JPH06177227A - Semiconductor pellet protruding apparatus - Google Patents

Abstract

PURPOSE:To freely control a protruding operation of a protruding needle and to obtain an optimum protruding operation adapted for a pellet by the control. CONSTITUTION:A protruding rod 4 is axially telescopically mounted coaxially with an adsorption stage 2 in the stage 2 formed with an adsorption table 2a provided with an adsorption hole 2c communicating with a negative pressure chamber 2b at an upper end. A protruding needle 5 is coaxially mounted at an end of the rod 4 at the table 2a side. On the other hand, a linear motor 7 is directly mounted at an opposite end via a connecting rod 6. The motor 7 is connected to a controller 9 having a setter 10 via a linear motor driver 8, and the motor 7 is controlled to be driven.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor pellet ejecting device for peeling a semiconductor pellet attached to a wafer sheet from the wafer sheet.

[0002]

2. Description of the Related Art In the manufacture of semiconductor devices, a pellet bonding operation is carried out in which semiconductor pellets (hereinafter referred to as pellets) attached to a wafer sheet are sequentially picked up and mounted on a lead frame. The pellet is pushed up from the back with a push-up needle.

Conventionally, as a push-up device of this type, a push-up needle is moved up and down by using a cam mechanism as described in, for example, Japanese Patent Application Laid-Open No. 2-113547.

[0004]

As described above, when the up-and-down movement of the push-up needle is performed by the cam, the push-up needle can perform only a certain operation along the cam curve.
For this reason, when trying to change the operating conditions such as the thrust amount and the thrust timing, the cam itself had to be replaced. Since the push-up device is provided in the wafer stretching device included in the pellet bonding device, the cam replacement work must be performed in the limited space inside the wafer stretching device. I was forced to change it. Further, after the push-up needle has been replaced, the origin position of the push-up needle must be adjusted, which requires a lot of time for the replacement work. Further, in the conventional push-up device, since the push-up force of the pellet cannot be changed, there is a drawback that a good push-up operation cannot be performed when the size of the pellet or the adhesive force of the wafer sheet is changed.

It is an object of the present invention to provide a semiconductor pellet ejecting apparatus capable of freely controlling the ejecting operation of an ejecting needle and thereby obtaining an optimal ejecting operation suitable for a pellet.

[0006]

According to a first aspect of the present invention, there is provided a semiconductor pellet ejecting apparatus for ejecting a semiconductor pellet adhered on a wafer sheet from a back surface of the wafer sheet by using an ejection needle and peeling the semiconductor pellet. The linear drive motor for advancing and retracting the ejection needle is provided at the end of the ejection needle opposite to the wafer sheet.

According to a second aspect of the present invention, there is provided a semiconductor pellet ejecting apparatus for ejecting a semiconductor pellet adhered on a wafer sheet from a back surface of the wafer sheet by using an ejecting needle, and peeling the semiconductor pellet. A linear drive motor that is provided at the end portion on the side opposite to the wafer sheet to move back and forth, a setting means that can set the operating conditions of the linear drive motor, and a position detection means that can detect the position of the linear drive motor. A control means for controlling the drive of the linear drive motor based on the set value in the setting means and the detection value of the position detection means is provided.

[0008]

According to the first aspect of the present invention, when the semiconductor pellet attached to the wafer sheet is ejected by the ejection needle, the ejection needle is moved by the linear drive motor.

According to the present invention as set forth in claim 2, the ejecting needle for ejecting the semiconductor pellet attached to the wafer sheet is moved forward and backward by the linear drive motor, and the linear drive motor is set by the setting value in the setting means. And the value detected by the position detection means.

[0010]

Embodiments of the present invention will be described with reference to the drawings. 1 is a front sectional view showing a configuration of a first embodiment of the present invention, and FIG. 2 is a partial front sectional view showing an operating state of FIG.

In FIG. 1, a semiconductor pellet pushing-up device 1 has a cylindrical suction stage 2, and an upper portion of the suction stage 2 forms a flat suction table 2a. The suction table 2a communicates with a negative pressure chamber 2b provided inside the suction stage 2 capable of making a negative pressure inside the suction device through a suction passage 3 in a suction device (not shown), and an opening is formed on the suction table 2a. A plurality of suction holes 2c are provided. In addition, a rod-shaped push-up rod 4 is mounted in the suction stage 2 coaxially with the central axis of the suction stage 2 so as to be movable back and forth in the axial direction. A push-up needle 5 is mounted coaxially with the push-up rod 4 at the end of the push-up rod 4 on the suction table 2a side. On the other hand, the linear motor 7 is directly attached to the opposite end through the connecting rod 6. The linear motor 7 includes a moving coil 7 a fixed to the connecting rod 6 and the moving coil 7 a.
and a magnet 7b provided so as to surround a.

The linear motor 7 is connected to the control unit 9 through the linear motor driver 8, and the control unit 9
Has a setting unit 10 for setting the operating conditions of the linear motor 7. In addition, this operating condition means the linear motor 7
The driving conditions required for the linear motor 7 during the peeling operation of the pellet P in the push-up device 1, such as the driving speed, the driving amount and the driving force, or the driving timing. Further, the linear motor 7 is provided with a position detection sensor 11, and the output end of the position detection sensor 11 has a control unit 9
It is connected to the.

The push-up device 1 thus constructed is
The wafer sheet S to which the pellets P are attached is arranged so as to be movable back and forth with respect to the wafer sheet S in a wafer stretching device (not shown) that fixes the wafer sheet S in a stretched state. This arrangement position is, for example, when the wafer expanding device is XY-θ.
When it is movable in the direction, the rotation axis of the θ table and the axial center of the push-up needle 5 are positioned at the same position, and the pellet P is sucked and conveyed immediately above the push-up needle 5 by the suction nozzle N that sucks and conveys the pellet P. Pick up position.

Next, the operation will be described.

A pellet P is attached to a wafer stretching device (not shown).
When the wafer sheet S attached with is fixed in a stretched state, a predetermined pellet P is positioned at the pickup position by the movement of the wafer stretching device after a predetermined recognition operation accompanying the pickup operation of the pellet P. At this time, the push-up device 1 is on standby in the lowered position to prevent the wafer sheet S and the suction table 2a from interfering with each other when the wafer stretching device is moved. When the pellet P is positioned at the pickup position, the center of the pellet P is located on the push-up needle 5 because the pickup position and the axial center of the push-up needle 5 coincide with each other.

Next, the push-up device 1 moves up to bring the suction table 2a into contact with the wafer sheet S, and the suction force of the suction holes 2c generated by the negative pressure generated in the negative pressure chamber 2b by the suction device (not shown). Then, the wafer sheet S is sucked. Then, when the suction nozzle N is positioned at the pickup position, the control unit 9 drives the linear motor 7 in synchronization with the timing at which the suction nozzle N sucks the pellet P and raises the suction nozzle N to a predetermined position. At the same time, the push-up needle 5 is raised. At this time, the linear motor 7 is previously set by the setting unit 1 so that the position where the tip of the push-up needle 5 and the upper surface of the suction table 2a coincide with each other is the origin position.
It is set to 0. Further, the operation pattern of the push-up needle 5, that is, the linear motor 7, is preset in the setting unit 10 according to the type of the pellet P and the viscosity of the wafer sheet S. For example, when a relatively large pellet P is peeled off from the highly viscous wafer sheet S, the linear motor 7 is set to be driven as shown in FIG. That is, the linear motor 7 is lifted at a low speed and with a low weight, and the height Δ is increased.
Each time t is increased in 3 steps. In the case of such an operation pattern, the wafer sheet S is gradually peeled from the outer peripheral side of the pellet P in the first rise, and the wafer sheet S is further moved toward the center of the pellet P in the second rise.
Is torn off. Then, in the third rise, the wafer sheet S is pierced by the sharp tip portion of the push-up needle 5 and completely separated from the pellet P. Such means for moving the push-up needle 5 by a predetermined amount is based on the amount of movement of the linear motor 7 by the position detection sensor 11
It becomes possible to detect by.

The pellet P separated by the above means is
By the suction nozzle N, it is conveyed to, for example, die bonding means. After this, the wafer stretching device (not shown)
Next, the pellet P to be picked up is positioned at the pickup position. The pellet P is picked up by the above-described operation.

According to the first embodiment described above, the push-up needle 5
The linear motor 7 is driven by
Operating condition set in the setting unit 10 and the position detection sensor 1
Since it is controlled by the control unit 9 based on the position information of the linear motor 7 detected in 1, it is possible to freely and easily set or change the operating condition of the push-up needle 5. it can.

For the same reason, the pushing force of the push-up needle 5 can be freely changed, and the push-up can be divided into several stages. For this reason, it is possible to perform a push-up operation that matches the size of the pellet P and the adhesive force of the wafer sheet S, and it is possible to perform a good peeling operation without causing damage to the pellet P or a suction error.

Since the linear motor 7 is directly fixed to the push-up rod 4 via the connecting rod 6, the push-up device 1 itself can be downsized. Therefore, the push-up device 1 can be lightened, and the lifting means of the push-up device 1 can be saved in labor.

Next, a second embodiment of the present invention will be described with reference to FIG.
Will be explained.

In FIG. 3, the difference from the first embodiment is that the linear motor 12 is a moving magnet type linear motor 12 and the entire linear motor 12 is built in the adsorption stage 2. The same parts as those in FIG. 1 are designated by the same reference numerals and the description thereof will be omitted. Further, in FIG. 3, parts corresponding to the linear motor driver 8, the control unit 9, and the setting unit 10 in FIG. 1 are omitted.

First, the linear motor 12 is attached to the end of the push-up rod 4 on the side opposite to the suction table 2a.
The moving magnet 12a is directly fixed, and the coil 12b is fixed to the inner peripheral surface of the attraction stage 2 corresponding to the moving magnet 12a.

The second embodiment has the following effects in addition to the same effects as the first embodiment.

First, the suction stage 2 and the linear motor 12 are integrated by fixing the coil 12b to the inner peripheral surface of the suction stage 2, so that the end portion of the suction stage 2 on the linear motor 12 side can be sealed. The airtightness in the negative pressure chamber 2b can be improved. Therefore, the negative pressure of a vacuum device (not shown) can be efficiently transmitted to the suction holes 2c, the wafer sheet S can be efficiently sucked, and the peeling operation of the pellets P can be reliably performed.

Since the coil 12b is arranged around the moving magnet 12a, the volume of the coil 12b can be increased and the output of the linear motor 12 can be increased. Further, when compared to a moving coil type linear motor having the same output, the linear motor itself can be made smaller and lighter, and therefore, further smaller size and lighter weight can be achieved as compared with the first embodiment.

In the case of FIG. 1, one end of the push-up rod 4 projects into the negative pressure chamber 2b, and the other end is in contact with the atmosphere. Therefore, every time the negative pressure chamber 2b is evacuated or released to the atmosphere, the push-up rod 4 is inadvertently moved up and down, which makes it difficult to control the operation. Since the entire motor 12 is installed in the suction stage 2, such a situation is prevented and the operation control is facilitated.

The present invention is not limited to pushing up the pellets, but may be, for example, those in which the wafer is vertically arranged and the pellets are pushed out in the lateral direction, and those in which the wafer is attached to the lower surface of the wafer sheet and the pellets are pushed down. Application is also possible.

[0029]

According to the present invention, the ejecting operation of the ejecting needle can be freely controlled, and thus the optimal ejecting operation suitable for the pellet can be obtained.

[Brief description of drawings]

FIG. 1 is a front sectional view showing a configuration of a first embodiment of the present invention.

FIG. 2 is a partial front sectional view showing an operating state of FIG.

FIG. 3 is a front sectional view showing a configuration of a second embodiment of the present invention.

[Explanation of symbols]

 1 Semiconductor Pellet Pushing Device 5 Pushing Needle 7 Linear Motor 7a Moving Coil 7b Magnet 9 Control Unit 10 Setting Unit 12 Linear Motor 12a Moving Magnet 12b Coil

Claims (2)

[Claims] 1. A semiconductor pellet ejecting apparatus for ejecting a semiconductor pellet adhered on a wafer sheet from a back surface of the wafer sheet by using an ejecting needle and peeling the semiconductor pellet, wherein A semiconductor pellet ejecting device comprising a linear drive motor that moves an ejecting needle forward and backward. 2. A semiconductor pellet ejecting device for ejecting a semiconductor pellet adhered on a wafer sheet from a back surface of the wafer sheet by using an ejection needle and peeling the semiconductor pellet, wherein the ejection needle is provided at an end portion of the ejection needle opposite to the wafer sheet. A linear drive motor for moving the ejector needle back and forth, setting means for setting the operating condition of the linear drive motor, position detecting means for detecting the position of the linear drive motor, and a set value in the setting means. A semiconductor pellet ejecting device comprising: a control unit that controls driving of the linear drive motor based on a detection value of the position detection unit.