JPH0612905Y2 - スラッシュ成形用金型の取付構造 - Google Patents
スラッシュ成形用金型の取付構造Info
- Publication number
- JPH0612905Y2 JPH0612905Y2 JP10138589U JP10138589U JPH0612905Y2 JP H0612905 Y2 JPH0612905 Y2 JP H0612905Y2 JP 10138589 U JP10138589 U JP 10138589U JP 10138589 U JP10138589 U JP 10138589U JP H0612905 Y2 JPH0612905 Y2 JP H0612905Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- support frame
- die
- mounting structure
- molding die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000465 moulding Methods 0.000 title claims description 21
- 238000006073 displacement reaction Methods 0.000 claims description 5
- 238000010276 construction Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 238000001816 cooling Methods 0.000 description 8
- 239000002994 raw material Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000005338 heat storage Methods 0.000 description 5
- 239000000498 cooling water Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10138589U JPH0612905Y2 (ja) | 1989-08-30 | 1989-08-30 | スラッシュ成形用金型の取付構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10138589U JPH0612905Y2 (ja) | 1989-08-30 | 1989-08-30 | スラッシュ成形用金型の取付構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0339518U JPH0339518U (OSRAM) | 1991-04-16 |
| JPH0612905Y2 true JPH0612905Y2 (ja) | 1994-04-06 |
Family
ID=31650342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10138589U Expired - Lifetime JPH0612905Y2 (ja) | 1989-08-30 | 1989-08-30 | スラッシュ成形用金型の取付構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0612905Y2 (OSRAM) |
-
1989
- 1989-08-30 JP JP10138589U patent/JPH0612905Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0339518U (OSRAM) | 1991-04-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |