JPS5565218A - Epoxy resin adhesive or filler - Google Patents

Epoxy resin adhesive or filler

Info

Publication number
JPS5565218A
JPS5565218A JP13851878A JP13851878A JPS5565218A JP S5565218 A JPS5565218 A JP S5565218A JP 13851878 A JP13851878 A JP 13851878A JP 13851878 A JP13851878 A JP 13851878A JP S5565218 A JPS5565218 A JP S5565218A
Authority
JP
Japan
Prior art keywords
filler
epoxy resin
putty
amine
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13851878A
Other languages
Japanese (ja)
Other versions
JPS5910689B2 (en
Inventor
Akira Yoshida
Noboru Ito
Takamasa Nishimura
Masahiro Minato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP13851878A priority Critical patent/JPS5910689B2/en
Publication of JPS5565218A publication Critical patent/JPS5565218A/en
Publication of JPS5910689B2 publication Critical patent/JPS5910689B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: A cold self-curable title material that is specifically composed of an uncured epoxy resin putty and an amine-curing putty, thus being readily molded and blended and suitaly used as an adhesive for concrete and filler for tile joints.
CONSTITUTION: Said adhesive or filler is composed of (A) an uncured epoxy resin putty containing, as the essential ingredients, (a) an epoxy resin of 90W950 epoxy equivalent, (b) a thermoplastic resin compatible with component (a), preferably a phenoxy resin, (c) a bulking filler, and (d) a tack-reducing substance as paraffin and/or surface-active agnet and (B) a curing agent putty containing (e) cold-curable amine agent of 80W850 amine equivalent, when necessary, containing together components (b)W(d). The proportion of components (a)W(d) is 1:0.05W5:0.3W5: 0.03W1 and the ratio of (a) to (e) is 1:0.3W1.5.
EFFECT: The composition is tack-free even when it is mixed with hands.
COPYRIGHT: (C)1980,JPO&Japio
JP13851878A 1978-11-09 1978-11-09 Epoxy resin putty Expired JPS5910689B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13851878A JPS5910689B2 (en) 1978-11-09 1978-11-09 Epoxy resin putty

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13851878A JPS5910689B2 (en) 1978-11-09 1978-11-09 Epoxy resin putty

Publications (2)

Publication Number Publication Date
JPS5565218A true JPS5565218A (en) 1980-05-16
JPS5910689B2 JPS5910689B2 (en) 1984-03-10

Family

ID=15224010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13851878A Expired JPS5910689B2 (en) 1978-11-09 1978-11-09 Epoxy resin putty

Country Status (1)

Country Link
JP (1) JPS5910689B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57202367A (en) * 1981-03-24 1982-12-11 Raurii Furinto Teodooru Rapid hardening epoxy adhesive seal
JPH02501658A (en) * 1984-10-01 1990-06-07 ザ　ダウ　ケミカル　カンパニー Polyurethane type adhesives containing non-aqueous solutions of acrylate polymers

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57202367A (en) * 1981-03-24 1982-12-11 Raurii Furinto Teodooru Rapid hardening epoxy adhesive seal
JPH0257592B2 (en) * 1981-03-24 1990-12-05 Raurii Furinto Teodooru
JPH02501658A (en) * 1984-10-01 1990-06-07 ザ　ダウ　ケミカル　カンパニー Polyurethane type adhesives containing non-aqueous solutions of acrylate polymers

Also Published As

Publication number Publication date
JPS5910689B2 (en) 1984-03-10

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