JPH0613441A - Inspection and measurement of semiconductor integrated circuit device - Google Patents

Abstract

PURPOSE:To test and measure easily and rapidly a semiconductor integrated circuit device wherein many output terminals are highly integrated by a method wherein all the output terminals are shorted and output selection switches are controlled separately for each output terminal and then a level of current which flows in a wiring for supplying an output signal is measured. CONSTITUTION:All the output terminals 10 of an output circuit section 28 of a semiconductor integrated circuit device 18 are shorted from outside of the semiconductor integrated circuit device 18. Output selection switches 12, each of which is connected to each of the shorted output terminals 10 in the semiconductor integrated circuit device 18, is controlled separately for each output terminal 10 and then a level of current which flows in wirings for supplying an output signal 14 and 16 is measured. The measured current level is compared with the one which is expected to achieve when the semiconductor integrated circuit device 18 is normal. By this method, it is determined whether an output circuit section 28 of the semiconductor integrated circuit device 18 which is to be tested and measured is good or not and whether an operation of a function circuit 8 which is related to the control of the output circuit section 28 is good or not.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for inspecting and measuring a semiconductor integrated circuit device, and more particularly to a semiconductor capable of easily and promptly inspecting and measuring a semiconductor integrated circuit device in which a large number of output terminals are highly integrated. The present invention relates to an inspection / measurement method for an integrated circuit device.

[0002]

2. Description of the Related Art A conventional method for inspecting and measuring a semiconductor integrated circuit device (hereinafter sometimes referred to as an IC) will be described.

Generally, in the inspection and measurement of ICs, all of the power supply terminals, input terminals, and output terminals of the IC that are necessary for the inspection and measurement are individually and collectively touched to make electrical inspection and measurement. By doing.

More specifically, first, all of the power supply terminals, input terminals, and output terminals of the IC to be inspected and measured, which are necessary for inspection and measurement, are collectively touched with individual measuring needles, and then this IC is inspected. By supplying the necessary power supply voltage to the power supply terminal of and inputting the necessary input signal to the input terminal,
A predetermined circuit operation is performed inside C, and as a result, the signal output from the IC to the output terminal is electrically measured.

Then, by comparing the measurement result with the output signal potential value and the output characteristic expected from the operation function of this IC, the operation of the circuit portion related to the quality of the output circuit of the IC itself and the control of the output circuit is compared. Determine the quality of the function.

The IC fulfills its function by acting on the peripheral circuit device by the potential signal output to the output terminal. Therefore, whether or not the operation function of the circuit portion related to the control of the output circuit is good is the original function of the IC. It is equal to the quality of the operating function of the circuit part that controls it. Therefore, the quality of the operation function of the entire IC, that is, the quality of the IC can be determined by the above-described inspection measurement.

[0007]

The above-described method for inspecting and measuring a semiconductor integrated circuit device has the following features when it is necessary to inspect and measure a semiconductor integrated circuit device having a large number of output terminals arranged in high density. It causes various difficult problems to be noted.

As a first problem, a jig for holding and fixing the inspection measurement needles necessary for contacting all the output terminals requiring inspection measurement individually and collectively with a high accuracy (hereinafter, referred to as a jig) It is technically very difficult to manufacture (referred to as a probe card), and it is impossible to manufacture the probe card, or even if it is possible, it is extremely expensive.

In order to alleviate the above-mentioned difficulty in manufacturing the probe card, the collective stylus is stopped for all the output terminals that need to be inspected and measured, for example, the number of inspected output terminals to be inspected at one time is inspected. 2 of the total number of terminals that require measurement
Reduced to one-third, or one-third, instead of two
In principle, a method of inspecting and measuring all the terminals in every three or three degrees is also possible. However, the method of dividing measurement requires replacement of the probe card, etc.
The entire inspection and measurement work becomes extremely complicated, and the efficiency of inspection and measurement is significantly reduced.

Further, due to the restrictions on the manufacturing technique of the probe card, which is extremely difficult to manufacture as described above, the shape, size, and arrangement interval of the output terminals are restricted, and high integration of the semiconductor device is prevented. There is also a problem.

Further, even if a probe card which is difficult to manufacture as described above is somehow manufactured, all the output terminals required for inspection of the semiconductor device are stylized, and the signal lines from the individual stylus needles are used as an inspection and measurement device. Even if it is pulled in, it is necessary to prepare the number of signal lines that lead in the measurement circuit for inspection in the inspection and measurement apparatus, that is, the number of output terminals that need to be inspected, so the inspection and measurement apparatus becomes very expensive. .

Further, avoiding this adverse effect, the signal lines for all the output terminals drawn into the inspection and measurement device by using a small number of inspection and measurement circuits and changeover switches in the inspection and measurement device are used.
When the method of sequentially measuring the number of small numbers is adopted, the time required for the inspection measurement increases, and the efficiency of the inspection measurement significantly decreases.

In order to solve the above-mentioned problems, an object of the present invention is to perform a conventional inspection in which a semiconductor integrated circuit device having a large number of output terminals is individually stylized for electrical measurement. An object of the present invention is to provide a method for inspecting and measuring a semiconductor integrated circuit device, which can be carried out more simply and quickly, instead of the measuring technique.

[0014]

In order to achieve the above object, the present invention employs the inspection and measurement method described below.

In the method of inspecting and measuring a semiconductor integrated circuit device according to the present invention, the output selection switch is connected to each of the plurality of output terminals, and the output selection switches connected to each of the plurality of output terminals are the same connection. In the inspection and measurement of a semiconductor integrated circuit device having an output circuit unit configured by connecting to a plurality of output signal supply wirings, the total number of output terminals of the output circuit unit in the semiconductor integrated circuit device is Measure the current value flowing between each output signal supply wiring after controlling the output selection switch that is short-circuited from the outside and connected to each of the shorted output terminals inside this semiconductor integrated circuit device independently for each output terminal. Then, the output circuit section of the semiconductor integrated circuit device to be measured is compared with the expected current value when the semiconductor integrated circuit device is normal. And judging the quality of the operation of the function circuit according to the control of the quality and the output circuit section.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below using the semiconductor integrated circuit device shown in FIG. 1 as an example.

First, the structure and function of the semiconductor integrated circuit device will be described with reference to the circuit block diagram of FIG.

As shown in FIG. 1, a semiconductor integrated circuit device 1
Reference numeral 8 denotes a functional circuit 8 that performs main circuit operations including control of the output selection switch 12, an input terminal 2 that inputs an input signal for controlling the circuit operation of the functional circuit 8, and the semiconductor integrated circuit device 18 as a whole. A power supply terminal 20 for supplying a power supply voltage to the output circuit section 28.

Further, the output circuit section 28 includes an output terminal 10
An output selection switch 12 including a first output switch 4 and a second output switch 6, and a first output switch 4
For supplying an output signal to the output terminal 10 via
Output signal supply wiring 14, a second output signal supply wiring 16 for supplying an output signal to the output terminal via the second output switch 6, and a first output signal supply wiring 14
A first output signal is supplied from the outside of the semiconductor integrated circuit device 18 to each of the second output signal supply wiring 16 and the first output signal supply wiring 16.
The output signal supply terminal 24 and the second output signal supply terminal 26 of FIG.

In the semiconductor integrated circuit device 18, the first output switch 4 and the second output switch 6 connected to each output terminal 10 are individually operated for each output terminal 10 by the circuit operation of the functional circuit 8. The first output signal supply wiring 14 and the second output signal supply wiring 1 are controlled to arbitrary output terminals.
It has a function of selecting and outputting any one of the two output signals supplied at 6.

Next, a specific example of the inspection and measurement method of the present invention will be described with reference to the circuit block diagram showing the semiconductor integrated circuit device of FIG.

In the IC to be inspected and measured, all the output terminals which are the objects of the inspecting and measuring method according to the present invention are short-circuited from the outside of the IC, the required power supply voltage is supplied to the power supply terminal 20 of the IC, and the outputs having different potentials from each other. A signal A and an output signal B are prepared. The output signal A is the first output signal supply terminal 2
4 to the first output signal supply wiring 14, while the output signal B is supplied from the second output signal supply terminal 26 to the second output signal supply wiring 16.

Here, an input signal that causes the output signal A to be output only to a specific one of the output terminals targeted for the inspection and measurement method according to the present invention and the output signal B to be output to the other output terminals, Input from input terminal 2 and input functional circuit 8
Are operated to control the output selection switch 12 of each output terminal.

At this time, the first output switch 4 connected to the output terminal that outputs the output signal A, the current conducting path that short-circuits the output terminal from outside the IC, and the output terminal B are output. Second output switch 6 connected to the output terminal
The first output signal supply wiring 14 and the second output signal supply wiring 16 are short-circuited via the, and between the first output signal supply wiring 14 and the second output signal supply wiring 16. Short-circuit current flows to.

If the above-mentioned short-circuit current is measured and the measured current value matches the value expected to flow in a normal IC, the IC under test has correctly formed the short-circuit flow path which causes the short-circuit current. The circuit operation of the functional circuit 8 controlled to output the output signal A to only one specific output terminal is normal, and the first output switch 4 of the output selection switches 12 of the output terminal that outputs the output signal A is normal. It is possible to confirm that the “ON” is performed according to the control of the functional circuit with a proper conduction resistance value.

Actually, one output terminal for outputting the output signal A to only the above-mentioned specific one output terminal is sequentially assigned to all of the output terminals to be inspected and measured, one by one, and the same as above. By repeating the measurement of the short-circuit current value and the determination of the measured value, it is possible to determine whether the first output switch 4 of the output selection switches 12 is turned on one output terminal at a time and determines whether the circuit function is “ON”. , The function of the switch element itself to be "on" and the conduction characteristic are inspected.

Further, the relationship between the output signal A and the output signal B in the measurement up to this point is interchanged, and the output signal to be output to only one output terminal is defined as the output signal B, and the output signals are output to the other output terminals. By controlling so as to output A, the same short-circuit current measurement and measurement value determination are sequentially performed. As a result, the second output switch 6 of the output selection switches 12 is turned “on” one output terminal at a time.
Whether or not the circuit function to be controlled is judged to be good, the function of the switch element itself being "on", and the conduction characteristic are inspected.

From all the above inspection and measurement, regarding all output terminals of the circuit operation of the functional circuit 8, whether or not the circuit function of controlling the first output switch 4 and the second output switch 6 to be "on" is good and bad. Of the first output switch 4 and the second output switch 6 themselves, the function of turning on themselves and the continuity characteristics, and the first output signal supply wiring 14 and the second output signal supply It can be confirmed that there is no disconnection defect with the wiring 16.

In addition to the above test, whether or not the operation part for controlling the first output switch 4 and the second output switch 6 of each output selection switch 12 in the circuit operation of the functional circuit 8 is "off" The quality and the function of turning off the first output switch 4 and the second output switch 6 themselves of each output selection switch 12, and the first output signal supply wiring 14
It is necessary to inspect and measure whether there is a short circuit defect between the second output signal supply wiring 16 and the second output signal supply wiring 16.

Therefore, other inspection and measurement conditions are left as they are until the inspection and measurement so far, and the necessary input signals are input to the input terminal 2 so that all the output terminals of the inspection and measurement outputs the output signal A at the same time. The function circuit 8 is operated to control the output selection switch 12.

If the IC to be inspected is normal, the first output switch 4 is "on" and the second output switch 6 is "off" at all output terminals to be inspected and measured in this state. Yes, the first output signal supply wiring 14 and the second
A conduction path through which a current flows is not formed between the output signal supply wiring 16 of FIG.

On the contrary, among the second output switches 6 that should be “off”, even if one of them is “on”, or there is the first output signal supply wiring 14 and the second output signal supply wiring 14. If there is a short circuit between the output signal supply wiring 16 and the output signal supply wiring 16, a current conduction path is provided between the first output signal supply wiring 14 and the second output signal supply wiring 16. Will be formed.

Here, the current flowing between the first output signal supply wiring 14 and the second output signal supply wiring 16 is measured, and this measured current value is taken as the current value expected in a normal IC. Compare.

Next, this time, the necessary input signals are input to the input terminals 2 so that all the output terminals to be inspected and measured output the output signals B at the same time, the functional circuit 8 is operated, and the output selection switch 12 is controlled. Then, similarly to the above, the current value flowing between the first output signal supply wiring 14 and the second output signal supply wiring 16 is measured, and the measured current value is set to a value expected in a normal IC. Compare.

In both of the above-mentioned two inspection measurements, if the measured current value matches the expected value of the normal IC, the first output switch 4 and the first output switch 4 of all the output selection switches in the circuit operation of the functional circuit 8 are selected. The circuit function of controlling the second output switch 6 and the "off" is normal, and the first output switch 4 is
And the function and characteristics of turning off the second output switch 6 itself are normal, and the first output signal supply wiring 14
It is possible to inspect and confirm that there is no short circuit defect between the second output signal supply wiring 16 and the second output signal supply wiring 16.

The output terminal 10 in the semiconductor integrated circuit device 18 is obtained by all of the above inspection and measurement based on the present invention.
And the output selection switch 12 and the first output signal supply wiring 1
4) and the second output signal supply wiring 16 to determine whether the output circuit unit 28 is good or bad, and whether or not all the circuit operations related to the control of the output circuit unit 28 in the circuit operation of the functional circuit 8 are good or bad. You can

In the above, each of the plurality of output terminals is connected to the output selection switch consisting of two output switches, and these output selection switches are connected to the two output signal supply wirings in the same connection manner. An example of inspection and measurement for a semiconductor integrated circuit device having an output circuit section configured as described above has been shown. However, in the inspection measurement method of the present invention, the output selection switches composed of three or more output switches are connected to each of the plurality of output terminals, and these output selection switches are equal to the number of output switches constituting the output selection switch. The semiconductor integrated circuit device having the output circuit section configured by connecting the same number of output signal supply wirings with the same connection method can be inspected and measured by the same method.

The output switch and the control function of the output switch, which are necessary for the inspection and measurement method of the present invention, are usually originally provided in order for a general semiconductor integrated circuit device to fulfill its original function purpose. However, if there is a shortage in adopting the inspection measurement method of the present invention, an output switch is added only for inspection measurement when an IC is manufactured, or an output switch control function is added only for inspection measurement. Then, it is possible to adopt the inspection measurement method of the present invention.

The switches used in this embodiment can be constructed of transistor elements, and thus can be built in the semiconductor integrated circuit device.

[0040]

As is apparent from the above description, when the conventional inspection measurement method in which the probe card is used for all the output terminals of the IC and the direct contact needle is individually inspected and measured, the probe card is manufactured. When the inspection / measuring method according to the present invention is adopted, the restrictions on the shape, size, and arrangement interval of the output terminals, which are restricted due to technical restrictions, are eliminated, so that higher integration of the semiconductor integrated circuit device becomes possible. .

Furthermore, the IC inspection and measurement method according to the present invention does not require a probe card having measuring needles for all output terminals, and does not need to provide measuring circuits for all output terminals on the inspection and measurement device side. In addition, the inspection and measurement are simpler and quicker than the inspection and measurement by the conventional method, and the inspection and measurement device can be simplified, so that the inspection and measurement of the semiconductor integrated circuit device can be performed with high efficiency and at low cost.

[Brief description of drawings]

FIG. 1 is a circuit block diagram showing a method for inspecting and measuring a semiconductor integrated circuit device according to an embodiment of the present invention.

[Explanation of symbols]

 8 Functional Circuit 10 Output Terminal 12 Output Selection Switch 14 First Output Signal Supply Wiring 16 Second Output Signal Supply Wiring 18 Semiconductor Integrated Circuit Device 28 Output Circuit Section

Claims (1)

[Claims] 1. An output selection switch is connected to each of the plurality of output terminals, and the output selection switches connected to each of the plurality of output terminals are connected to a plurality of output signal supply wirings in the same connection manner. In a method for inspecting and measuring a semiconductor integrated circuit device having an output circuit part that constitutes, a total number of output terminals of the output circuit part of the semiconductor integrated circuit device are short-circuited from outside the semiconductor integrated circuit device, and the short-circuited output terminals are individually The output selection switch connected inside the semiconductor integrated circuit device is controlled independently for each output terminal, and the current value flowing between the output signal supply wirings is measured to be expected when the semiconductor integrated circuit device is normal. The output circuit section of the semiconductor integrated circuit device, which is the object to be measured, and the operation of the functional circuit related to the control of the output circuit section are judged by comparing with the current value A method for inspecting and measuring a semiconductor integrated circuit device, comprising: