CN117300923A - Preparation process and application of porous active metal-based diamond abrasive particle tool - Google Patents
Preparation process and application of porous active metal-based diamond abrasive particle tool Download PDFInfo
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- CN117300923A CN117300923A CN202311298255.6A CN202311298255A CN117300923A CN 117300923 A CN117300923 A CN 117300923A CN 202311298255 A CN202311298255 A CN 202311298255A CN 117300923 A CN117300923 A CN 117300923A
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- Prior art keywords
- diamond abrasive
- active metal
- abrasive particle
- porous active
- metal
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- 239000010432 diamond Substances 0.000 title claims abstract description 91
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 91
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 70
- 239000002184 metal Substances 0.000 title claims abstract description 70
- 239000002245 particle Substances 0.000 title claims abstract description 63
- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- 238000000227 grinding Methods 0.000 claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 17
- 239000007767 bonding agent Substances 0.000 claims abstract description 14
- 229910004349 Ti-Al Inorganic materials 0.000 claims abstract description 10
- 229910004692 Ti—Al Inorganic materials 0.000 claims abstract description 10
- 239000006061 abrasive grain Substances 0.000 claims description 27
- 239000011812 mixed powder Substances 0.000 claims description 20
- 239000003292 glue Substances 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 12
- 239000000843 powder Substances 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 9
- 239000002994 raw material Substances 0.000 claims description 8
- 238000009966 trimming Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 4
- 238000001272 pressureless sintering Methods 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 4
- 238000009792 diffusion process Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 229910000765 intermetallic Inorganic materials 0.000 abstract description 3
- 150000002739 metals Chemical class 0.000 abstract description 3
- 239000011148 porous material Substances 0.000 abstract description 3
- 230000002035 prolonged effect Effects 0.000 abstract description 3
- 239000011343 solid material Substances 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 229910052594 sapphire Inorganic materials 0.000 description 6
- 239000010980 sapphire Substances 0.000 description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
- B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/346—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties utilised during polishing, or grinding operation
Abstract
The invention relates to the technical field of porous active metal-based diamond abrasive particles, in particular to a preparation process of a porous active metal-based diamond abrasive particle tool and application thereof; the Ti-Al-based metal is selected as a bonding agent of the diamond abrasive particle tool, chemical metallurgical bonding is realized by using mutual diffusion of active metal Ti and diamond, so that the holding force of the abrasive particles is improved, the service life of the tool is prolonged, a porous structure is introduced by using the Kendall effect between Ti/Al elements, the self-sharpening capability and the chip removal and heat dissipation capability of the diamond abrasive particle tool are improved, materials such as pore formers and the like are not needed to be added to reduce the production cost, and intermetallic compounds are generated by using mutual diffusion between Ti/Al metals, so that the hardness of the metal bonding agent is improved, and the grinding requirement of extremely hard and brittle solid materials is better met.
Description
Technical Field
The invention relates to the technical field of porous active metal-based diamond abrasive particles, in particular to a preparation process and application of a porous active metal-based diamond abrasive particle tool.
Background
Diamond abrasive grain tools are important tools for abrasive machining in modern precision manufacturing. Diamond abrasive tools can be classified into three categories, resin, ceramic, metal bond, according to the classification of the bond.
When the existing diamond abrasive particle tool is used for grinding hard and brittle materials, the hardness of the resin bond is low, the self-sharpening property is good, but the heat resistance is poor, the abrasion rate is high, and the diamond abrasive particle tool is only suitable for grinding and processing the brittle materials with low hardness; the porous structure of the ceramic bond improves the self-sharpening capability, but also accelerates the replacement speed of new and old abrasive particles, and has lower service life; the metal bonding agent has small porosity, high compactness, strong holding force on diamond abrasive particles and long service life of the tool, but has poor self-sharpening capability, and the holding mode of the conventional bonding agent on diamond is mechanical embedding, so that the self-sharpening capability and the service life of the diamond abrasive particle tool are difficult to be simultaneously considered, and the contradiction between the self-sharpening capability and the service life of the diamond abrasive particle tool is further aggravated due to the extremely hard and brittle characteristics of single crystal materials such as sapphire, silicon carbide and the like.
Accordingly, a process for producing a porous active metal-based diamond abrasive grain tool has been proposed to solve the above-mentioned problems.
Disclosure of Invention
In order to make up the deficiency of the prior art, the method solves the problems that the hardness of the resin bond is lower, the self-sharpening property is good, the heat resistance is poor, the abrasion rate is higher when the diamond abrasive particle tool grinds hard and brittle materials, and the method is only suitable for grinding and processing the brittle materials with lower hardness; the porous structure of the ceramic bond improves the self-sharpening capability, but also accelerates the replacement speed of new and old abrasive particles, and has lower service life; the metal bonding agent has small porosity, high compactness, strong holding force on diamond abrasive particles and long service life of the tool, but has poor self-sharpening capability, and the holding mode of the conventional bonding agent on diamond is mechanical embedding, so that the self-sharpening capability and the service life of the diamond abrasive particle tool are difficult to be simultaneously considered, and the contradiction between the self-sharpening capability and the service life of the diamond abrasive particle tool is further aggravated due to the extremely hard and brittle characteristics of single crystal materials such as sapphire, silicon carbide and the like.
The technical scheme adopted for solving the technical problems is as follows: a process for preparing a porous active metal-based diamond abrasive particle tool, comprising the steps of:
s1, premixing raw materials;
s2, adding glue;
s3, cold press molding;
s4, sintering and forming;
s5, bonding and trimming.
Preferably, in the step S1, the required Ti, al metal powder and diamond abrasive grains are accurately taken out by the dosage spoon, put into a mixing raw material bottle, continuously mixed for 3-6 hours in a mixer, and after the materials are uniformly mixed, taken out and sieved.
Preferably, in the step S1, the diamond abrasive grain tool includes an abrasive disc and a back thinning grinding wheel, and the diamond abrasive grain tool has a porous structure, the diamond abrasive grain includes bare diamond particles and Ti-plated diamond particles, and the diamond abrasive grain size is 1-200 μm; the diamond abrasive grain accounts for 15-75% of the volume of the diamond abrasive grain tool, the active metal bonding agent is Ti-Al-based metal, the mass ratio of Al in the Ti-Al-based metal is 15-70%, the Ti content is the balance, and the particle size of metal powder of Al and Ti is 1-10 mu m.
Preferably, in the step S2, glue is added into the mixed powder after the step S1 is completed, and the mixed powder is stirred uniformly by a stirring rod, and then the mixed powder is put into a constant-temperature drying oven for drying, and the mixed powder is taken out and sieved again after the drying is completed.
Preferably, in the step S2, the glue adding amount is 5-15% of the mass of the mixed powder.
Preferably, in the step S3, the mixed material after completing the step S2 is loaded into a steel mold, and cold pressing and demolding are performed by using a hydraulic press, so as to obtain a cold pressing blank.
Preferably, in the step S3, the cold pressing pressure is 100-200MPa.
Preferably, in the step S4, the cold-pressed blank after completing the step S3 is placed into a high-temperature vacuum furnace, and pressureless sintering is performed to obtain a sintered molding block.
Preferably, in the step S4, the temperature in the furnace is raised to 500-600 ℃ at a rate of 10 ℃/min and kept for 60-100 min, then is continuously raised to 750-1000 ℃ at a rate of 5 ℃/min and sintered for 30-120 min, and finally is cooled along with the furnace.
Preferably, in the step S5, the sintered molding block obtained in the step four is subjected to ultrasonic cleaning with alcohol, and then bonded to the substrate according to the required arrangement sequence, and subjected to surface polishing and finishing.
Preferably, the use of Ti, al metal powder according to claim 2 and diamond abrasive grains, abrasive disc and back-thinned grinding wheel according to claim 3 in porous active metal-based diamond abrasive grain tools.
The invention has the advantages that:
according to the invention, ti-Al-based metal is selected as a bonding agent of a diamond abrasive particle tool, and chemical metallurgical bonding is realized by using mutual diffusion of active metal Ti and diamond, so that the holding force of abrasive particles is improved, and the service life of the tool is further prolonged; the method has the advantages that the porous structure is introduced by utilizing the Kendall effect between Ti/Al elements so as to improve the self-sharpening capability and the chip removal and heat dissipation capability of the diamond abrasive particle tool, and materials such as pore formers and the like are not required to be added so as to reduce the production cost; inter-diffusion between Ti/Al metals is utilized to generate intermetallic compounds so as to improve the hardness of the metal bonding agent and further better meet the grinding requirement of extremely hard and brittle solid materials.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.
FIG. 1 is a pictorial view of a porous active metal-based diamond abrasive disk made in accordance with the present invention;
FIG. 2 is a physical diagram of a porous active metal-based backing-thinning grinding wheel prepared by the invention;
FIG. 3 is a pictorial view of the single crystal silicon carbide and the back thinning grinding wheel cutting edge after grinding in accordance with the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
A process for preparing a porous active metal-based diamond abrasive particle tool, comprising the steps of:
s1, premixing raw materials;
s2, adding glue;
s3, cold press molding;
s4, sintering and forming;
s5, bonding and trimming.
In the step S1, the required Ti and Al metal powder and diamond abrasive grains are accurately taken out by a dosage spoon, put into a mixed raw material bottle, continuously mixed for 6 hours in a mixer, and after the materials are uniformly mixed, taken out and sieved.
In the step S1, the diamond abrasive particle tool comprises an abrasive disc and a back thinning grinding wheel, the diamond abrasive particle tool is of a porous structure, the diamond abrasive particle comprises bare diamond particles and Ti-plated diamond particles, and the grain diameter of the diamond abrasive particle is 3-5 mu m; the diamond abrasive grain accounts for 25% of the volume of the diamond abrasive grain tool, the active metal bonding agent is Ti-Al-based metal, the mass ratio of Al in the Ti-Al-based metal is 60%, the Ti content is the balance, and the grain size of the metal powder of Al and Ti is 1 mu m.
In the step S2, glue is added into the mixed powder after the step S1, and the mixed powder is stirred uniformly by a stirring rod, and then the mixed powder is placed into a constant-temperature drying box for drying, and the dried mixed powder is taken out and sieved again.
In the preparation process of the porous active metal-based diamond abrasive particle tool, in the step S2, the glue addition amount is 8% of the mass of the mixed powder.
In the step S3, the mixed material which is subjected to the step S2 is filled into a steel mould, and cold pressing and demoulding are carried out by using a hydraulic press to obtain a cold pressing blank.
In step S3, the cold pressing pressure is 150MPa.
In the step S4, the cold-pressed blank after the step S3 is placed into a high-temperature vacuum furnace for pressureless sintering, and a sintered molding block is obtained.
In the step S4, the temperature in the furnace is firstly increased to 550 ℃ at the speed of 10 ℃/min and is kept for 60 minutes, then the temperature is continuously increased to 830 ℃ at the speed of 5 ℃/min and is sintered for 60 minutes, and finally the furnace is cooled.
In the step S5, the sintered molding block obtained in the step four is subjected to alcohol ultrasonic cleaning, then bonded to a substrate according to the required arrangement sequence, and subjected to surface polishing and trimming.
A process for preparing a porous active metal-based diamond abrasive particle tool and application thereof, wherein the Ti and Al metal powder and diamond abrasive particles according to claim 2, the abrasive disc according to claim 3 and the back-thinned grinding wheel are applied to the porous active metal-based diamond abrasive particle tool.
The porous active metal-based diamond grinding disc prepared in the embodiment is applied to the grinding processing of sapphire: and the linear cutting processing trace on the surface of the 4-inch sapphire wafer is completely removed after the 4-inch sapphire wafer is ground for 4 hours under the load of 30N, the near-mirror surface effect is shown, and a real object diagram of the ground sapphire is shown in figure 2.
Example two
A process for preparing a porous active metal-based diamond abrasive particle tool, comprising the steps of:
s1, premixing raw materials;
s2, adding glue;
s3, cold press molding;
s4, sintering and forming;
s5, bonding and trimming.
In the step S1, the required Ti and Al metal powder and diamond abrasive grains are accurately taken out by a dosage spoon, put into a mixed raw material bottle, continuously mixed for 5 hours in a mixer, and after the materials are uniformly mixed, taken out and sieved.
In the step S1, the diamond abrasive particle tool comprises an abrasive disc and a back thinning grinding wheel, the diamond abrasive particle tool is of a porous structure, the diamond abrasive particle comprises bare diamond particles and Ti-plated diamond particles, and the grain diameter of the diamond abrasive particle is 5-10 mu m; the diamond abrasive grain accounts for 62.5% of the volume of the diamond abrasive grain tool, the active metal bonding agent is Ti-Al-based metal, the mass ratio of Al in the Ti-Al-based metal is 30%, the Ti content is the balance, and the grain size of metal powder of Al and Ti is 3-5 mu m.
In the step S2, glue is added into the mixed powder after the step S1, and the mixed powder is stirred uniformly by a stirring rod, and then the mixed powder is placed into a constant-temperature drying box for drying, and the dried mixed powder is taken out and sieved again.
In the preparation process of the porous active metal-based diamond abrasive particle tool, in the step S2, the glue addition amount is 12% of the mass of the mixed powder.
In the step S3, the mixed material which is subjected to the step S2 is filled into a steel mould, and cold pressing and demoulding are carried out by using a hydraulic press to obtain a cold pressing blank.
In the step S3, the cold pressing pressure is 180MPa.
In the step S4, the cold-pressed blank after the step S3 is placed into a high-temperature vacuum furnace for pressureless sintering, and a sintered molding block is obtained.
In the step S4, the temperature in the furnace is firstly increased to 600 ℃ at the speed of 10 ℃/min and kept for 90 minutes, then the temperature is continuously increased to 900 ℃ at the speed of 5 ℃/min and sintered for 60 minutes, and finally the furnace is cooled.
In the step S5, the sintered molding block obtained in the step four is subjected to alcohol ultrasonic cleaning, then bonded to a substrate according to the required arrangement sequence, and subjected to surface polishing and trimming.
A process for preparing a porous active metal-based diamond abrasive particle tool and application thereof, wherein the Ti and Al metal powder and diamond abrasive particles according to claim 2, the abrasive disc according to claim 3 and the back-thinned grinding wheel are applied to the porous active metal-based diamond abrasive particle tool.
The porous active metal-based back thinning grinding wheel prepared in the embodiment is applied to grinding processing of monocrystalline silicon carbide: when the feeding speed is reduced to 1 mu m/s, the thinning grinding of 4 inches of monocrystalline silicon carbide is realized, the grinding back thinning grinding wheel cutting edge still presents a porous structure, namely the self-sharpening property is good, and the grinding monocrystalline silicon carbide and the back thinning grinding wheel cutting edge are shown in figure 3.
Working principle: the Ti-Al-based metal is selected as a bonding agent of the diamond abrasive particle tool, chemical metallurgical bonding is realized by using mutual diffusion of active metal Ti and diamond, so that the holding force of the abrasive particles is improved, the service life of the tool is prolonged, a porous structure is introduced by using the Kendall effect between Ti/Al elements, the self-sharpening capability, chip removal capability and heat dissipation capability of the diamond abrasive particle tool are improved, materials such as pore formers and the like are not needed to be added to reduce the production cost, intermetallic compounds are generated by using mutual diffusion between Ti/Al metals, the hardness of the metal bonding agent is improved, and the grinding requirement of extremely hard and brittle solid materials is better met.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the foregoing embodiments, which have been described in the foregoing description merely illustrates the principles of the invention, and that various changes and modifications may be made therein without departing from the spirit and scope of the invention, which is defined in the appended claims.
Claims (10)
1. A preparation process of a porous active metal-based diamond abrasive particle tool is characterized in that: the method comprises the following steps:
s1, premixing raw materials;
s2, adding glue;
s3, cold press molding;
s4, sintering and forming;
s5, bonding and trimming.
2. The process for preparing a porous active metal-based diamond abrasive particle tool according to claim 1, wherein: in the step S1, the required Ti and Al metal powder and diamond abrasive grains are accurately taken out by a dosage spoon, put into a mixed raw material bottle, continuously mixed for 3-6 hours in a mixer, and taken out and sieved after the materials are uniformly mixed.
3. The process for preparing a porous active metal-based diamond abrasive grain tool according to claim 2, wherein: in the step S1, the diamond abrasive grain tool includes an abrasive disc and a back thinning grinding wheel, and the diamond abrasive grain tool has a porous structure, the diamond abrasive grain includes bare diamond particles and Ti-plated diamond particles, and the grain size of the diamond abrasive grain is 1-200 μm; the diamond abrasive grain accounts for 15-75% of the volume of the diamond abrasive grain tool, the active metal bonding agent is Ti-Al-based metal, the mass ratio of Al in the Ti-Al-based metal is 15-70%, the Ti content is the balance, and the particle size of metal powder of Al and Ti is 1-10 mu m.
4. The process for preparing a porous active metal-based diamond abrasive particle tool according to claim 1, wherein: in the step S2, glue is added into the mixed powder after the step S1 is completed, the mixed powder is uniformly stirred by a stirring rod, then the mixed powder is put into a constant-temperature drying box for drying, the dried mixed powder is taken out and sieved again, and the addition amount of the glue is 5-15% of the mass of the mixed powder.
5. The process for preparing a porous active metal-based diamond abrasive particle tool according to claim 1, wherein: in the step S3, the mixed material after the step S2 is filled into a steel mould, and cold pressing and demoulding are carried out by using a hydraulic press to obtain a cold pressing blank.
6. The process for preparing a porous active metal-based diamond abrasive particle tool according to claim 5, wherein: in the step S3, the cold pressing pressure is 100-200MPa.
7. The process for preparing a porous active metal-based diamond abrasive particle tool according to claim 1, wherein: in the step S4, the cold-pressed blank after the step S3 is placed into a high-temperature vacuum furnace for pressureless sintering, and a sintered molding block is obtained.
8. The process for preparing a porous active metal-based diamond abrasive particle tool according to claim 7, wherein: in the step S4, the temperature in the furnace is firstly increased to 500-600 ℃ at the speed of 10 ℃/min and is kept for 60-100 min, then the temperature is continuously increased to 750-1000 ℃ at the speed of 5 ℃/min and is sintered for 30-120 min, and finally the furnace is cooled.
9. The process for preparing a porous active metal-based diamond abrasive particle tool according to claim 1, wherein: in the step S5, the sintering molding block obtained in the step four is subjected to alcohol ultrasonic cleaning, then is bonded to a substrate according to the required arrangement sequence, and is subjected to surface polishing and trimming.
10. Use of the Ti, al metal powder according to claim 2, diamond abrasive grains, abrasive disc and back thinning grinding wheel according to claim 3 in porous active metal-based diamond abrasive grain tools.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311298255.6A CN117300923A (en) | 2023-10-09 | 2023-10-09 | Preparation process and application of porous active metal-based diamond abrasive particle tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311298255.6A CN117300923A (en) | 2023-10-09 | 2023-10-09 | Preparation process and application of porous active metal-based diamond abrasive particle tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117300923A true CN117300923A (en) | 2023-12-29 |
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ID=89280847
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|---|---|---|---|
| CN202311298255.6A Pending CN117300923A (en) | 2023-10-09 | 2023-10-09 | Preparation process and application of porous active metal-based diamond abrasive particle tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117300923A (en) |
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2023
- 2023-10-09 CN CN202311298255.6A patent/CN117300923A/en active Pending
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Effective date of registration: 20240119 Address after: Fengze District of Quanzhou City, Fujian province 362021 Applicant after: HUAQIAO University Applicant after: Xiamen shizhirui Material Technology Co.,Ltd. Address before: Xiamen Park, Huaqiao University, No. 668, Jimei Avenue, Jimei District, Xiamen, 361000, Fujian Applicant before: HUAQIAO University |