JPH0592369A - Composite abrasive board and manufacture thereof - Google Patents

Abstract

PURPOSE:To provide a compound abrasive board adapted to be used for polishing quartz, zirconia ceramic or the like with a high degree of polishing efficiency, and to provide a method of manufacture thereof. CONSTITUTION:A compound abrasive material contains therein 60 to 98wt.% of particles made of at least one kind selected from a group consisting of WC, Mo2C, W and Mo, and 2 to 40wt.% of low melting point metal of at least one kind selected from a group consisting of Cu, Ni, Co and Fe, which serves as a binder for hard fine particles. Further, the compound abrasive material is press-molded and then sintered at a temperature of 700 to 1,600 deg.C in a reductive atmosphere or an inert atmosphere. Thus obtained sintered material contains a 60 to 98wt.% of the hard fine particles made of at least one kind selected from a group consisting of WC, Mo2C, W and Mo, and the low melting point metal as a binder of at least one kind selected from a group consisting of Cu, Ni, Co, Fe and the like. Further, this sintered material has the relative density of 40 to 90%.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an abrasive used for polishing quartz, zirconia ceramics and the like, and more particularly to a composite polishing machine using this abrasive and a method for producing the composite polishing machine.

[0002]

2. Description of the Related Art Conventionally, for polishing quartz or zirconia ceramics, a highly accurate polishing surface has been required, and diamond abrasive grains have been used. During polishing, the material to be polished was pressed and polished while supplying a working liquid containing diamond abrasive grains onto a rotating polishing plate.

[0003]

However, in the conventional polishing of quartz, zirconia ceramics, etc., the diamond abrasive grains are blown off by centrifugal force in order to supply the working fluid containing the diamond abrasive grains onto the rotating polishing plate. Easy,
Many diamond grains are wasted. In addition, if it is attempted to increase the polishing speed of the object to be polished, the rotation speed of the polishing disk must be increased and the diamond abrasive grain supply amount must be increased, which further reduces the diamond abrasive grain polishing efficiency. Furthermore, in order to improve the surface accuracy of the object to be polished, the supply amount of the working liquid must be increased, which facilitates the flow of diamond abrasive grains and significantly reduces the polishing efficiency of the diamond abrasive grains. Although ultrafine particles are used for the diamond abrasive grains, diamond is very expensive and has a drawback that the polishing cost is also high. Therefore, a technical problem of the present invention is to provide a composite polishing machine used for polishing quartz, zirconia ceramics, or the like, which has a low manufacturing cost and a high polishing efficiency, and a method of manufacturing the polishing machine.

[0004]

[Means for Solving the Problems] Generally, WC, Mo ₂ C
The carbides such as are hardest next to diamond in terms of Mohs' hardness, and W and Mo are also harder to a degree corresponding thereto. Therefore, it was thought that it could be changed to diamond abrasive grains. Therefore, in the present invention, it is expected that the polishing efficiency will be better when these materials are used as the polishing plate than when they are used as the abrasive grains, and hard particles such as WC, Mo ₂ C, W, and Mo are used for Cu, Ni, Co, The present invention has been accomplished as a polishing plate that is bonded with a low melting point metal such as Fe.
However, when making these polishing discs, if the relative density is increased, the hard fine particles are less likely to come off, and the polishing disc is clogged by the object to be polished, making polishing difficult. Therefore, in the present invention, the type of hard fine particles of the polishing plate for the object to be polished is at least one selected from WC, Mo ₂ C, W, Mo, etc., and Cu that binds these hard fine particles is used.
By adjusting the amount of low melting point metal such as Ni, Co and Fe to 2 to 40% by weight and the sintering temperature to 700 to 1600 ° C., the relative density of the sintered body is set to 40 to 90%, and By suppressing the particle growth of fine particles as much as possible, and by making the average particle size of the sintered body 1 μm or less, the hard fine particles are appropriately separated during polishing by the polishing plate, and always fresh hard fine particles are formed on the surface of the polishing plate. As a result, polishing can be performed extremely effectively, and the surface accuracy of the work piece is improved. This substantially reduces the polishing cost. That is, according to the present invention, WC, Mo ₂ C, W, Mo
60 to 98% by weight of hard fine particles of at least one selected from among the above, and 2 to 40% by weight of at least one of low-melting point metals of Cu, Ni, Co and Fe which serve as a binder for the hard fine particles. A composite abrasive is obtained which is characterized in that it contains. According to the present invention, the composite abrasive material is press-molded, and the composite abrasive material is pressed in a reducing or inert atmosphere.
A method for manufacturing a composite polishing plate is obtained, which is characterized by sintering at 0 to 1600 ° C. According to the invention, WC, Mo ₂
60 to 98% by weight of hard fine particles composed of at least one of C, W and Mo, and Cu, Ni, Co as a binder,
A composite polishing plate is obtained, which is a sintered body containing at least one low melting point metal of Fe in an amount of 2 to 40% by weight, and the sintered body has a relative density of 40 to 90%. According to the present invention, in the composite polishing plate, the composite polishing plate is a porous sintered body. According to the present invention, there is obtained a composite polishing plate which is used for polishing quartz or zirconia ceramics in the composite polishing plate. According to the present invention, in the composite polishing machine, an average particle diameter of the hard fine particles is 1 μm or less, and a composite polishing machine is obtained.

[0005]

EXAMPLES Examples of the present invention will be described below.

(Example 1) 475 g of 0.5 μm WC,
Mix 25g of minus 44μm copper with an attritor, and
C-Cu composite powder was prepared, and this powder was pressed at 294 MPa and sintered in a hydrogen stream at 700 to 1600 ° C for 2 hours. FIG. 1 shows the relationship between the change in relative density of the obtained sintered body with respect to the sintering temperature and the bending strength of the sintered body with respect to the sintering temperature.
And shown in FIG. The relative density is a theoretical density obtained by converting the volume occupied by each component from the weight ratio of each component and the theoretical value d of the specific gravity derived from the specific gravity as 100% as a reference. For example, when the density of the sintered body of 95% WC-5% Cu is 7.50 g / cm ³ , d _95-5 = 14.
Since 95, the relative density (%) = 7.5 / 14.95
= 50.17. As is clear from FIG. 1, the higher the sintering temperature, the higher the sintering density. further,
As is clear from FIG. 2, as the sintering temperature increases, the bending strength of the sintered body also increases. Further, when the fracture surface of the sintered body obtained in Example 1 was observed with a scanning electron microscope (SEM), the average particle diameter in the sintered body was all 1 μm or less.

(Example 2) A mixed powder was prepared in the same manner as in Example 1 by changing the compounding ratio of WC and Cu, and this powder was 294MP.
Pressed at a and sintered at 1000 ° C. The relationship of bending strength of the obtained sintered body is shown in FIG. As shown in Figure 3,
It was found that the bending strength of the sintered body increased as the mixing ratio (Cu content) of the sintered body increased.

Example 3 Among the sintered bodies obtained in Example 1, the sintered body sintered at 1000 ° C. was used as a rotary polishing machine at 1000 rpm to simultaneously polish quartz and zirconia ceramics. Table 1 shows the results when
Shown in.

[0009]

[Table 1]

From Table 1, it is found that quartz and zirconia ceramics have an appropriate roughness and are good in that they do not crack during polishing. Moreover, when a bonded product of quartz and zirconia ceramics was polished at the same time, the level difference on the boundary surface was 0.02 μm or less, and there was almost no crack, which was good.

[0011]

As described above, according to the present invention, the binding temperature of hard fine particles is adjusted by adjusting the sintering temperature and the content thereof by using a low melting point metal. Since the fine particles are easily released and fresh particles are constantly exposed on the surface, it is possible to provide a composite polishing machine having a good polishing property and a method for producing the same. Further, according to the present invention, since the hard fine particles are fine, it is possible to provide a composite polishing machine and a method for manufacturing the same that can improve the surface accuracy of the polishing surface of the object to be polished. Here, when used as the abrasive particles of fine diamond, the diamond particles did not work effectively and the polishing cost was very high. However, according to the present invention, the polishing disk can be manufactured at a low cost, and thus the polishing cost is significantly increased. It is possible to provide a composite polishing plate and a method for manufacturing the same, which can be significantly reduced. Further, according to the present invention, the type of hard fine particles, the amount of bound metal, and the sintering temperature are adjusted according to the hardness of the object to be polished, and the relative density of the polishing plate is adjusted, so that a polishing plate with high polishing efficiency can be obtained. It is possible to provide a composite polishing plate that can be easily manufactured and a manufacturing method thereof.

[Brief description of drawings]

FIG. 1 is a diagram showing a relationship between a sintering temperature and a relative density of a sintered body of a composite polishing plate sintered body according to Example 1 of the present invention.

FIG. 2 is a diagram showing a relationship between a sintering temperature and a bending strength of a composite polishing plate sintered body according to Example 1 of the present invention.

FIG. 3 is a diagram showing a relationship between a mixing ratio and a bending strength of a sintered body for a composite polishing plate according to Example 2 of the present invention.

Claims (6)

[Claims] 1. Hard particles comprising at least one selected from the group consisting of WC, Mo ₂ C, W, and Mo of 60 to 98.
% By weight and at least one of the low melting point metals of Cu, Ni, Co and Fe which serve as a binder for the hard particles.
40% by weight of the composite abrasive. 2. The composite abrasive according to claim 1, which is 700 to 160 in a reducing atmosphere or an inert atmosphere by press molding.
A method for manufacturing a composite polishing plate, which comprises sintering at 0 ° C. 3. A hard fine particle composed of at least one of WC, Mo ₂ C, W and Mo is contained in an amount of 60 to 98% by weight and at least one of low melting point metals of Cu, Ni, Co and Fe is used as a binder. 40% by weight, said composite having a relative density of 40-90%. 4. The composite polishing plate according to claim 3, wherein the composite polishing plate is a porous sintered body. 5. The composite polishing machine according to claim 3, which is used for polishing quartz or zirconia ceramics. 6. The composite polishing board according to claim 3, wherein the hard particles have an average particle diameter of 1 μm or less.