JPS5783553A - Reducing method of thermal expansibility of organic material - Google Patents

Reducing method of thermal expansibility of organic material

Info

Publication number
JPS5783553A
JPS5783553A JP16053280A JP16053280A JPS5783553A JP S5783553 A JPS5783553 A JP S5783553A JP 16053280 A JP16053280 A JP 16053280A JP 16053280 A JP16053280 A JP 16053280A JP S5783553 A JPS5783553 A JP S5783553A
Authority
JP
Japan
Prior art keywords
organic material
reducing method
thermal expansibility
linear thermal
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16053280A
Other languages
English (en)
Japanese (ja)
Other versions
JPH059467B2 (enrdf_load_stackoverflow
Inventor
Toshiro Yamada
Niro Nagatomo
Tsukasa Taniyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Co Ltd
Original Assignee
Toyobo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyobo Co Ltd filed Critical Toyobo Co Ltd
Priority to JP16053280A priority Critical patent/JPS5783553A/ja
Publication of JPS5783553A publication Critical patent/JPS5783553A/ja
Publication of JPH059467B2 publication Critical patent/JPH059467B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP16053280A 1980-11-13 1980-11-13 Reducing method of thermal expansibility of organic material Granted JPS5783553A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16053280A JPS5783553A (en) 1980-11-13 1980-11-13 Reducing method of thermal expansibility of organic material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16053280A JPS5783553A (en) 1980-11-13 1980-11-13 Reducing method of thermal expansibility of organic material

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP1038935A Division JPH0277441A (ja) 1989-02-17 1989-02-17 熱膨張性低下組成物

Publications (2)

Publication Number Publication Date
JPS5783553A true JPS5783553A (en) 1982-05-25
JPH059467B2 JPH059467B2 (enrdf_load_stackoverflow) 1993-02-05

Family

ID=15716998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16053280A Granted JPS5783553A (en) 1980-11-13 1980-11-13 Reducing method of thermal expansibility of organic material

Country Status (1)

Country Link
JP (1) JPS5783553A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0277441A (ja) * 1989-02-17 1990-03-16 Toyobo Co Ltd 熱膨張性低下組成物
EP0553492A3 (enrdf_load_stackoverflow) * 1992-01-27 1994-02-02 Corning Inc
JPH0715150A (ja) * 1994-06-28 1995-01-17 Hitachi Ltd ボトムカバーの取付け構造
DE19800460A1 (de) * 1998-01-08 1999-04-29 Siemens Ag Befestigung eines Halbleiterkörpers auf einer Leiterplatte
WO2003070817A1 (en) * 2002-02-19 2003-08-28 Photon-X, Inc. Athermal polymer nanocomposites
EP1772481A1 (en) * 2005-10-05 2007-04-11 The Goodyear Tire & Rubber Company Tire with low thermal expansion component
US20160068728A1 (en) * 2013-05-03 2016-03-10 Fmc Kongsberg Subsea As Elastomeric seal

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0277441A (ja) * 1989-02-17 1990-03-16 Toyobo Co Ltd 熱膨張性低下組成物
EP0553492A3 (enrdf_load_stackoverflow) * 1992-01-27 1994-02-02 Corning Inc
JPH0715150A (ja) * 1994-06-28 1995-01-17 Hitachi Ltd ボトムカバーの取付け構造
DE19800460A1 (de) * 1998-01-08 1999-04-29 Siemens Ag Befestigung eines Halbleiterkörpers auf einer Leiterplatte
WO2003070817A1 (en) * 2002-02-19 2003-08-28 Photon-X, Inc. Athermal polymer nanocomposites
EP1772481A1 (en) * 2005-10-05 2007-04-11 The Goodyear Tire & Rubber Company Tire with low thermal expansion component
US7347242B2 (en) 2005-10-05 2008-03-25 The Goodyear Tire & Rubber Company Tire with low thermal expansion component
US20160068728A1 (en) * 2013-05-03 2016-03-10 Fmc Kongsberg Subsea As Elastomeric seal
US10047261B2 (en) * 2013-05-03 2018-08-14 Fmc Kongsberg Subsea As Elastomeric seal

Also Published As

Publication number Publication date
JPH059467B2 (enrdf_load_stackoverflow) 1993-02-05

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