JPH0614993Y2 - 電子部品の樹脂封止成形装置 - Google Patents
電子部品の樹脂封止成形装置Info
- Publication number
- JPH0614993Y2 JPH0614993Y2 JP1988136621U JP13662188U JPH0614993Y2 JP H0614993 Y2 JPH0614993 Y2 JP H0614993Y2 JP 1988136621 U JP1988136621 U JP 1988136621U JP 13662188 U JP13662188 U JP 13662188U JP H0614993 Y2 JPH0614993 Y2 JP H0614993Y2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- mold
- molds
- bolt insertion
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 title claims description 57
- 229920005989 resin Polymers 0.000 title claims description 57
- 238000000465 moulding Methods 0.000 title claims description 50
- 238000005538 encapsulation Methods 0.000 claims description 34
- 230000037431 insertion Effects 0.000 claims description 31
- 238000003780 insertion Methods 0.000 claims description 31
- 238000007789 sealing Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 241001397809 Hakea leucoptera Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988136621U JPH0614993Y2 (ja) | 1988-10-18 | 1988-10-18 | 電子部品の樹脂封止成形装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988136621U JPH0614993Y2 (ja) | 1988-10-18 | 1988-10-18 | 電子部品の樹脂封止成形装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0258921U JPH0258921U (enrdf_load_stackoverflow) | 1990-04-27 |
| JPH0614993Y2 true JPH0614993Y2 (ja) | 1994-04-20 |
Family
ID=31397299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988136621U Expired - Lifetime JPH0614993Y2 (ja) | 1988-10-18 | 1988-10-18 | 電子部品の樹脂封止成形装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0614993Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2757073B2 (ja) * | 1990-09-28 | 1998-05-25 | ファナック株式会社 | プラテンに対する金型の固定方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58136426A (ja) * | 1982-02-08 | 1983-08-13 | Yamada Seisakusho:Kk | トランスフアー成形機の金型位置決め方法 |
| JPS62109612A (ja) * | 1985-11-08 | 1987-05-20 | Fujitsu Ltd | モ−ルド型の固定方法 |
| JPS62159613U (enrdf_load_stackoverflow) * | 1986-03-29 | 1987-10-09 | ||
| JPH0331452Y2 (enrdf_load_stackoverflow) * | 1986-05-09 | 1991-07-04 |
-
1988
- 1988-10-18 JP JP1988136621U patent/JPH0614993Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0258921U (enrdf_load_stackoverflow) | 1990-04-27 |
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