JPH059467B2 - - Google Patents
Info
- Publication number
- JPH059467B2 JPH059467B2 JP16053280A JP16053280A JPH059467B2 JP H059467 B2 JPH059467 B2 JP H059467B2 JP 16053280 A JP16053280 A JP 16053280A JP 16053280 A JP16053280 A JP 16053280A JP H059467 B2 JPH059467 B2 JP H059467B2
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- expansion
- organic polymer
- inorganic
- synthetic organic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000126 substance Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 9
- 229920005613 synthetic organic polymer Polymers 0.000 claims description 8
- 239000002861 polymer material Substances 0.000 claims description 7
- 239000005373 porous glass Substances 0.000 claims description 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910000174 eucryptite Inorganic materials 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
- OJLGWNFZMTVNCX-UHFFFAOYSA-N dioxido(dioxo)tungsten;zirconium(4+) Chemical compound [Zr+4].[O-][W]([O-])(=O)=O.[O-][W]([O-])(=O)=O OJLGWNFZMTVNCX-UHFFFAOYSA-N 0.000 claims description 2
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- PBYZMCDFOULPGH-UHFFFAOYSA-N tungstate Chemical compound [O-][W]([O-])(=O)=O PBYZMCDFOULPGH-UHFFFAOYSA-N 0.000 claims description 2
- 238000007789 sealing Methods 0.000 description 15
- 239000000203 mixture Substances 0.000 description 10
- 229920006351 engineering plastic Polymers 0.000 description 5
- -1 CaF 2 ) Chemical class 0.000 description 4
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 229910008556 Li2O—Al2O3—SiO2 Inorganic materials 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229910018626 Al(OH) Inorganic materials 0.000 description 1
- 229910004261 CaF 2 Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910018068 Li 2 O Inorganic materials 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 239000007849 furan resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Landscapes
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16053280A JPS5783553A (en) | 1980-11-13 | 1980-11-13 | Reducing method of thermal expansibility of organic material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16053280A JPS5783553A (en) | 1980-11-13 | 1980-11-13 | Reducing method of thermal expansibility of organic material |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1038935A Division JPH0277441A (ja) | 1989-02-17 | 1989-02-17 | 熱膨張性低下組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5783553A JPS5783553A (en) | 1982-05-25 |
| JPH059467B2 true JPH059467B2 (enrdf_load_stackoverflow) | 1993-02-05 |
Family
ID=15716998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16053280A Granted JPS5783553A (en) | 1980-11-13 | 1980-11-13 | Reducing method of thermal expansibility of organic material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5783553A (enrdf_load_stackoverflow) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0277441A (ja) * | 1989-02-17 | 1990-03-16 | Toyobo Co Ltd | 熱膨張性低下組成物 |
| CA2083983A1 (en) * | 1992-01-27 | 1993-07-28 | Kishor P. Gadkaree | Low expansion composition for packaging optical waveguide couplers |
| JPH0831698B2 (ja) * | 1994-06-28 | 1996-03-27 | 株式会社日立製作所 | ボトムカバーの取付け構造 |
| DE19800460A1 (de) * | 1998-01-08 | 1999-04-29 | Siemens Ag | Befestigung eines Halbleiterkörpers auf einer Leiterplatte |
| WO2003070817A1 (en) * | 2002-02-19 | 2003-08-28 | Photon-X, Inc. | Athermal polymer nanocomposites |
| US7347242B2 (en) * | 2005-10-05 | 2008-03-25 | The Goodyear Tire & Rubber Company | Tire with low thermal expansion component |
| CA2910589C (en) * | 2013-05-03 | 2020-11-10 | Fmc Kongsberg Subsea As | Elastomeric seal |
-
1980
- 1980-11-13 JP JP16053280A patent/JPS5783553A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5783553A (en) | 1982-05-25 |
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