JPH0612740B2 - Electronic component manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention is directed to stacking a plurality of electronic component bodies having electrodes formed on both principal surfaces of an electronic component and bonding them to each other at the electrode surfaces to form an outer electrode. The present invention relates to an improvement in a method of manufacturing an electronic component in which a terminal is connected to a terminal.

[Prior Art] Conventionally, in order to improve the withstand voltage, a plurality of ceramic capacitor bodies are connected to each other via electrode surfaces,
A capacitor having a terminal connected to an outer electrode is known. This capacitor is manufactured through the following method.

That is, as shown in FIG. 2, the electrodes 2 formed so as not to reach the outer peripheral edges on both main surfaces of the plate-shaped ceramic body 1.
A plurality of capacitor bodies 3 having the above are prepared. Next, as shown in FIG. 3, cream solder 4 is applied on the electrode 2 of one capacitor element body 3 and the other capacitor element body 1 is applied.
3 is piled up and heat-treated to obtain a laminate 6 shown in FIG. Further, as shown in FIG. 5, the metal terminals 7 and 8 are joined to the electrodes 12 (the electrodes on the back surface are not shown) on the outer side of the laminated body 6 by soldering. It is performed by immersing the laminated body 6 in a solder bath while holding the laminated body 6 therebetween.

[Problems to be Solved by the Invention] In the above-described manufacturing method, soldering using the cream solder 4 is performed when forming the laminated body 6, and further soldering is performed by immersion solder when connecting the terminals 7 and 8. Therefore, although soldering is performed in the same manner, the soldering process must be performed a plurality of times, which is complicated. Not only this, the capacitor body 3,
13 was heated twice, and there was a problem that the characteristics might deteriorate.

Therefore, the object of the present invention consists of a small number of working steps,
An object of the present invention is to provide a method for manufacturing an electronic component that is less likely to have characteristic deterioration.

[Means for Solving the Problems] In the manufacturing method of the present invention, at least the thickness of the central region is uniform and the thickness of the outer peripheral portion is equal to or thinner than that region, or at least the thickness of the plate-shaped ceramic body is smaller. A plurality of electronic component element bodies in which electrodes are formed on both principal surfaces of a portion having a uniform thickness are used. And it is characterized by comprising the following steps.

That is, a step of stacking the plurality of electronic component bases on top of each other via the electrode surface and stacking them, and a pair of terminals that are biased so that the stacked electronic component bases are close to each other. A step of inserting it between the terminals and holding it between the terminals, a step of applying flux to the outer electrode in contact with the terminals of the laminated electronic component base and the electrode between the electronic component bases, Soldering the applied electronic component element body while holding it between the terminals, thereby connecting between the electronic component element bodies and between the electrodes of the electronic component element body and the terminals by soldering. .

[Operation and Effect of the Invention] In the conventional method described with reference to FIGS. 2 to 5, the connection between the capacitor bodies 3 and 13 and the connection of the terminals 7 and 8 are completed by one-time soldering. It is conceivable to hold the capacitor bodies 3 and 13 in a laminated state between the terminals 7 and 8 and immerse them in solder. However, the electrodes formed on both main surfaces of the capacitor bodies 3 and 13 are formed so as to be drawn toward the center side so as not to reach the outer peripheral edge.
Therefore, as shown in FIG. 6, a gap 9 is formed between the laminated capacitor element bodies 3 and 13. At this time, the distance between both element bodies is determined by the electrode thickness (0.1 to 20 μm). It is a very small gap.
On the other hand, since the surface tension of the molten solder is considerably large and it is difficult for the molten solder to fit in the ceramic body, even if the solder is immersed in the solder, the solder can be absorbed from the electrodes 2 ', 1 due to these factors.
It is difficult to enter the space between 2'by capillarity.

On the other hand, in the present invention, since the electrodes are formed on the entire surface of the region having a uniform thickness, in the state in which a plurality of electronic component bodies are stacked, the solder and the flux are overlapped between the electrodes. Flux easily enters. Therefore, since both electronic component bodies can be connected by solder immersion, both can be soldered by one solder immersion together with the connection of the terminals.

Therefore, not only can the entire process be simplified, the electronic parts as described above can be manufactured at low cost, but the number of times the element body is handled is reduced, so that defective defects such as chips and cracks can be reduced. Will also be possible. Not only that, the number of heat treatments required for soldering is half that of the conventional method, so it is possible to effectively prevent characteristic deterioration due to thermal deterioration of the element body, and reduce the energy required for manufacturing. Will also be possible.

[Explanation of Examples] Examples applied to a method of manufacturing a capacitor will be described.

As shown in FIG. 1, a plurality of capacitor element bodies 24 having electrodes 22 and 23 formed on both main surfaces of a plate-shaped ceramic body 21 having a uniform thickness are prepared.

Next, as shown in FIG. 7, a plurality of capacitor element bodies are laminated. Here, the other capacitor element body is indicated by reference numeral 34 (corresponding reference numerals are also attached to other portions).

Further, the laminated body 40 (unbonded) in FIG. 7 is held between the terminals 41 and 42 as shown in FIG. This terminal 4
1, 42 are composed of both ends of a U-shaped metal terminal material 43 having a spring property shown in FIG. 9 which will be described later, and when the laminated body 40 is sandwiched, both terminals 41, 42 are The stacks 40 are biased so that they are in close proximity to each other.

Next, with the laminate 40 held between the terminals 41 and 42, the flux is attached by a method such as dipping, dropping, coating or foam dipping. At this time, the flux enters between the mutually overlapping electrodes, that is, the electrode 22 of the element body 24 and the electrode 33 of the element body 34 by a capillary phenomenon.

Next, as shown in FIG. 9, with the laminated body 40 subjected to the flux treatment held between the terminals 41 and 42,
It is dipped in the solder bath 45 for soldering. As a result, soldering between the electrode 22 of the element body 24 and the electrode 33 of the element body 34 and between the terminals 41 and 42 and the electrodes 23 and 32 are simultaneously performed. In this case, unlike the conventional method, the electrodes 22 and 33 between the element bodies 24 and 34 are formed so as to extend to the outer peripheral edges of the ceramic bodies 21 and 31, so that the molten solder easily enters due to the capillary phenomenon. Therefore, it is possible to reliably connect the element bodies 24 and 34 by soldering.

In the above-mentioned embodiment, the capacitor body having the uniform thickness of the ceramic body 21 is used. However, as shown in the sectional views of FIGS. 10 to 14, the ceramic body having the uneven thickness is used. It is also possible to manufacture using a capacitor body. That is, in the ceramic capacitor body 54 of FIG. 10, a ceramic body 51 having a relatively thin outer peripheral edge is used, and electrodes 52 and 53 are formed on the entire both main surfaces thereof. In this case, in the laminated state, a gap B is formed at the outer peripheral edge between one of the capacitor element bodies (shown by an imaginary line). The gap B functions as a die for the molten solder to enter between the capacitor element bodies. Further, the electrode 53 is formed so as to reach the outer peripheral edge of the main surface, and the molten solder is easily adapted to the electrode 53, and therefore easily penetrates between the electrodes between the superposed capacitor bodies due to a capillary phenomenon to ensure the reliability. Can be soldered to.

In the example of FIG. 11, a ceramic body 61 having the same shape as the ceramic body 51 of FIG.
2, 63 are formed so as not to reach the outer peripheral edge. That is, the electrodes 62, 63 are formed only in the central portion having a uniform thickness.
Are formed. When the capacitor element bodies 64 of FIG. 11 are laminated, a gap is formed between both capacitor element bodies 64 as in the case of the example of FIG. This gap also functions as a guide for molten solder penetration. Therefore, the molten solder easily penetrates into the gap portion and easily penetrates between the electrodes of both capacitor bodies which are superposed by a capillary phenomenon.

In the example of FIG. 12, the outer peripheral edge of the ceramic body 71 is rounded so that the outer peripheral end face is relatively thin. Further, the electrodes 72, 73 are formed on the entire surfaces of both main surfaces so as to reach the outer peripheral edge. Therefore, as in the case of the example of FIG. 10, when a plurality of capacitor element bodies 74 are laminated, a gap is formed between the capacitor element bodies, the molten solder can be guided by the gap, and they are superposed. Molten solder easily enters between the electrodes.

In the example of FIG. 13, a step 8 is formed on the outer peripheral portion of the ceramic body 81.
1a is formed, the central portion of the step 81a has a uniform thickness, and the outer peripheral portion of the step 81a is relatively thin. In addition, the electrodes 82,
83 is formed on the entire surfaces of both main surfaces. Therefore, when a plurality of capacitor element bodies 84 are laminated, a gap is formed in the outer peripheral portion in the same manner as in the example of FIG. 10, and the gap causes molten solder to reach a position where portions of uniform thickness overlap. It easily penetrates, and further, it penetrates between the electrodes on the portion having a uniform thickness due to the capillary phenomenon.

Similarly, as shown in FIG. 14, in the ceramic body 81 of FIG. 13, a capacitor element body 94 in which electrodes 92 and 93 are formed up to the end portion 81a, that is, only in a portion having a uniform thickness can be used. .

Further, as shown in FIG. 15, electrodes 102 and 103 were formed over the entire main surfaces of a ceramic body 101 having a uniform thickness, and the electrodes 102 and 103 were formed so as to extend to the side surfaces of the outer peripheral portion. The capacitor body 104 may be used. Also in this case, when a plurality of capacitor element bodies 104 are overlapped, like the capacitor element body 24 of FIG. 1, molten solder can easily enter between the overlapping electrodes due to a capillary phenomenon.

The present invention can be applied not only to an electronic component formed by stacking a plurality of capacitor bodies, but also to a general manufacturing method of electronic components in which electronic body bodies having electrodes on both main surfaces are stacked.

[Brief description of drawings]

FIG. 1 is a perspective view showing a capacitor body as an electronic component body used for carrying out one embodiment of the present invention. 2 to 5 are perspective views for explaining the conventional method. FIG. 2 shows a capacitor element body, FIG. 3 shows a process of laminating the capacitor element body, and FIG. 5 shows the capacitor element body, and FIG. 5 shows the state in which the terminals are connected.
FIG. 6 is a partial side view of the laminated state of FIG. 7th
FIG. 8 is a perspective view showing a state where the capacitor bodies of FIG. 1 are superposed, FIG. 8 is a perspective view showing a state where the laminated body of FIG. 7 is held between terminals, and FIG. 9 is a solder dipping process. It is a sectional view for explaining. 10 to 15 are cross-sectional views each showing a capacitor element body that can be used in the present invention. In the figure, 21 is a ceramic body, 22 and 23 are electrodes,
24 is a capacitor body as an electronic component body, 31 is a ceramic body, 32 and 33 are electrodes, 34 is a capacitor body, 41 and 42 are terminals, and 43 is a metal terminal material.

Claims (6)

[Claims] 1. A main portion having a uniform thickness in at least a central region and a thickness of an outer peripheral portion equal to that of the region, or at least a portion of a thinner plate-shaped ceramic body having a uniform thickness. A step of preparing a plurality of electronic component bodies having electrodes formed on the surfaces thereof, a step of stacking the plurality of electronic component bodies on top of each other via electrode surfaces, and stacking the stacked electronic parts A step of inserting the element body between a pair of terminals that are biased so as to be close to each other and holding the element body between the terminals; and an outer electrode with which the terminals of the laminated electronic component elements are in contact. And a step of adhering a flux to the electrodes between the electronic component bases, and immersing the flux-treated electronic component bases in a state that the electronic component bases are held between the terminals. Electrodes and terminals of component body And a step of connecting the two by soldering. 2. As the pair of terminals, both ends of a metal terminal material having a spring property which is entirely bent in a U shape are used.
The stacked electronic component bodies are held between the both ends to carry out a flux adhering and solder dipping process, and then a connecting portion which is a top portion of the metal terminal material is cut to form a pair of terminals. Forming claim 1
A method of manufacturing an electronic component according to the item. 3. The electronic component element body according to claim 1, wherein a plate-shaped ceramic body having a uniform thickness and having electrodes formed even on the outer peripheral edges of both main surfaces is used. A method for manufacturing the described electronic component. 4. The electronic component element body according to claim 1, wherein an electrode is formed on both main surfaces of a ceramic body whose outer peripheral portion is relatively thinner than a central region. Item 2. A method of manufacturing an electronic component according to Item 2. 5. The method of manufacturing an electronic component according to claim 4, wherein the electrodes are formed on both main surfaces of the ceramic body so as to reach the outer peripheral edge of the ceramic body. 6. The electrode according to claim 4, wherein the electrode is formed so as to reach an outer edge portion of a relatively thick central portion.
A method of manufacturing an electronic component according to the item.