JPH0722282A - Chip solid electrolytic capacitor - Google Patents

Abstract

PURPOSE:To protect an anode terminal against conduction or bridging by bending the forward end of a cathode terminal on the capacitor element side toward the capacitor element by an amount corresponding to the thickness of a cathode terminal plate. CONSTITUTION:A capacitor element 1 provided with an anode lead wire 2a is produced by forming an electrolyte layer on an electrode body of sintered porous tantalum and then laminating a carbon layer and a cathode layer sequentially thereon. The capacitor element 1 is provided with a cathode terminal plate 6b having forward end being bent 3 by an amount corresponding to the thickness of an anode terminal plate 7b and provided with a cut being bent 4b similarly by an amount corresponding to the thickness of the cathode terminal plate 6b, and the general anode plate 7b. The anode terminal plate 7b is welded to the anode lead wire 2b of the capacitor element whereas the capacitor cathode part 8 is welded to the lead wire 2b, by applying solder or conductive adhesive 5 to the bent joint of the terminal plate 6b, simultaneously with bonding to the terminal plate 6b and the capacitor element 1. Finally, it is resin molded and bent into a predetermined shape.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type solid electrolytic capacitor used in consumer and industrial electronic equipment.

[0002]

2. Description of the Related Art A conventional chip type solid electrolytic capacitor is
As shown in FIG. 3, the connection portion of the cathode terminal plate 6 to the cathode portion 8 of the capacitor element is made flat, or as shown in FIG.
No. 50814), a part of the connection portion of the cathode terminal to the capacitor element cathode portion 8 is formed into a frame-shaped terminal 9. Further, the anode terminal and the cathode terminal are pulled out in opposite directions, the capacitor element is molded and coated with an insulating resin, and the pulled out anode terminal and cathode terminal are bent downward along the end face and the bottom face of the capacitor body. To form a chip-type solid electrolytic capacitor.

[0003]

However, in either case, solder or a conductive adhesive is used to connect between the capacitor element and the cathode portion adhesive surface. Has a drawback in that the spread of the conductive adhesive easily causes conduction to the opposite electrode, that is, the anode terminal, a bridge, and the like, and the insulating property and withstand voltage of the capacitor are significantly deteriorated.

[0004]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a component which eliminates these conventional drawbacks.

According to the present invention, the cathode terminal is connected to the cathode portion of the capacitor element, the anode terminal and the cathode terminal are drawn out in opposite directions, the capacitor element is molded with the insulating resin, and the anode terminal is drawn out. And a chip type solid electrolytic capacitor in which the cathode terminal is bent downward along the end face and the bottom surface of the capacitor body, and the tip of the capacitor element of the cathode terminal is subjected to burring corresponding to the thickness of the cathode terminal, and A chip-type solid electrolytic capacitor is obtained, in which a notch is formed in the terminal surface, and a burring process corresponding to the thickness of the cathode terminal is formed in the same manner as the tip burring process.

[0006]

Embodiments of the present invention will be described below with reference to FIGS.

In FIG. 1A, a capacitor element 1
Then, an electrolyte layer of manganese dioxide or the like is formed on an electrode body which is provided with an anode lead wire 2 made of tantalum metal and which is made of a tantalum porous sintered body having a dielectric oxide film formed on the surface thereof, and carbon is formed thereon. Layers, cathode layers, etc. are sequentially laminated.

On the other hand, as shown in FIG. 1 (b), the tip is subjected to a burring process 3a corresponding to the thickness of the anode terminal plate, and a notch is formed in the terminal surface to form a cathode terminal in the same manner as the tip burring process 3a. A cathode terminal plate formed by forming a burring process 4b corresponding to the thickness of the plate 6b and a general anode terminal plate 7b are prepared. This may be performed by punching a metal plate to form an integral metal terminal. The anode lead-out wire 2b of the capacitor element is applied to the anode terminal plate 7b, and the cathode lead-out portion 8 of the capacitor element is applied with solder or a conductive adhesive 5 to the burred connection portion of the cathode terminal plate 6b to lead out the anode. Simultaneously with welding to the wire 2b, the cathode terminal end 6b and the capacitor element 1 are bonded.

Further, this is covered with resin by transfer molding or the like, and bent into a predetermined shape, as shown in FIG.
The chip type solid electrolytic capacitor as shown in FIG.

FIG. 2 shows another embodiment. Similar to the embodiment of FIG. 1, the tip is burred 3c corresponding to the thickness of the cathode terminal,
In addition, a plurality of notches are formed on the terminal surface, and a burring process 4c corresponding to the thickness of the cathode terminal is formed in the same manner as the tip burring process 3c.
Cathode terminal plate 6c and general anode terminal plate 7
Prepare c. Hereinafter, the chip-type solid electrolytic capacitor is formed by the processing method shown in FIG.

[0011]

According to the present invention described above, the following effects can be obtained. 1) Since the cathode terminal plate is burred, the soldering method of the capacitor element and the cathode terminal plate is a counter electrode, that is, an anode due to the spread of the solder or the conductive adhesive when the conductive adhesive is bonded. The occurrence of conduction / bridge to the terminal is extremely small.

Moreover, since the burring process is the thickness partner of the cathode terminal plate, the chip type solid electrolytic capacitor can be formed without impairing the volumetric efficiency. 2) Since the notch processing is done on the cathode terminal plate, it is possible to partly wrap solder or conductive adhesive in the opposite direction of the cathode terminal plate and the capacitor element bonding surface, and further stabilize the connection. be able to.

[Brief description of drawings]

1A and 1B are a cross-sectional view and a perspective view of the present invention.

FIG. 2 is a perspective view of another embodiment of the present invention.

FIG. 3 is a perspective view showing a conventional example.

FIG. 4 is a perspective view showing a conventional example.

[Explanation of symbols]

 1 capacitor element 2a, 2b anode lead wire 3a, 3b, 3c burring 4a. 4b, 4c Burring 5 Solder or conductive adhesive 6,6a, 6b, 6c Cathode terminal end 7a, 7b, 7c Anode terminal plate 8 Capacitor element cathode part 9 Frame-shaped terminal

Claims (2)

[Claims] 1. A cathode terminal is connected to a cathode portion of a capacitor element, the anode terminal and the cathode terminal are pulled out in opposite directions, and the capacitor element is molded and coated with an insulating resin. In a chip-type solid electrolytic capacitor bent along the end face and the bottom face toward the bottom of the capacitor main body, the cathode terminal plate end of the capacitor element side is directed to the capacitor element side, and burring corresponding to the thickness of the cathode terminal plate is performed. Is a chip-type solid electrolytic capacitor. 2. The chip type solid electrolytic capacitor according to claim 1, wherein a notch is formed in the terminal surface and a burring process corresponding to the thickness of the cathode terminal is formed in the same manner as the tip burring process.