JPS5565218A - Epoxy resin adhesive or filler - Google Patents
Epoxy resin adhesive or fillerInfo
- Publication number
- JPS5565218A JPS5565218A JP13851878A JP13851878A JPS5565218A JP S5565218 A JPS5565218 A JP S5565218A JP 13851878 A JP13851878 A JP 13851878A JP 13851878 A JP13851878 A JP 13851878A JP S5565218 A JPS5565218 A JP S5565218A
- Authority
- JP
- Japan
- Prior art keywords
- filler
- epoxy resin
- putty
- amine
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
PURPOSE: A cold self-curable title material that is specifically composed of an uncured epoxy resin putty and an amine-curing putty, thus being readily molded and blended and suitaly used as an adhesive for concrete and filler for tile joints.
CONSTITUTION: Said adhesive or filler is composed of (A) an uncured epoxy resin putty containing, as the essential ingredients, (a) an epoxy resin of 90W950 epoxy equivalent, (b) a thermoplastic resin compatible with component (a), preferably a phenoxy resin, (c) a bulking filler, and (d) a tack-reducing substance as paraffin and/or surface-active agnet and (B) a curing agent putty containing (e) cold-curable amine agent of 80W850 amine equivalent, when necessary, containing together components (b)W(d). The proportion of components (a)W(d) is 1:0.05W5:0.3W5: 0.03W1 and the ratio of (a) to (e) is 1:0.3W1.5.
EFFECT: The composition is tack-free even when it is mixed with hands.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13851878A JPS5910689B2 (en) | 1978-11-09 | 1978-11-09 | Epoxy resin putty |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13851878A JPS5910689B2 (en) | 1978-11-09 | 1978-11-09 | Epoxy resin putty |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5565218A true JPS5565218A (en) | 1980-05-16 |
JPS5910689B2 JPS5910689B2 (en) | 1984-03-10 |
Family
ID=15224010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13851878A Expired JPS5910689B2 (en) | 1978-11-09 | 1978-11-09 | Epoxy resin putty |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5910689B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57202367A (en) * | 1981-03-24 | 1982-12-11 | Raurii Furinto Teodooru | Rapid hardening epoxy adhesive seal |
JPH02501658A (en) * | 1984-10-01 | 1990-06-07 | ザ ダウ ケミカル カンパニー | Polyurethane type adhesives containing non-aqueous solutions of acrylate polymers |
-
1978
- 1978-11-09 JP JP13851878A patent/JPS5910689B2/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57202367A (en) * | 1981-03-24 | 1982-12-11 | Raurii Furinto Teodooru | Rapid hardening epoxy adhesive seal |
JPH0257592B2 (en) * | 1981-03-24 | 1990-12-05 | Raurii Furinto Teodooru | |
JPH02501658A (en) * | 1984-10-01 | 1990-06-07 | ザ ダウ ケミカル カンパニー | Polyurethane type adhesives containing non-aqueous solutions of acrylate polymers |
Also Published As
Publication number | Publication date |
---|---|
JPS5910689B2 (en) | 1984-03-10 |
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