent substrate, and
In a method of manufacturing a color filter in which a plurality of pixels are formed by inserting a predetermined color ink into a recess surrounded by the partition wall, a mask layer having a pattern in which the partition wall portion to be formed remains concave on the main surface of the substrate. And forming a composite plating containing 1 to 30% by weight of a fluorine compound in a dispersed manner on the main surface of the substrate where the mask layer is not formed, and removing only the mask layer. The partition walls are formed by, and the color inks are put in a predetermined array in the recesses surrounded by the partition walls.

According to the invention of claim 4, partition walls are provided in a predetermined pattern on the main surface of the translucent substrate, and
In a method of manufacturing a color filter in which a plurality of pixels are formed by inserting a predetermined color ink into a recess surrounded by the partition wall, 1 to 30% by weight of a fluorine compound is dispersed and contained on the entire main surface of the substrate. A composite layer formed on the main surface of the substrate, and a mask layer is formed on the composite plating formed on the main surface of the substrate in accordance with the pattern of the partition wall to be formed. After removing the plating, the mask layer remaining on the composite plating is removed to form the partition wall, and in the recess surrounded by the partition wall,
The color inks are put in a predetermined arrangement.

The invention according to claim 5 is the method for producing a color filter according to any one of claims 2 to 4, in which 1 to 30 parts by weight in a polymer is used instead of the composite plating. % Of the fluorine compound is dispersed and contained in the coating film, and the coating film is subjected to electrodeposition coating.

[0014]

The operation of the invention described in claim 1 is as follows. That is, the upper surface of the partition wall that surrounds the recess for forming the pixel by forming the ink is formed of a material containing 1 to 30% by weight of a fluorine compound. This fluorine compound is
Since the surface energy is low, the wettability with water, oil, etc. is extremely poor. Even when the ink adheres to the partition walls when the ink is put into the recesses, the adhesion is weak and the ink is repelled and the ink is deposited on the partition walls. Does not remain. Further, the repelled ink is pulled by the condensation force of the ink itself put in the intended recess and is settled in the recess. Therefore, pixel blurring is prevented. The reason why the amount of the fluorine compound is 1 to 30% by weight is that if the amount is less than this range, sufficient ink repellency cannot be obtained. On the contrary, if the amount is more than this range, it is difficult to disperse the fluorine compound and the partition wall is formed. This is because the compositional uniformity is also reduced.

According to the second to fourth aspects of the present invention, the upper surface of the partition wall is formed by the composite plating containing 1 to 30% by weight of the fluorine compound dispersed therein. This manufacturing method uses an electroplating method or an electroless plating method,
The ink repellent partition wall can be manufactured by a simple manufacturing process, and the color filter in which the pixel bleeding is prevented can be manufactured at low cost.

According to a fifth aspect of the present invention, in the method for producing a color filter according to the second to fourth aspects, instead of the composite plating, 1 to 30% by weight is contained in the polymer. With a structure in which a coating film containing a dispersed fluorine compound is electrodeposited, ink-repellent partition walls can be manufactured by a simple manufacturing process, and a color filter in which pixel bleeding is prevented can be manufactured at low cost. .

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing an appearance of a part of a color filter manufactured by the present invention, and FIG. 2 is a view taken along the line AA of FIG. In this embodiment, in a color filter used for liquid crystal display, stripes of R (red) and G are formed.
Although an example in which (green) and B (blue) color inks are arranged to form pixels is used, a color filter that forms pixels in other arrangements, for example, R, G, and B in a grid pattern is used. A color filter or the like in which color inks are arranged to form pixels can be similarly manufactured.

In the figure, reference numeral 1 indicates a glass substrate having a light-transmitting property, and partition walls 2 are provided on the main surface of the glass substrate 1 in a pattern in which pixels are arranged in stripes.
Further, in the concave portion 3 surrounded by the partition wall 2, R, G, and B color inks 4 (however, 4 _R in FIG. 2 is red ink, 4 _G is green ink, and 4 _B is blue ink, respectively). Put in,
Striped pixels are formed.

This color filter has a size of 10 inches. To describe the size of each part, the thickness H ₁ of the glass substrate ₁ is about 1.0 mm and the width W of each recess 3 is W.
₃ is about 110 μm, the width W ₂ of each partition 2 is about 40 μm, and the thickness H ₂ of each partition ₂ is about 3.5 μm. Width W of recess 3
₃ and the width W _{2 of the} partition wall 2 can be further miniaturized as the liquid crystal image becomes higher in density. Further, the thickness H _{2 of the} partition wall 2 can be adjusted according to the amount of ink to be filled in each recess 3 to prevent the ink 4 from spreading from the target recess 3 ₁ to the other recesses 3 ₂ , 3 _3. Bleeding of pixels due to this can be prevented. Generally, it may be in the range of 0.5 μm to 20 μm, preferably 1 μm to 5 μm. It is difficult to reduce the thickness H _{2 of the} partition walls 2 to less than 0.5 μm because of the average particle diameter of the fluorine compound used to form the partition walls 2 as described later, and when it exceeds 20 μm, The shape and composition of the formed partition walls 2 are not uniform, and it takes time to form them, which is not preferable.

The upper surface of the partition wall 2 has ink repellency and is constructed so as to shield visible light.
In order to make the upper surface of the partition wall 2 ink-repellent, even if the colored ink 4 is attached to the partition walls 2 ₁ and 2 ₂ around the target recessed portion 3 _{1 in} the manufacturing process in which the colored ink 4 is put in the recessed portion 3, The color ink 4 is repelled on the partition wall 2 and the color ink 4 is not left on the partition wall 2 (the top surface of the partition wall 2 is not colored or impregnated).
This is to prevent bleeding of pixels of the molded color filter. The color ink 4 repelled on the partition 2 is settled in the recess 3 ₁ due to the condensing force of the color ink 4 itself put in the target recess 3 ₁ .

As described above, in order to make the upper surface of the partition wall 2 ink-repellent, the upper surface of the partition wall 2 is formed of a material containing 1 to 30% by weight of a fluorine compound. Since this fluorine compound has a low surface energy, it has very poor wettability with water, oil, etc., so that sufficient ink repellency can be obtained. It is preferable to use PTFE (polytetrafluoroethylene) as the fluorine compound. This is PTF
Since E is generally used as a fluorine compound and can be manufactured at a relatively low cost, the manufacturing cost of the color filter can be reduced. In addition,
Other fluorine compounds such as graphite fluoride ((CF))
n) or the like may be used.

The average particle size of the fluorine compound particles is preferably 10 μm or less. When the average particle size is 10 μm or more, when the partition walls 2 are formed, the particle size is larger than the thickness thereof, the thickness becomes uneven, and residual substances (metals in the first to third manufacturing methods described later, In the fourth to sixth production methods, it is difficult to stably disperse and contain the fluorine compound in the polymer, which is not preferable. In this embodiment, a fluorine compound having an average particle size of about 1 μm is used. In the present invention, the effect of the invention can be further exerted by using a fluorine compound having a finer average particle diameter, but the production cost of the fluorine compound increases with the reduction of the particle radius. It is preferable to use a fluorine compound having an average particle size of 1 μm, which can be manufactured at a relatively low cost by the current technology. It should be noted that it is preferable to use a fluorine compound having a particle diameter of 1 μm or less if the production technology of the fluorine compound is improved and a fluorine compound having an average particle size smaller than 1 μm can be manufactured at low cost.

The amount of the fluorine compound contained in the material forming the partition walls 2 may be 1 to 30% by weight, and particularly preferably 5 to 10% by weight.
If the amount of the fluorine compound is less than 1% by weight, sufficient ink repellency cannot be obtained, and if it is more than 30% by weight, it is difficult to disperse the fluorine compound in the partition walls 2 and the partition wall composition is uniform. Is also reduced. The residual components other than the fluorine compound differ depending on the manufacturing method described later. In the first to third production methods, chromium (C
r), nickel (Ni), cobalt (Co), or
Composite plating is performed using a metal such as nickel (Ni) and phosphorus (P) alloy, and the partition walls 2 are formed by using electroplating or electroless plating technology. In the fourth to sixth manufacturing methods, a polymer such as acrylic resin is used as the residual component,
The partition walls 2 are formed by using the electrodeposition coating technique.

The reason why the partition wall 2 is constructed so as to shield visible light is to function as a black matrix for enhancing the display contrast of the manufactured color filter.

As described above, in the first to third manufacturing methods, since the upper surface of the partition wall 2 is formed by the composite plating composed of the fluorine compound and the light-shielding metal, the partition wall 2 is shielded from visible light. Can be configured. Further, in the fourth to sixth manufacturing methods, as will be described later, since the upper surface of the partition wall 2 is formed with a coating film in which a fluorine compound and a light-shielding graphite are dispersedly contained in a polymer, visible light rays are not generated. The partition 2 can be configured to shield.

There are various methods of manufacturing the color filter having the above-mentioned structure. Among them, a method which is particularly simple and has a low manufacturing cost will be described below.

First, the first manufacturing method will be described with reference to FIG. In this first manufacturing method, a conductive thin film is formed on a glass substrate 1 in a predetermined pattern, and a composite plating made of a metal and a fluorine compound is deposited on the thin film by electroplating to form a partition wall 2. It is characterized by The first manufacturing method corresponds to the manufacturing method described in claim 2.

First, a conductive thin film is formed on the main surface of the glass substrate 1 in accordance with the pattern of the partition walls 2 to be formed (pattern in which pixels are arranged in stripes). More specifically, a copper thin film 11 of about 1.5 μm is deposited on the main surface of the glass substrate 1 by chemical copper plating, and the copper thin film 1 is deposited.
1 is screen-printed on 1 to match the pattern of the partition wall 2 desired to be formed, and a portion (unmasked portion) of the copper thin film 11 is removed by salt copper etching. As shown in a), a conductive copper thin film 11 having a predetermined pattern is formed on the main surface of the glass substrate 1.
To form. There are various other methods for forming the copper thin film 11 on the glass substrate 1. For example, the copper thin film 11 may be formed by sputtering or the like, and a photolithography method using a resist for masking with a predetermined pattern. You may form a mask with.

Next, if necessary, the surface of the copper thin film 11 is degreased and then washed with water, and further activated with an acid and then washed with water. In this embodiment, the surface of the copper thin film 11 on the glass substrate 1 is activated by immersing it in a 5% sulfuric acid aqueous solution for 10 minutes.

After washing with water, electroless plating is applied to the copper thin film 11 to form a composite plating made of a metal and a fluorine compound.
The barrier ribs 2 having a predetermined pattern are formed by depositing them on top.

In the present embodiment, nickel (Ni) is used as the residual substance other than the fluorine compound, and it is used in an electric nickel plating bath consisting of nickel sulfamate (450 g / l), nickel chloride (45 g / l) and boric acid (40 g / l). 100 g of fine PTFE powder sized to an average particle size of 1 μm
/ L and a KAOTIN-type surfactant were forcibly stirred by mechanical stirring to form a plating bath in which PTFE was suspended, and the copper thin film 11 on the glass substrate 1 was used as the cathode, and the cathode current density was 1A. / Dm ² , 4 at 50 ℃
After plating for 50 seconds, a composite plating layer 12 of Ni (93% by weight) -PTFE (7% by weight) is deposited on the copper thin film 11 in an amount of about 2
μm precipitate. Then, after washing with water, washing with methanol, and drying with hot air, a thickness of about 3.5 μm (the copper thin film 11 is about 1.5 μm, on the main surface of the glass substrate 1 as shown in FIG. 3B). A partition 2 having a composite plating layer 12 of about 2 μm) and an upper surface thereof having ink repellency (the composite plating layer 12 containing the ink repellent PTFE becomes the upper surface of the partition 2) is formed in a predetermined pattern.

Next, the recess 3 surrounded by the formed partition wall 2 is formed.
Then, the color ink 4 is put in a predetermined arrangement to form a color filter. An ink jet method, a printing method, or the like can be used as a method of putting the color ink 4 into the recessed portion 3, but it is preferable to use the ink jet method having high positioning accuracy of the ink application position. FIG. 4 shows a state in which the color ink 4 is put into the concave portion 3 by using the inkjet method.

As shown in FIG. 4, the red ink 4 jet nozzles 6 for injecting _{R R,} green ink 4 jet nozzles 6 for injecting _{G G,} and blue ink 4 ink jet nozzles 6 _B is attached for injecting _B The head 7 is moved to move each ink jet nozzle _6R , _6G , 6
Recess 3 _R (recess for red ink 4 _R ) and 3 _G (recess for green ink 4 _G ) for _B respectively 3
_B positioned at the top (blue ink 4 _B recess put), each recess 3 _R, 3 _G, 3 _B to the desired color ink 4 _R, 4 _G, 4
_B is sprayed in. Each recess 3 _R, 3 _G, 3 color inks was placed in a _{B 4 R, 4 G, 4} B , the recess 3 _R, 3 _G, 3
_It rises from _B (dotted line in the figure), but after a predetermined time elapses, it contracts due to the contraction force of the ink (solid line in the figure),
Fit into each recess 3 _R , 3 _G , 3 _B. At this time, since the upper surface of the partition wall 2 is formed to be ink repellent as described above,
Even if the colored ink 4 is attached to the partition walls 2, the ink 4 is repelled and does not color or soak into the partition walls 2, so that the bleeding of pixels after the color filter molding is prevented. Further, the color ink 4 attached on the partition walls 2 is pulled into the recess 3 by the condensing force of the color ink 4 itself put in the target recess 3.

Even when the printing method is used, the ink 4 is repelled in the same manner as described above even if the color ink 4 is attached to the partition walls 2 due to the blurring of the printing at the time of printing. Bleeding is prevented.

After the color inks 4 are placed in the recesses 3 in a predetermined arrangement, the color inks 4 and the upper portions of the partition walls 2 are coated, if necessary, to protect the color inks 4 as shown in FIG. You may In the figure, reference numeral 8 is about 2 μm ±
The coating layer coated to 0.1 μm is shown. The thickness error of the coating layer 8 is preferably 0.1 μm or less as described above. This is to prevent irregular reflection of light due to waviness on the surface of the coating layer 8.

Next, the second manufacturing method will be described with reference to FIG. In this second manufacturing method, a mask layer is formed on the glass substrate 1 so that the partition walls 2 to be formed remain in a concave shape, and a composite plating layer composed of a metal and a fluorine compound is formed in the concave portion where the mask layer is not formed. Is formed, and then the mask layer is removed to form the partition walls 2. The second manufacturing method corresponds to the manufacturing method described in claim 3.

First, a mask layer is formed on the main surface of the glass substrate 1 in a pattern in which the partition walls 2 to be formed remain concave.
For this, the mask layer 21 is formed as shown in FIG. 6A by, for example, a photolithography method using a resist. The method for forming the mask layer 21 can be realized by another method, for example, screen printing.

Next, a composite plating layer made of a metal and a fluorine compound is formed in the concave portion where the mask layer 21 is not formed. The method of forming the composite plating layer can be realized by various methods such as electroplating and electroless plating. However, the case of forming the composite plating layer by the method utilizing electroplating which can shorten the processing time is as follows. Explained.

First, as shown in FIG. 6B, a conductive thin film 22 is formed in the concave portion where the mask layer 21 is not formed. The method of forming the thin film 22 will be described below.

First, SnCl ₂ (20 g) and HCl
The glass substrate 1 is dipped in a sensitizing solution composed of (40 ml) and H ₂ O (1000 ml), and is subjected to a sensitizing treatment at about 40 ° C. to 50 ° C. for 5 minutes while stirring, followed by washing with water.

Next, PdCl ₂ (0.2 g to 1.0
g), HCl (10 ml to 20 ml) and H ₂ O (1
The sensitized glass substrate 1 is dipped in a palladium chloride solution consisting of 2,000 ml) at about 50 ° C. for 0.5 to 1 minute, washed with water and dried to be activated.

Then, the activated glass substrate 1 is dipped in an electroless nickel plating solution [5-fold dilution of Nimden (trade name, manufactured by Uemura Kogyo Co., Ltd.)] at about 90 ° C. for 5 minutes. Thickness of about 1.5 μm as shown in FIG.
The conductive thin film 22 is formed on the glass substrate 1 from which the mask layer 21 is removed, that is, at the place where the partition 2 is formed.

Next, as shown in FIG. 6C, a composite plating layer 23 (having a thickness of about 2 μm) made of Ni and PTFE is formed on the conductive thin film 22 by electroplating. Since the forming conditions and the like are the same as those in the above-mentioned first manufacturing method, the description thereof is omitted here. Next, only the mask layer 21 is removed, and as shown in FIG.
5 μm (copper thin film 22 is about 1.5 μm, composite plating layer 23
Of about 2 μm) (partition 2 (ink-repellent composite plating layer 23)
Are on the top surface).

The recess 3 surrounded by the formed partition wall 2 is formed.
Then, by the same method as the above-mentioned first manufacturing method, the color ink 4 is put in a predetermined arrangement to form a color filter.

Next, the third manufacturing method will be described with reference to FIG. In this third manufacturing method, a composite plating layer made of a metal and a fluorine compound is formed on the entire surface of the glass substrate 1, and a mask layer is formed according to the pattern of the partition walls 2 desired to be formed on the composite plating layer. The partition wall 2 is formed by removing the portion of the plating layer where the mask layer is not formed and then removing the mask layer. The third manufacturing method corresponds to the manufacturing method described in claim 4.

First, a composite plating layer made of a metal and a fluorine compound is formed on the entire main surface of the glass substrate 1. There are various methods for forming the composite plating layer, for example, electroplating, electroless plating, and coating, but a method using electroplating that is easy to process and has a high processing speed will be described below. First, a conductive copper thin film layer (thickness: about 1.5 μm) is formed on the entire surface of the glass substrate 1. This is performed by chemical copper plating or the like as described in the first manufacturing method above.

The copper thin film thus formed is degreased, washed with water, washed with an acid (activation treatment), washed with water, and then electroplated to form a composite plating layer 32 of Ni and PTFE as shown in FIG. 7A. (Thickness is about 2 μm) is formed on the conductive copper thin film 31. Since the forming conditions and the like are the same as those in the above-mentioned first manufacturing method, the description thereof is omitted here.

Next, as shown in FIG. 7B, a mask layer 33 is formed on the composite plating layer 32 by screen printing or the like in accordance with the pattern of the partition wall 2 to be formed. Then, for example, wet etching is performed by using a release agent [Asahi Lip S-1, S-2 (trade name, manufactured by Uemura Kogyo Co., Ltd.)], and as shown in FIG.
Of 2, the portion where the mask layer 33 is not formed is removed. Further, the mask layer 33 is also removed, and the result shown in FIG.
As shown in FIG. 3, the thickness is about 3.5 μm (the copper thin film 31 is about 1.
A partition wall 2 (having an ink-repellent composite plating layer 32 on the upper surface) having a thickness of 5 μm and a composite plating layer 32 of about 2 μm) is formed.

Then, the concave portion 3 surrounded by the formed partition wall 2 is formed.
Then, by the same method as the above-mentioned first manufacturing method, the color ink 4 is put in a predetermined arrangement to form a color filter.

Next, the fourth to sixth manufacturing methods will be described. The fourth to sixth manufacturing methods are the same as those in the above-described first to third manufacturing methods.
In the case of depositing 2, 23, 32 (see FIGS. 3, 6, and 7) by electroplating, the composite plating layers 12, 23, 3
In place of 2, the coating film in which PTFE is dispersedly contained in the acrylic resin (graphite is also dispersedly contained for the light shielding property) is characterized by electrodeposition coating. The fourth to sixth manufacturing methods correspond to the manufacturing method described in claim 5.

Specifically, for example, taking the first manufacturing method as an example, as shown in FIG. 3A, a conductive copper thin film 1 is formed.
After forming No. 1, a voltage of 10 V was applied to the copper thin film 11, the glass substrate 1 was immersed in a coating film bath [Elecoat (trade name, Shimizu Co., Ltd.)], and electrodeposition coating was performed at a bath temperature of 25 ° C. for 2 minutes. ,
Ink-repellent coating of about 2 μm (composite plating layer 1 in FIG. 3)
2) is formed. Then, the coating film is baked by oven drying at 190 ° C. for 30 minutes, and the thickness is about 3.5
The partition walls 2 (the coating film containing ink-repellent PTFE is the upper surface of the partition walls 2) having a thickness of μm (the copper thin film 11 is about 1.5 μm and the coating film is about 2 μm) are formed.

The second manufacturing method and the third manufacturing method (FIG. 6,
7) as well, the composite plating layers 23, 32 are similarly formed.
When forming by electroplating, copper thin film 2
The partition wall 2 can be formed by forming a coating film (in place of the composite plating layers 23 and 32) on the layers 2 and 31 under the same conditions as above.

[0053]

As is apparent from the above description, according to the first aspect of the invention, a layer made of a material containing a predetermined amount of a fluorine compound having high ink repellency is filled with ink to form a pixel. It is formed on the upper surface of the partition wall that surrounds the recessed portion, and when ink is put into the recessed portion, even if the ink adheres to the partition wall, the ink is repelled and the ink does not remain on the partition wall. It is possible to realize a color filter that does not include

According to the second aspect of the invention, a conductive thin film is formed in a predetermined pattern on a transparent substrate, and 1 to 30 parts by weight of a fluorine compound is dispersed and contained on the thin film. The composite plating is deposited by electroplating to form partition walls, and the color ink is put in the recesses surrounded by the partition walls, and it is possible to manufacture a color filter that prevents pixel bleeding with a simple process. The manufacturing cost can also be reduced.

According to the third aspect of the invention, the mask layer is formed on the translucent substrate so that the partition wall to be formed remains concave, and 1 to 1 are formed in the concave portion where the mask layer is not formed. After formation of composite plating containing 30 parts by weight of a fluorine compound dispersed therein, the mask layer is removed to form partition walls, and color ink is put into the recesses surrounded by the partition walls. It is possible to manufacture a color filter in which bleeding is prevented, and it is possible to reduce the manufacturing cost.

Further, according to the invention of claim 4, the composite plating containing 1 to 30 parts by weight of the fluorine compound dispersed therein is formed on the entire surface of the transparent substrate, and the partition wall to be formed on the composite plating is formed. The mask layer is formed according to the pattern of No. 3, and after removing the portion of the composite plating where the mask layer is not formed, the mask layer is removed to form partition walls, and color ink is applied to the recesses surrounded by the partition walls. With such a configuration, it is possible to manufacture a color filter in which pixel bleeding is prevented by simple processing, and it is also possible to reduce the manufacturing cost.

According to a fifth aspect of the present invention, in the method for producing a color filter according to the second to fourth aspects, instead of the composite plating, 1 to 30% by weight of fluorine is contained in the polymer. With a constitution in which a coating film containing a dispersed compound is applied by electrodeposition, a color filter in which pixel bleeding is prevented can be manufactured by a simple process, and the manufacturing cost can be reduced.

[Brief description of drawings]

FIG. 1 is a diagram showing an appearance of a part of a color filter manufactured by the present invention.

FIG. 2 is a view on arrow AA of FIG.

FIG. 3 is a diagram showing a manufacturing process according to a first manufacturing method.

FIG. 4 is a cross-sectional view showing a state where color inks are put in by an inkjet method.

FIG. 5 is a cross-sectional view showing a state in which the upper surface of the color filter is coated.

FIG. 6 is a diagram showing a manufacturing process according to a second manufacturing method.

FIG. 7 is a diagram showing a manufacturing process according to a third manufacturing method.

[Explanation of symbols]

1 ... glass substrate (translucent substrate) 2 ... partition wall 3 ... recess 4 ... color inks surrounded by the partition walls _{6 R, 6 G, 6 B} ... inkjet nozzles 7 ... ink heads 8 ... coating layer 11,22,31 ... Copper thin film (conductive thin film) 12, 23, 32 ... Composite plating (layer) made of Ni and PTFE, or acrylic resin (polymer) and PTF
Coating film consisting of E, 21, 33 ... Mask layer

Claims (5)

[Claims] 1. A color in which partition walls are provided in a predetermined pattern on a main surface of a transparent substrate, and a plurality of pixels are formed by inserting color ink of a predetermined color into the recesses surrounded by the partition walls. In the filter, the partition wall is configured so that the upper surface of the partition wall is formed of a material containing 1 to 30% by weight of a fluorine compound. 2. A color filter in which partition walls are provided in a predetermined pattern on a main surface of a light-transmissive substrate, and a plurality of pixels are formed by inserting color ink of a predetermined color into the recesses surrounded by the partition walls. In the manufacturing method of, on the main surface of the substrate, to form a conductive thin film in accordance with the pattern of the partition to be formed, on the formed thin film,
It is characterized in that composite plating containing 1 to 30% by weight of a fluorine compound dispersed therein is deposited by electroplating to form the partition wall, and the color ink is put in a predetermined array in the recess surrounded by the partition wall. Color filter manufacturing method. 3. A color filter in which partition walls are provided in a predetermined pattern on a main surface of a translucent substrate, and a plurality of pixels are formed by inserting color ink of a predetermined color into the recesses surrounded by the partition walls. In the manufacturing method of 1., a mask layer is formed on the main surface of the substrate in a pattern in which a partition wall portion to be formed remains in a concave shape, and 1 to 1 are formed in the concave portion on the main surface of the substrate where the mask layer is not formed. Thirty
Forming a partition by forming a composite plating in which a fluorine compound is dispersed and contained by weight% and removing only the mask layer, and putting the color ink in a predetermined array in the recess surrounded by the partition. A method for manufacturing a characteristic color filter. 4. A color filter in which partition walls are provided in a predetermined pattern on a main surface of a translucent substrate, and a plurality of pixels are formed by inserting color ink of a predetermined color into the recesses surrounded by the partition walls. In the manufacturing method of 1., a composite plating containing 1 to 30% by weight of a fluorine compound dispersed therein is formed on the entire main surface of the substrate, and the composite plating is formed on the main surface of the substrate. A mask layer is formed according to the pattern of the partition wall that is desired to be formed, the composite plating is removed from a portion where the mask layer is not formed, and then the mask layer remaining on the composite plating is removed to form the partition wall. A method for manufacturing a color filter, characterized in that the color ink is put in a predetermined array in a recess surrounded by the partition wall. 5. The method for manufacturing a color filter according to claim 2, wherein the composite plating is replaced with a coating containing 1 to 30% by weight of a fluorine compound dispersed in a polymer. A method for producing a color filter, characterized in that the film is electrodeposited.