JPH0610684Y2 - ボンディング装置 - Google Patents

ボンディング装置

Info

Publication number
JPH0610684Y2
JPH0610684Y2 JP1989108668U JP10866889U JPH0610684Y2 JP H0610684 Y2 JPH0610684 Y2 JP H0610684Y2 JP 1989108668 U JP1989108668 U JP 1989108668U JP 10866889 U JP10866889 U JP 10866889U JP H0610684 Y2 JPH0610684 Y2 JP H0610684Y2
Authority
JP
Japan
Prior art keywords
black
bonding
bonded
component
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989108668U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0348231U (cs
Inventor
秀明 三好
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP1989108668U priority Critical patent/JPH0610684Y2/ja
Publication of JPH0348231U publication Critical patent/JPH0348231U/ja
Application granted granted Critical
Publication of JPH0610684Y2 publication Critical patent/JPH0610684Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Landscapes

  • Wire Bonding (AREA)
JP1989108668U 1989-09-19 1989-09-19 ボンディング装置 Expired - Lifetime JPH0610684Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989108668U JPH0610684Y2 (ja) 1989-09-19 1989-09-19 ボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989108668U JPH0610684Y2 (ja) 1989-09-19 1989-09-19 ボンディング装置

Publications (2)

Publication Number Publication Date
JPH0348231U JPH0348231U (cs) 1991-05-08
JPH0610684Y2 true JPH0610684Y2 (ja) 1994-03-16

Family

ID=31657293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989108668U Expired - Lifetime JPH0610684Y2 (ja) 1989-09-19 1989-09-19 ボンディング装置

Country Status (1)

Country Link
JP (1) JPH0610684Y2 (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100324857B1 (ko) * 1996-07-08 2002-07-06 니시무로 타이죠 반도체부품고정지그와반도체부품탑재용받침대및본딩장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754278U (cs) * 1980-09-18 1982-03-30
JPS5790943A (en) * 1980-11-26 1982-06-05 Mitsubishi Electric Corp Heating base for bonding of semiconductor element
JPS59174576A (ja) * 1983-03-18 1984-10-03 日立化成工業株式会社 ＳｉＣ治具
JPS61143686A (ja) * 1984-12-18 1986-07-01 イビデン株式会社 寸法精度の優れた耐熱性治具用炭化珪素質焼結体
JP2664951B2 (ja) * 1988-08-31 1997-10-22 山形日本電気株式会社 半導体製造装置

Also Published As

Publication number Publication date
JPH0348231U (cs) 1991-05-08

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term