CN113021204B - Porous ultrathin grinding wheel for cutting chip and preparation method thereof - Google Patents
Porous ultrathin grinding wheel for cutting chip and preparation method thereof Download PDFInfo
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- CN113021204B CN113021204B CN202110379057.7A CN202110379057A CN113021204B CN 113021204 B CN113021204 B CN 113021204B CN 202110379057 A CN202110379057 A CN 202110379057A CN 113021204 B CN113021204 B CN 113021204B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/1003—Use of special medium during sintering, e.g. sintering aid
- B22F3/1007—Atmosphere
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/11—Making porous workpieces or articles
- B22F3/1121—Making porous workpieces or articles by using decomposable, meltable or sublimatable fillers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
- B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C14/00—Alloys based on titanium
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C26/00—Alloys containing diamond or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F2005/001—Cutting tools, earth boring or grinding tool other than table ware
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Abstract
The invention provides a porous ultrathin grinding wheel for cutting chips and a preparation method thereof, wherein the ultrathin grinding wheel consists of a superhard grinding material and a metal-based matrix, the superhard grinding material comprises diamond and cubic boron nitride, the metal-based matrix is Ti-Al-based alloy, and a porous structure on the ultrathin grinding wheel is generated by utilizing a Cokendall effect reaction caused by the difference of diffusion rates between Ti/Al elements; the preparation method comprises the steps of material preparation, cold press molding, sintering molding and machining; the sintering forming comprises two sintering processes of pore forming and performance adjusting, wherein the sintering conditions of the pore forming process are 600-700 ℃ and 10-240 min, and the sintering conditions of the performance adjusting process are 750-1100 ℃ and 5-120 min. The invention realizes chemical bonding by utilizing mutual diffusion of Ti element and superhard abrasive material so as to improve the holding force of abrasive particles and further thin the ultrathin grinding wheel; the self-sharpening capability of the ultrathin grinding wheel is improved by introducing a porous structure by utilizing the Kerkdall effect between Ti/Al elements so as to improve the scribing quality of a chip, and materials such as pore-forming agents are not required to be added so as to reduce the production cost.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of manufacturing of a chip dicing grinding wheel tool, in particular to a porous ultrathin grinding wheel for chip dicing and a preparation method thereof.
[ background ] A method for producing a semiconductor device
The ultrathin grinding wheel is an important tool for wafer cutting in the semiconductor industry, the cutting quality of the ultrathin grinding wheel directly influences the yield and the service performance of chips, and the ultrathin grinding wheel bears the economic cost of a plurality of previous working procedures. With the miniaturization and the large capacity of semiconductor chips, the cutting space between the chips is smaller and smaller, which greatly improves the technical requirements on the thickness and the strength of the ultrathin grinding wheel. The binding agent of the ultrathin grinding wheel is mainly divided into three types of resin, ceramic and metal, and the metal binding agent has a large performance adjusting area, so that the problems of low strength, poor heat resistance, brittleness, easy breakage, difficult thinning and the like of the resin binding agent and the ceramic binding agent can be avoided, and the ultrathin grinding wheel becomes a wider binding agent type at present. The electroforming metal ultrathin grinding wheel is formed by electrodeposition, and can be used for preparing an ultrathin grinding wheel with the thickness of 0.015mm, but the abrasive particles are low in holding force and small in exposure degree due to the fact that the superhard abrasive is solidified in a mechanical embedding mode; the sintered metal ultrathin grinding wheel has developed various metal bond types such as a Cu base, a Co base, a Fe base and the like, when the ultrathin grinding wheel with the thickness less than 0.1mm is prepared, the Cu base bonding agent is universally applied due to good mechanical property, but the Cu base bonding agent also depends on a mechanical embedding mode to hold the superhard grinding material. Because the mechanical embedded abrasive must ensure enough coating thickness, the continuous thinning of the ultrathin grinding wheel is difficult to carry out; on the other hand, the Cu-based bonding agent is often required to improve the connection strength of the mechanically embedded abrasive by improving the compactness of the metal bonding agent, and the compact tire body reduces the self-sharpening capability of the ultrathin grinding wheel, so that the cutting quality cannot be further improved.
In order to solve the problems, Ti-Al-based high-strength alloy is selected as a bonding agent of the metal ultrathin grinding wheel, and chemical bonding is realized by utilizing interdiffusion of Ti element and superhard grinding material, so that the holding force of abrasive particles is improved, and the bottleneck problem that the ultrathin grinding wheel cannot be thinned further is solved; on the other hand, a porous structure is introduced by utilizing the Kenkard effect among Ti/Al elements to improve the self-sharpening capability of the ultrathin grinding wheel so as to improve the chip cutting quality, and materials such as pore-forming agents are not required to be added so as to reduce the production cost.
[ summary of the invention ]
The technical problem to be solved by the invention is to provide a porous ultrathin grinding wheel for chip dicing and a preparation method thereof, wherein chemical bonding is realized by utilizing interdiffusion of Ti element and superhard grinding material, so that the holding force of abrasive particles is improved, and the ultrathin grinding wheel can be further thinned; the self-sharpening capability of the ultrathin grinding wheel is improved by introducing a porous structure by utilizing the Kerkdall effect between Ti/Al elements so as to improve the scribing quality of a chip, and materials such as pore-forming agents are not required to be added so as to reduce the production cost.
The invention is realized by the following steps:
a porous ultrathin grinding wheel for cutting a chip comprises a superhard grinding material and a metal matrix, wherein the ultrathin grinding wheel is of a porous structure; the superabrasive material comprises diamond or cubic boron nitride; the metal matrix body is Ti-Al based alloy.
Further, the porous structure is formed by utilizing a kirkendall effect reaction caused by a difference in diffusion rate between Ti/Al elements.
Furthermore, the volume content ratio of the superhard abrasive material in the ultrathin grinding wheel is 2.5-75%, and the grain size of the superhard abrasive material is 1-40 mu m.
Furthermore, the mass ratio of metal Al in the Ti-Al-based alloy is 5-40%, the content of metal Ti is the balance, and the particle size of the metal Al and the metal Ti powder is 1-15 μm.
Further, a method for preparing a porous ultrathin grinding wheel for cutting a chip comprises the following steps:
(1) preparing materials: firstly, accurately weighing Ti powder, Al powder and super-hard abrasive micro powder, putting the Ti powder, the Al powder and the super-hard abrasive micro powder into a three-dimensional vortex mixer for material mixing for 3-5 hours, and then sieving the materials by a 100-200-mesh sieve; adding glue water according to the mass ratio of 5-15% of the mixed material, stirring and mixing until no large caking exists, and then putting the mixture into a drying box for 8-10 hours; finally, the dried material is screened by a 100-200-mesh screen;
(2) cold press molding: putting the prepared material into a mold, using a scraper matched with the shape of the mold to rotationally scrape the material evenly, then placing an upper mold for cold pressing, wherein the pressure is 250-500 Mpa, the pressure maintaining time is 30-60 seconds, and the cold pressing times are 1-3 times respectively for the upper surface and the lower surface, so that a cold pressing cutter blank is obtained;
(3) sintering and forming: sintering the cold-pressed cutter blank in a vacuum furnace, wherein the sintering molding comprises two sintering processes of pore forming and property adjustment, and the vacuum degree in the sintering process is less than 1 x 10 -2 pa, sintering conditions of 600-700 ℃ and 10-240 min in the pore forming process, and sintering conditions of 750-1100 ℃ and 5-120 min in the performance adjusting process; finally, cooling along with the furnace to obtain a sintered formed cutter blank;
(4) and (3) machining: and machining the cutter blank obtained by sintering and forming to the required ultrathin grinding wheel according to the size requirement.
The invention has the following advantages:
the sintering temperature of the pore-forming process is 600-700 ℃, the principle mechanism is that the interface movement and pore formation between elements are generated by utilizing the difference of diffusion rate between Ti/Al elements near 660 ℃ (liquidus of Al) where the Kirkinjal effect reaction between Ti/Al elements is most severe; the performance adjustment sintering temperature is 750-1100 ℃, and the temperature is above the sintering temperature of Ti element and the superhard abrasive material which are fully diffused mutually and below the sintering temperature of the superhard abrasive material which is seriously thermally damaged.
In a word, Ti-Al-based high-strength alloy is selected as a bonding agent of the metal ultrathin grinding wheel, chemical bonding is realized by utilizing interdiffusion of Ti element and superhard abrasive, so that the holding force of abrasive particles is improved, the bottleneck problem that the ultrathin grinding wheel cannot be thinned further is solved, and the thickness of the ultrathin grinding wheel can be as low as 0.08 mm; on the other hand, the porosity of the ultrathin grinding wheel can reach 25% -35%, namely, a porous structure is introduced by utilizing the Kenkard effect among Ti/Al elements to improve the self-sharpening capability of the ultrathin grinding wheel so as to improve the scribing quality of a chip, and materials such as pore-forming agents do not need to be added so as to reduce the production cost.
[ description of the drawings ]
The invention will be further described with reference to the following examples with reference to the accompanying drawings.
FIG. 1 is a graph of porosity and pore morphology of an ultra-thin grinding wheel prepared in example 2 of the present invention;
fig. 2 is a profile diagram of the ultra-thin grinding wheel prepared in embodiment 2 of the present invention after dicing.
[ detailed description ] embodiments
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings and the detailed description. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
Example 1
A method for preparing a porous ultrathin grinding wheel for cutting a chip comprises the steps that the ultrathin grinding wheel consists of a superhard grinding material and a metal matrix, and the ultrathin grinding wheel is of a porous structure; the super-hard abrasive is diamond, the volume content ratio of the super-hard abrasive in the ultra-thin grinding wheel is 50%, and the grain size of the abrasive is 3-5 microns; the metal matrix body is a Ti-Al-based alloy, the mass content ratio of metal Al in the Ti-Al-based alloy is 10%, the content of metal Ti is the balance, and the particle size of metal Al and metal Ti powder is 3-5 mu m;
the preparation method comprises the following specific steps:
(1) preparing materials: firstly, accurately weighing Ti powder, Al powder and diamond micro powder, putting the Ti powder, the Al powder and the diamond micro powder into a three-dimensional vortex mixer for material mixing for 4 hours, and then sieving the materials by a 200-mesh sieve; adding phenolic resin glue according to the mass ratio of 12%, stirring and mixing until no large caking exists, and then putting the mixture into a drying oven for 10 hours; finally, the dried material is screened by a 140-mesh screen;
(2) cold press molding: putting the prepared material into a die, using a scraper matched with the shape of the die to rotate and strickle the material evenly, and then placing an upper die for cold pressing, wherein the pressure is 300Mpa, the pressure maintaining time is 30 seconds, and the cold pressing times are 2 times respectively for the upper surface and the lower surface, so that a cold pressing knife blank is obtained;
(3) sintering and forming: sintering the cold-pressed knife blank in a vacuum furnace, wherein the sintering molding comprises two sintering processes of pore forming and performance adjustment, the sintering conditions of the pore forming process are 650 ℃ and 80min, the sintering conditions of the performance adjustment process are 750 ℃ and 60min, and the vacuum degree in the sintering process is less than 1 x 10 -2 pa; finally, cooling along with the furnace to obtain a sintered formed cutter blank;
(4) and (3) machining: and machining the sintered and molded cutter blank to an ultrathin grinding wheel with the thickness of 0.08mm according to the size requirement.
The porosity of the ultrathin grinding wheel prepared in this example is: 31.69 +/-0.59%;
the ultra-thin grinding wheel prepared in this embodiment has a shape after cutting: the appearance of the surface of the machined tool is observed, and a large amount of abrasive particles are not separated, which indicates that the alloy has better abrasive particle holding force on the abrasive.
Example 2
A method for preparing a porous ultrathin grinding wheel tool for cutting a chip is disclosed, wherein the ultrathin grinding wheel consists of a superhard grinding material and a metal matrix tire body, and the ultrathin grinding wheel is of a porous structure; the super-hard abrasive is diamond, the volume content ratio of the super-hard abrasive to the ultra-thin grinding wheel is 25%, and the grain size of the abrasive is 9-12 microns; the metal matrix body is a Ti-Al-based alloy, the mass content ratio of metal Al in the Ti-Al-based alloy is 15%, the content of metal Ti is the balance, and the particle size of powder of the metal Al and the metal Ti is 4-6 mu m;
the preparation method comprises the following specific steps:
(1) preparing materials: firstly, accurately weighing Ti powder, Al powder and diamond micro powder, putting the Ti powder, the Al powder and the diamond micro powder into a three-dimensional vortex mixer for material mixing for 4 hours, and then sieving the materials by a 100-mesh sieve; then adding phenolic resin glue according to the mass ratio of 10%, stirring and mixing until no large caking exists, and then putting the mixture into a drying oven for 10 hours; finally, the dried material is screened by a 100-mesh screen;
(2) cold press molding: putting the prepared material into a die, using a scraper matched with the shape of the die to rotate and strickle the material evenly, and then placing an upper die for cold pressing, wherein the pressure is 250Mpa, the pressure maintaining time is 40 seconds, and the cold pressing times are 2 times respectively for the upper surface and the lower surface, so that a cold pressing knife blank is obtained;
(3) sintering and forming: sintering the cold-pressed knife blank in a vacuum furnace, wherein the sintering molding comprises two sintering processes of pore forming and performance adjustment, the sintering conditions of the pore forming process are 650 ℃ and 60min, the sintering conditions of the performance adjustment process are 850 ℃ and 60min, and the vacuum degree in the sintering process is less than 1 x 10 -2 pa; finally, cooling along with the furnace to obtain a sintered formed cutter blank;
(4) and (3) machining: and machining the sintered and molded cutter blank to an ultrathin grinding wheel with the thickness of 0.08mm according to the size requirement.
Referring to fig. 1, the porosity and the pore morphology of the ultra-thin grinding wheel prepared in the embodiment are that the porosity of the ultra-thin grinding wheel is 30.11 ± 0.6%;
referring to fig. 2, the ultra-thin grinding wheel prepared in this embodiment has a post-dicing morphology: the appearance of the surface of the machined tool is observed, and a large amount of abrasive particles are not separated, which indicates that the alloy has better abrasive particle holding force on the abrasive.
Example 3
A method for preparing a porous ultrathin grinding wheel tool for cutting a chip comprises the steps that the ultrathin grinding wheel consists of a superhard grinding material and a metal matrix, and the ultrathin grinding wheel is of a porous structure; the superhard grinding material is cubic boron nitride, the volume content ratio of the superhard grinding material in the ultrathin grinding wheel is 25%, and the grain size of the grinding material is 19-21 mu m; the metal matrix body is a Ti-Al-based alloy, the mass content ratio of metal Al in the Ti-Al-based alloy is 20%, the content of metal Ti is the balance, and the particle size of powder of the metal Al and the metal Ti is 8-10 mu m;
the preparation method comprises the following specific steps:
(1) preparing materials: firstly, accurately weighing Ti powder, Al powder and cubic boron nitride micro powder, putting the materials into a three-dimensional vortex mixer for mixing for 3 hours, and then sieving the materials by a 100-mesh sieve; then adding 13% of epoxy resin glue by mass, stirring and mixing until no large caking exists, and then putting the mixture into a drying oven for 10 hours; finally, the dried material is screened by a 100-mesh screen;
(2) cold press molding: putting the prepared material into a mold, using a scraper matched with the shape of the mold to rotate, strickling and evenly scraping, and then placing the upper mold for cold pressing, wherein the pressure is 350Mpa, the pressure maintaining time is 30 seconds, and the cold pressing times are 2 times respectively for the upper surface and the lower surface, so that a cold pressing knife blank is obtained;
(3) sintering and forming: sintering the cold pressing cutter blank in a vacuum furnace, wherein the sintering molding comprises two sintering processes of pore forming and performance adjustment, the sintering conditions of the pore forming process are 700 ℃ and 30min, the sintering conditions of the performance adjustment process are 900 ℃ and 80min, and the vacuum degree in the sintering process is less than 1 x 10 -2 pa; finally, cooling along with the furnace to obtain a sintered formed cutter blank;
(4) and (3) machining: and machining the sintered and molded cutter blank into an ultrathin grinding wheel with the thickness of 0.2mm according to the size requirement.
The porosity of the ultrathin grinding wheel prepared in this example is: 30.89 +/-0.88%;
the experimental process of the abrasive grain holding force of the ultrathin grinding wheel prepared in the embodiment comprises the following steps: the appearance of the surface of the machined tool is observed, and a large amount of abrasive particles are not separated, which indicates that the alloy has better abrasive particle holding force on the abrasive.
In conclusion, the sintering temperature of the pore-forming process is 600-700 ℃, the principle mechanism is that the interface movement and pore formation between elements are generated by utilizing the difference of diffusion rates between Ti/Al elements near 660 ℃ (liquidus of Al) where the Kirkinjal effect reaction between Ti/Al elements is most severe; the performance adjustment sintering temperature is 750-1100 ℃, and the temperature is above the sintering temperature of Ti element and the superhard abrasive material which are fully diffused mutually and below the sintering temperature of the superhard abrasive material which is seriously thermally damaged.
In a word, the Ti-Al-based high-strength alloy is selected as the bonding agent of the metal ultrathin grinding wheel, and chemical bonding is realized by utilizing interdiffusion of Ti element and superhard grinding material, so that the holding force of abrasive particles is improved, the bottleneck problem that the ultrathin grinding wheel cannot be thinned further is solved, and the thickness of the ultrathin grinding wheel can be as low as 0.08 mm; on the other hand, the porosity of the ultrathin grinding wheel can reach 25% -35%, namely, a porous structure is introduced by utilizing the Kenkard effect among Ti/Al elements to improve the self-sharpening capability of the ultrathin grinding wheel so as to improve the scribing quality of a chip, and materials such as pore-forming agents do not need to be added so as to reduce the production cost.
Although specific embodiments of the invention have been described above, it will be understood by those skilled in the art that the specific embodiments described are illustrative only and are not limiting upon the scope of the invention, and that equivalent modifications and variations can be made by those skilled in the art without departing from the spirit of the invention, which is to be limited only by the appended claims.
Claims (3)
1. A porous ultrathin grinding wheel for cutting a chip is composed of a superhard grinding material and a metal matrix, wherein the ultrathin grinding wheel is of a porous structure; the super-hard abrasive is diamond, the volume content ratio of the super-hard abrasive in the ultra-thin grinding wheel is 50%, and the grain size of the abrasive is 3-5 microns; the metal matrix body is a Ti-Al-based alloy, the mass content ratio of metal Al in the Ti-Al-based alloy is 10%, the content of metal Ti is the balance, and the particle size of powder of the metal Al and the metal Ti is 3-5 mu m;
the preparation method comprises the following specific steps:
(1) preparing materials: firstly, accurately weighing Ti powder, Al powder and diamond micro powder, putting the Ti powder, the Al powder and the diamond micro powder into a three-dimensional vortex mixer for material mixing for 4 hours, and then sieving the materials by a 200-mesh sieve; adding phenolic resin glue according to the mass ratio of 12%, stirring and mixing until no large caking exists, and then putting the mixture into a drying oven for 10 hours; finally, the dried material is screened by a 140-mesh screen;
(2) cold press molding: putting the prepared material into a die, using a scraper matched with the shape of the die to rotate and strickle the material evenly, and then placing an upper die for cold pressing, wherein the pressure is 300Mpa, the pressure maintaining time is 30 seconds, and the cold pressing times are 2 times respectively for the upper surface and the lower surface, so that a cold pressing knife blank is obtained;
(3) sintering and forming: sintering the cold-pressed knife blank in a vacuum furnace, wherein the sintering molding comprises two sintering processes of pore forming and performance adjustment, the sintering conditions of the pore forming process are 650 ℃ and 80min, the sintering conditions of the performance adjustment process are 750 ℃ and 60min, and the vacuum degree in the sintering process is less than 1 x 10 -2 pa; finally, the sintered forming cutter is obtained by furnace coolingBlank;
(4) and (3) machining: and machining the sintered and molded cutter blank to an ultrathin grinding wheel with the thickness of 0.08mm according to the size requirement.
2. The porous ultra-thin grinding wheel for dicing a chip according to claim 1, wherein: the porous structure is generated by utilizing a kirkendall effect reaction caused by a difference in diffusion rate between Ti/Al elements.
3. The method for preparing a porous ultra-thin grinding wheel for dicing a chip as claimed in any one of claims 1 to 2, wherein: the method comprises the following steps:
(1) preparing materials: firstly, accurately weighing Ti powder, Al powder and super-hard abrasive micro powder, putting the Ti powder, the Al powder and the super-hard abrasive micro powder into a three-dimensional vortex mixer for material mixing for 3-5 hours, and then sieving the materials by a 100-200-mesh sieve; adding glue water according to the mass ratio of 5-15% of the mixed material, stirring and mixing until no large caking exists, and then putting the mixture into a drying box for 8-10 hours; finally, the dried material is screened by a 100-200-mesh screen;
(2) cold press molding: putting the prepared material into a mold, using a scraper matched with the shape of the mold to rotationally scrape the material evenly, then placing an upper mold for cold pressing, wherein the pressure is 250-500 Mpa, the pressure maintaining time is 30-60 seconds, and the cold pressing times are 1-3 times respectively for the upper surface and the lower surface, so that a cold pressing cutter blank is obtained;
(3) sintering and forming: sintering the cold-pressed cutter blank in a vacuum furnace, wherein the sintering molding comprises two sintering processes of pore forming and property adjustment, and the vacuum degree in the sintering process is less than 1 x 10 -2 pa, wherein the sintering conditions of the pore-forming process are 600-700 ℃ and 10-240 min, and the sintering conditions of the performance adjusting process are 750-1100 ℃ and 5-120 min; finally, cooling along with the furnace to obtain a sintered formed cutter blank;
(4) and (3) machining: and machining the sintered and molded cutter blank to obtain the required ultrathin grinding wheel according to the size requirement.
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| CN114290012A (en) * | 2021-12-31 | 2022-04-08 | 南通华严磨片有限公司 | Preparation method of porous circular cutter with milling and grinding functions |
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