JPH0610718Y2 - 集積回路素子の保持構造 - Google Patents

集積回路素子の保持構造

Info

Publication number
JPH0610718Y2
JPH0610718Y2 JP10542987U JP10542987U JPH0610718Y2 JP H0610718 Y2 JPH0610718 Y2 JP H0610718Y2 JP 10542987 U JP10542987 U JP 10542987U JP 10542987 U JP10542987 U JP 10542987U JP H0610718 Y2 JPH0610718 Y2 JP H0610718Y2
Authority
JP
Japan
Prior art keywords
integrated circuit
chip
substrate
circuit element
holding structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP10542987U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6413144U (enExample
Inventor
博 吉野
Original Assignee
日鉄セミコンダクター株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日鉄セミコンダクター株式会社 filed Critical 日鉄セミコンダクター株式会社
Priority to JP10542987U priority Critical patent/JPH0610718Y2/ja
Publication of JPS6413144U publication Critical patent/JPS6413144U/ja
Application granted granted Critical
Publication of JPH0610718Y2 publication Critical patent/JPH0610718Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
JP10542987U 1987-07-09 1987-07-09 集積回路素子の保持構造 Expired - Lifetime JPH0610718Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10542987U JPH0610718Y2 (ja) 1987-07-09 1987-07-09 集積回路素子の保持構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10542987U JPH0610718Y2 (ja) 1987-07-09 1987-07-09 集積回路素子の保持構造

Publications (2)

Publication Number Publication Date
JPS6413144U JPS6413144U (enExample) 1989-01-24
JPH0610718Y2 true JPH0610718Y2 (ja) 1994-03-16

Family

ID=31338034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10542987U Expired - Lifetime JPH0610718Y2 (ja) 1987-07-09 1987-07-09 集積回路素子の保持構造

Country Status (1)

Country Link
JP (1) JPH0610718Y2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107004647B (zh) * 2014-11-20 2019-05-03 日本精工株式会社 电子部件搭载用散热基板
US12417966B2 (en) 2021-12-17 2025-09-16 Macom Technology Solutions Holdings, Inc. IPD components having SiC substrates and devices and processes implementing the same
US12230614B2 (en) * 2021-12-17 2025-02-18 Macom Technology Solutions Holdings, Inc. Multi-typed integrated passive device (IPD) components and devices and processes implementing the same

Also Published As

Publication number Publication date
JPS6413144U (enExample) 1989-01-24

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JPH0610718Y2 (ja) 集積回路素子の保持構造