JPH04294977A - Diamond grinding wheel - Google Patents

Diamond grinding wheel

Info

Publication number
JPH04294977A
JPH04294977A JP5899091A JP5899091A JPH04294977A JP H04294977 A JPH04294977 A JP H04294977A JP 5899091 A JP5899091 A JP 5899091A JP 5899091 A JP5899091 A JP 5899091A JP H04294977 A JPH04294977 A JP H04294977A
Authority
JP
Japan
Prior art keywords
diamond
binder
catalyst material
sintered body
abrasive grains
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5899091A
Other languages
Japanese (ja)
Inventor
Katsuo Shoji
庄司 克雄
Tsunemoto Kuriyagawa
廚川 常元
Hirotoshi Yoshinaga
吉永 博俊
Hideo Oshita
大下 秀男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osaka Diamond Industrial Co Ltd
Original Assignee
Osaka Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osaka Diamond Industrial Co Ltd filed Critical Osaka Diamond Industrial Co Ltd
Priority to JP5899091A priority Critical patent/JPH04294977A/en
Publication of JPH04294977A publication Critical patent/JPH04294977A/en
Pending legal-status Critical Current

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  • Polishing Bodies And Polishing Tools (AREA)

Abstract

PURPOSE:To obtain a diamond grinding wheel capable of working a diamond sintered body in a high accuracy with a high work efficiency. CONSTITUTION:A catalytic material thermochemically reacting to diamond is included in the binder of a diamond abrasive grain. Consequently, the catalytic material and diamond are thermochemically reacted by the heat generated by the contact of a sintered body and binder in addition to the mechanical grinding by the abrasive grain, and the polishing quantity is increased.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】この発明は、ダイヤモンド焼結体
の加工に用いるダイヤモンド砥石に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a diamond grindstone used for processing diamond sintered bodies.

【0002】0002

【従来の技術およびその課題】通常のダイヤモンド砥石
は、砥石基台にメタルボンドやレジノイドホンド、ビト
リファイドボンド等の結合剤によって多数のダイヤモン
ド砥粒を結合した構造で成っており、ダイヤモンド砥粒
が加工物と機械的にこすり合うことによって研削を行な
うようになっている。  しかしながら、加工物がダイ
ヤモンド砥粒と同じ硬度をもつダイヤモンド焼結体であ
る場合、ダイヤモンド砥粒の摩耗や脱落が激しくなり、
加工能率が極めて低くなると共に、仕上面精度も低いも
のしか得られない問題が生じる。
[Prior art and its problems] A normal diamond grinding wheel has a structure in which a large number of diamond abrasive grains are bonded to a grinding wheel base using a bonding agent such as metal bond, resinoid bond, or vitrified bond. Grinding is done by mechanically rubbing against the object. However, if the workpiece is a diamond sintered body with the same hardness as the diamond abrasive grains, the diamond abrasive grains will wear out and fall off severely.
A problem arises in that machining efficiency becomes extremely low and that only low finished surface accuracy can be obtained.

【0003】一方、従来からダイヤモンド砥粒の結合剤
に対して、その結合力や耐摩耗性を向上させた各種の改
良が加えられているが、このような結合剤の機械的特性
の改良では、高硬度のダイヤモンド焼結体の加工に対し
てほとんど成果が得られず、依然としてダイヤモンド砥
粒の摩耗や脱落が、加工能率や加工精度を低く決定づけ
る要因になっている。
On the other hand, various improvements have been made to the bonding agent for diamond abrasive grains to improve its bonding strength and wear resistance, but improvements in the mechanical properties of such bonding agents have not been possible. However, little success has been achieved in machining high-hardness diamond sintered bodies, and wear and drop of diamond abrasive grains are still a factor that determines low machining efficiency and machining accuracy.

【0004】この発明は、上記の課題に鑑みてなされた
もので、ダイヤモンド砥粒による機械的な研削力に加え
て、結合剤にダイヤモンドに対する積極的な加工機能を
もたせることにより、ダイヤモンド焼結体の高能率で高
精度な加工を可能としたダイヤモンド砥石を提供しよう
とするものである。
[0004] This invention was made in view of the above-mentioned problems, and in addition to the mechanical grinding force of diamond abrasive grains, it provides a bonding agent with an active processing function for diamond, thereby producing a diamond sintered body. The aim is to provide a diamond whetstone that enables highly efficient and highly accurate machining.

【0005】[0005]

【課題を解決するための手段】上記の課題を解決するた
め、この発明は、ダイヤモンド砥粒の結合剤にダイヤモ
ンドと熱化学反応をする触媒材料を含有させた構成とし
たものである。
[Means for Solving the Problems] In order to solve the above problems, the present invention has a structure in which the binder of diamond abrasive grains contains a catalyst material that undergoes a thermochemical reaction with diamond.

【0006】上記のように構成したダイヤモンド砥石に
よりダイヤモンド焼結体を加工すると、ダイヤモンド砥
粒と結合剤が面一になった状態で、結合剤にはダイヤモ
ンド焼結体との接触によって大きな圧力と高い熱が加わ
り、結合剤内の触媒材料と焼結体のダイヤモンドとが熱
化学反応を起こす。
When a diamond sintered body is processed using the diamond grindstone configured as described above, the diamond abrasive grains and the binder are flush with each other, and the binder is subjected to a large pressure due to contact with the diamond sintered body. The high heat causes a thermochemical reaction between the catalyst material in the binder and the diamond in the sintered body.

【0007】これにより、ダイヤモンド焼結体は、ダイ
ヤモンド砥粒による機械的なこすりと、触媒材料との熱
化学反応によって研削加工されることになり、短時間で
大きな加工量が得られる。また、触媒材料の熱化学的反
応によって、焼結体の表面のダイヤモンドが分解し、炭
素として触媒材料に固溶されると共に、ダイヤモンド砥
粒の摩耗が抑えられるため、加工面の仕上り精度が向上
する。
[0007] Thereby, the diamond sintered body is ground by mechanical rubbing by the diamond abrasive grains and thermochemical reaction with the catalyst material, and a large amount of processing can be obtained in a short time. In addition, due to the thermochemical reaction of the catalyst material, the diamond on the surface of the sintered body is decomposed and dissolved as carbon in the catalyst material, and wear of the diamond abrasive grains is suppressed, improving the finishing accuracy of the machined surface. do.

【0008】上記の触媒材料としては、ダイヤモンドと
の親和性が大きい鉄や、良好な濡れ性を示すコバルトが
適しており、他にニッケルや白金族の金属等を用いるこ
とができる。
[0008] As the above-mentioned catalyst material, iron, which has a high affinity with diamond, and cobalt, which shows good wettability, are suitable, and other materials such as nickel and platinum group metals can also be used.

【0009】また、大きな熱化学反応を得るために、触
媒材料の含有量は結合剤において主成分になるのがよく
、それらの結合剤全体に対する重量割合を、50〜10
0%の範囲で設定すると、大きな加工量増大効果が得ら
れる。
In addition, in order to obtain a large thermochemical reaction, the content of the catalyst material is preferably the main component in the binder, and the weight ratio of the catalyst material to the entire binder is 50 to 10.
If it is set within the range of 0%, a large effect of increasing the amount of processing can be obtained.

【0010】この場合、触媒材料以外の結合剤の金属材
料とし、結合剤全体としてメタルボンドを構成させるの
がよい。これにより、熱化学反応によって触媒材料が分
解しても、結合剤によるダイヤモンド砥粒の結合力を安
定して保持することができる。
In this case, it is preferable that the binder is made of a metal material other than the catalyst material, and that the binder as a whole constitutes a metal bond. Thereby, even if the catalyst material is decomposed due to a thermochemical reaction, the binding force of the diamond abrasive grains due to the binder can be stably maintained.

【0011】また、触媒材料と他の成分との均一な含有
状態を得るために、結合剤に使用する触媒材料は高純度
で極細な粉体を用いるのが望ましく、通常粒度が#20
〜5μmの範囲で、純度が99.5%以上の粉体とする
のが好ましい。
[0011] Furthermore, in order to obtain a uniform state of containing the catalyst material and other components, it is desirable that the catalyst material used in the binder be a highly purified and ultrafine powder, and the particle size is usually #20.
It is preferable that the powder has a purity of 99.5% or more within the range of 5 μm.

【0012】さらに、上記の構造に加えて、結合剤で結
合するダイヤモンド砥粒の粒度を#140〜#3000
の範囲とし、ダイヤモンド集中度を25〜200の範囲
に設定すると、ダイヤモンド砥粒による機械的な研削力
を十分に大きくすることができ、砥石全体として大きな
加工能力を備えることができる。
Furthermore, in addition to the above structure, the particle size of the diamond abrasive grains bonded by the binder is #140 to #3000.
When the diamond concentration is set in the range of 25 to 200, the mechanical grinding force by the diamond abrasive grains can be sufficiently increased, and the grindstone as a whole can have a large processing capacity.

【0013】[0013]

【実施例】この発明の効果をみるため、試験品を製作し
、従来品との間で比較加工試験を実施した。
[Example] In order to examine the effects of the present invention, a test product was manufactured and a comparative processing test was conducted between it and a conventional product.

【0014】試験で使用したダイヤモンド砥石は、表1
に示す寸法と仕様のものとし、その寸法と仕様に基づい
て、試験品Aと試験品Bの2種類の試験品と、結合剤と
してメタルボンドを用いた従来品Cを準備した。それら
の結合剤の仕様は、表2の通りである。
[0014] The diamond whetstones used in the test are shown in Table 1.
Based on the dimensions and specifications, two types of test products, test product A and test product B, and a conventional product C using metal bond as a binder were prepared. The specifications of those binders are shown in Table 2.

【0015】[0015]

【表1】[Table 1]

【0016】[0016]

【表2】[Table 2]

【0017】なお、試験品AとBの結合剤において、F
eとCoはそれぞれ純度99.5%以上で、粒度範囲が
#20〜5μmの粉体を使用した。
[0017] In the binders of test items A and B, F
For e and Co, powders with a purity of 99.5% or more and a particle size range of #20 to 5 μm were used.

【0018】ダイヤモンド砥石の製造は、上記の結合剤
の金属粉末とダイヤモンド粉末を混合し、その混合物を
金型に挿入した後、2ton/cm2 の圧力で冷間圧
縮し、その後、水素ガス雰囲気中で700℃で焼結して
ダイヤモンド層を形成する方法で行なった。
Diamond grinding wheels are manufactured by mixing the metal powder of the binder and diamond powder, inserting the mixture into a mold, cold compressing it at a pressure of 2 tons/cm2, and then compressing it in a hydrogen gas atmosphere. The diamond layer was formed by sintering at 700°C.

【0019】加工物は、切削工具に用いるダイヤモンド
焼結体を使用し、また、加工条件は、加工物を15回/
min で揺動させ、加工物と砥石と間に2.5MPa
の加工負荷を加えた状態で、ダイヤモンド砥石の回転数
Vを3000rpmと6000rpmに切り換えて行な
った。
The workpiece used is a diamond sintered body used for cutting tools, and the processing conditions were as follows:
oscillate at 2.5 MPa between the workpiece and the grindstone.
The rotation speed V of the diamond grindstone was changed to 3000 rpm and 6000 rpm while applying a machining load of 3000 rpm.

【0020】試験は、先ず、V=3000rpmと60
00rpmの2つの回転数において、試験品A、Bと従
来品Cにより研磨面積12.5mm2 で研削した場合
の累積研磨量を比較した。結果を図1及び図2に示す。
[0020] First, the test was conducted at V = 3000 rpm and 60 rpm.
The cumulative amount of polishing was compared between test products A and B and conventional product C when grinding was performed with a polishing area of 12.5 mm 2 at two rotational speeds of 00 rpm. The results are shown in FIGS. 1 and 2.

【0021】この図1と図2から明らかなように、試験
品Aと試験品Bは2つの回転数の条件において従来品C
に比べ大きな研磨能力を示し、特に、高い回転数(V=
6000rpm)において、著しい研磨量の増大を示し
た。これは、高速回転になるほど結合剤とダイヤモンド
焼結体の接触部分の発生熱が高くなるため、触媒作用に
よる熱化学的反応も大きくなり、研磨量の増大をもたら
したものと考えられる。
As is clear from FIGS. 1 and 2, test product A and test product B were superior to conventional product C under two rotational speed conditions.
It shows greater polishing ability compared to
6000 rpm), the amount of polishing showed a significant increase. This is thought to be due to the fact that the higher the rotation speed, the higher the heat generated at the contact area between the binder and the diamond sintered body, so the thermochemical reaction due to catalytic action also increases, resulting in an increase in the amount of polishing.

【0022】試験は、次に、上記の2つの回転数で加工
した場合の仕上面粗さ(Ra)と平面度を比較した。結
果を図3及び図4に示す。
[0022] Next, the test compared the finished surface roughness (Ra) and flatness when machining was performed at the above two rotational speeds. The results are shown in FIGS. 3 and 4.

【0023】上図の結果から、結合剤にFeを含有した
試験品Aは、従来品Cに比べて仕上面積度の大きな向上
を示し、Feが仕上面粗さや平面度の向上に大きな役割
を示すことが解った。これから、ダイヤモンドに対する
親和性の大きさが仕上面精度の向上に大きく寄与するこ
とが推察される。
[0023] From the results shown in the above figure, test product A containing Fe in the binder showed a large improvement in the finished surface area compared to conventional product C, indicating that Fe plays a major role in improving the finished surface roughness and flatness. I understand what it shows. From this, it can be inferred that the affinity for diamond greatly contributes to improving the finished surface accuracy.

【0024】以上の試験の結果から、結合剤に含有した
FeやCoと、焼結体のダイヤモンドとの熱化学的反応
により、ダイヤモンド砥粒の研削機能だけを備えた従来
品に比べて、研磨能力の大幅な増大が図れることが確認
できた。
From the above test results, it was found that due to the thermochemical reaction between the Fe and Co contained in the binder and the diamond in the sintered body, polishing was improved compared to conventional products that only had the function of grinding diamond abrasive grains. It was confirmed that the capacity could be significantly increased.

【0025】また、触媒材料を選択することにより、仕
上面精度の向上を図れることが確認された。
[0025] Furthermore, it has been confirmed that the finished surface accuracy can be improved by selecting the catalyst material.

【0026】[0026]

【効果】以上説明したように、この発明は、結合剤にダ
イヤモンドと反応する触媒材料を含有させたので、ダイ
ヤモンド焼結体をダイヤモンド砥粒による研削と共に熱
化学的にも加工することができ、焼結体の加工に対して
加工能率の増大と仕上面精度の向上が図れる効果がある
[Effects] As explained above, in this invention, since the binder contains a catalyst material that reacts with diamond, a diamond sintered body can be processed thermochemically as well as by grinding with diamond abrasive grains. This has the effect of increasing processing efficiency and improving finished surface accuracy when processing sintered bodies.

【図面の簡単な説明】[Brief explanation of drawings]

【図1】回転数3000rpmでの累積研磨量を示すグ
ラフ
[Figure 1] Graph showing the cumulative amount of polishing at a rotation speed of 3000 rpm

【図2】回転数6000rpmでの累積研磨量を示すグ
ラフ
[Figure 2] Graph showing the cumulative amount of polishing at a rotation speed of 6000 rpm

【図3】仕上面粗さを示すグラフ[Figure 3] Graph showing finished surface roughness

【図4】平面度を示すグラフ[Figure 4] Graph showing flatness

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】  ダイヤモンド砥粒の結合剤にダイヤモ
ンドと熱化学反応をする触媒材料を含有させたダイヤモ
ンド砥石。
1. A diamond whetstone in which the binder of diamond abrasive grains contains a catalyst material that undergoes a thermochemical reaction with diamond.
【請求項2】  上記触媒材料が鉄又はコバルトである
請求項1に記載のダイヤモンド砥石。
2. The diamond grindstone according to claim 1, wherein the catalyst material is iron or cobalt.
【請求項3】  上記触媒材料の結合剤全体に対する重
量割合を、50〜100%の範囲に設定した請求項1又
は2に記載のダイヤモンド砥石。
3. The diamond grindstone according to claim 1, wherein the weight ratio of the catalyst material to the entire binder is set in a range of 50 to 100%.
【請求項4】  上記触媒材料以外の結合剤の成分を金
属材料とした請求項1乃至3のいずれかに記載のダイヤ
モンド砥石。
4. The diamond grindstone according to claim 1, wherein a component of the binder other than the catalyst material is a metal material.
【請求項5】  結合剤に使用する触媒材料を、粒度が
#20〜5μmの範囲の粉体で、純度が99.5%以上
のものとした請求項1乃至4のいずれかに記載のダイヤ
モンド砥石。
5. The diamond according to claim 1, wherein the catalyst material used as the binder is a powder with a particle size in the range of #20 to 5 μm and a purity of 99.5% or more. Whetstone.
【請求項6】  砥石のダイヤモンド粒度を#140〜
#3000の範囲とし、ダイヤモンド集中度を25〜2
00の範囲とした請求項1乃至5のいずれかに記載のダ
イヤモンド砥石。
[Claim 6] The diamond grain size of the whetstone is #140~
#3000 range, diamond concentration 25-2
The diamond grindstone according to any one of claims 1 to 5, wherein the diamond grindstone is in the range of 00.
JP5899091A 1991-03-22 1991-03-22 Diamond grinding wheel Pending JPH04294977A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5899091A JPH04294977A (en) 1991-03-22 1991-03-22 Diamond grinding wheel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5899091A JPH04294977A (en) 1991-03-22 1991-03-22 Diamond grinding wheel

Publications (1)

Publication Number Publication Date
JPH04294977A true JPH04294977A (en) 1992-10-19

Family

ID=13100285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5899091A Pending JPH04294977A (en) 1991-03-22 1991-03-22 Diamond grinding wheel

Country Status (1)

Country Link
JP (1) JPH04294977A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5865263A (en) * 1995-02-28 1999-02-02 Kabushikikaisha Equos Research Hybrid vehicle

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5437599A (en) * 1977-08-29 1979-03-20 Matsushita Electric Works Ltd Refuge guide device
JPS57196767A (en) * 1981-05-25 1982-12-02 Sumitomo Electric Industries Seizure-resistant diamond abrasive grain
JPS59161268A (en) * 1983-01-10 1984-09-12 デ・ビア−ズ・インダストリアル・ダイアモンドデイビイジヨン(プロプライエタリイ)リミテツド Abrasive body and manufacture thereof
JPS619245A (en) * 1984-06-25 1986-01-16 松下電器産業株式会社 Insect control apparatus
JPS632670A (en) * 1986-06-24 1988-01-07 Fuji Dies Kk Diamond grinding tool
JPS6399177A (en) * 1986-10-14 1988-04-30 Goei Seisakusho:Kk Manufacture of grinding wheel of cast iron bonded diamond
JPH0276680A (en) * 1988-09-13 1990-03-16 Asahi Daiyamondo Kogyo Kk Diamond grinding stone with metal bond

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5437599A (en) * 1977-08-29 1979-03-20 Matsushita Electric Works Ltd Refuge guide device
JPS57196767A (en) * 1981-05-25 1982-12-02 Sumitomo Electric Industries Seizure-resistant diamond abrasive grain
JPS59161268A (en) * 1983-01-10 1984-09-12 デ・ビア−ズ・インダストリアル・ダイアモンドデイビイジヨン(プロプライエタリイ)リミテツド Abrasive body and manufacture thereof
JPS619245A (en) * 1984-06-25 1986-01-16 松下電器産業株式会社 Insect control apparatus
JPS632670A (en) * 1986-06-24 1988-01-07 Fuji Dies Kk Diamond grinding tool
JPS6399177A (en) * 1986-10-14 1988-04-30 Goei Seisakusho:Kk Manufacture of grinding wheel of cast iron bonded diamond
JPH0276680A (en) * 1988-09-13 1990-03-16 Asahi Daiyamondo Kogyo Kk Diamond grinding stone with metal bond

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5865263A (en) * 1995-02-28 1999-02-02 Kabushikikaisha Equos Research Hybrid vehicle

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