CN101758213A - Formula of diamond ultrathin blade for cutting PCB baseplate and manufacturing technique thereof - Google Patents
Formula of diamond ultrathin blade for cutting PCB baseplate and manufacturing technique thereof Download PDFInfo
- Publication number
- CN101758213A CN101758213A CN200910218576A CN200910218576A CN101758213A CN 101758213 A CN101758213 A CN 101758213A CN 200910218576 A CN200910218576 A CN 200910218576A CN 200910218576 A CN200910218576 A CN 200910218576A CN 101758213 A CN101758213 A CN 101758213A
- Authority
- CN
- China
- Prior art keywords
- blade
- diamond
- powder
- mould
- pcb substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention relates to a blade and a technique, in particular to the formula of a diamond ultrathin blade for cutting PCB baseplates and a manufacturing technique thereof. The invention is characterized in that the blade is made by mixing phenol resin adhesive and auxiliary metallic stuffing the proportioning sum of which is 100%, wherein the phenol resin adhesive accounts for 27%, and has a mean grain size of 0.46 mu m; the auxiliary metallic stuffing contains 6% of tungsten powder, 25% of zinc powder, 16% of ganister sand, 18% of cobalt powder and 8% of carbon soot; and diamond abrasive with the diamond content of 0.66G/CBM is added in and mixed with the auxiliary metallic stuffing and the adhesive according to the size of the blade. The manufacturing technique of the compound diamond blade has the following steps: 1) mixing; 2) filling mould and charging; 3) prepressing and hot pressing in a fixed mould; 4) unloading mould and hardening; 5) protecting atmosphere and cooling; 6) mechanically processing; 7) inspecting products; and 8) branding, packing and warehousing. The blade has little compatibility to steel materials, favorable cutting wettability, small friction with processed materials and long service life.
Description
Technical field
The present invention relates to a kind of blade and technology, particularly a kind of formula of diamond ultrathin blade and production technology that is used for the PCB substrate cut.
Background technology
The composite diamond section has characteristics such as good wearability, heat-resisting quantity, corrosion resistance, but has shortcomings such as intensity is lower, toughness deficiency simultaneously.Adding additive in composite diamond is the effective ways that improve diamond intensity and toughness, and the composite diamond section of adopting this method to produce has higher intensity, toughness and density.
The traditional handicraft method of making the composite diamond section is pressure sintering (HP), promptly under certain process conditions metal powder material is hot pressed into the pie sintered body, cuts into the shape that needs by line cutting or skive then, carries out sharpening by iso standard again.Though with this explained hereafter diamond chipping qualities is stable, compactness is good, crystal grain is tiny, have following shortcoming: 1. there is anisotropy in blade; 2. can not produce blade complex-shaped and with holes; 3. the production cycle long, production efficiency is low, the production cost height.
Summary of the invention
The formula of diamond ultrathin blade and the production technology that the purpose of this invention is to provide a kind of PCB of being used for substrate cut, this blade strength height, toughness and good compactness; The friction of blade and machined material is less, the blade long service life; And easily manufactured, production cost is low, the production efficiency height.
The production technology of the diamond ultrathin blade of a kind of PCB of the being used for substrate cut that the objective of the invention is to be achieved through the following technical solutions, it is characterized in that:, this section is that to add assistant metal filler sum by the phenolic resins bonding agent be that 100% proportioning is mixed, wherein the phenolic resins bonding agent is 27%,, average grain diameter is 0.46 μ m; Auxiliary packing tungsten powder 6%, zinc powder 25%, silica flour 16%, cobalt powder 18%, carbon black 8%, adding diamond content by the volume of blade size is that the 0.66G/CBM diamond abrasive mixes with assistant metal filler, bonding agent.
Described bortz powder average grain diameter is 0.46 μ m.
Described blade is a toroidal, and apparent size external diameter * internal diameter * thickness is ￠ 70 * 40 * 0.5, and unit is mm.
The technological process of production of this composite diamond section is: 1) mix; 2) the dress mould feeds intake; 3) precompressed and cover half hot pressing; 4) mould unloading sclerosis; 5) atmosphere protection cooling; 6) machining; 7) examination and test of products; 8) branding and packing warehouse-in.
The concrete processing step of described this diamond section is as follows:
1) mix:
A) according to above-mentioned weight percent proportioning with raw material: auxiliary condiment, Buddha's warrior attendant building stones mix; Then two kinds of raw materials are carried out ball milling → vibration → ball milling through ball mill, evenly add dispersant ethanol again powder is uniformly dispersed the bonding agent of the above-mentioned percentage by weight raw material after with ball milling is bonding again, 80 orders sieve, and compound is dried in vacuum tank;
B) mixing granulation: 1. the step a) powder is pressed into blocks in advance, uses 20 orders and 40 purpose sieve after smashing respectively, remove greater than 20 orders less than 40 purpose powders; 2. drum-type granulation forms with ball milling bucket and ball mill continuous rolling;
2) the dress mould feeds intake
Mixed raw material is packed in the prefabricated mould, coat the zinc stearate antitack agent, will expect to drop in the film chamber and stir evenly, wipe off;
3) precompressed and cover half hot pressing:
Above-mentioned raw material after granulation is suppressed by composite diamond section mould, be hot-pressed onto given size having on the press of heating plate then;
4) mould unloading sclerosis
Insulation finishes the hot demoulding, and the slow cooling of product blank is to room temperature; The sclerosis of air blast Electric heat oven;
5) atmosphere protection cooling:
Base substrate is warming up to 1200 ℃ under vacuum state, adds the argon shield of 2MPa; When being warming up to 1850 ℃ then, be incubated 30 minutes, add the argon gas of 8MPa again, cool off with stove; Its true temp is respectively 400 ℃ and 1200 ℃;
6) machining:
Carry out sharpening with resin bond wheel and by the blade of C18WC grinding fluid after to above-mentioned processing;
7) examination and test of products;
8) branding, packing warehouse-in.
Baking temperature is not higher than 80 ℃ in the described vacuum tank.
Described drum-type granulation continuous rolling 30～60 minutes.
Described precompressed press pressure is 300-600kg/cm
2Hot pressing temperature is 170-180 ℃, insulation 10-30min.
185 ℃ of sclerosis of described Electric heat oven 8h.
The invention has the beneficial effects as follows: because the main component of this composite diamond section is to add a certain proportion of various different components metal dusts in the diamond base-material, proportioning by its compound and manufacturing process make this blade strength height, toughness and good compactness; Product has excellent toughness and wearability, and the friction of blade and machined material is less, and long service life reduces production costs greatly, and ultra-thin edge of a knife cutting is sharp, improves cutting efficiency.
The specific embodiment
Below the present invention will be further described by specific embodiment, need to prove that following embodiment only is used to illustrate the present invention, but be not limited to practical range of the present invention.
Embodiment 1
This section is that to add assistant metal filler sum by the phenolic resins bonding agent be that 100% proportioning is mixed, and wherein the phenolic resins bonding agent is 27%,, average grain diameter is 0.46 μ m; Auxiliary packing tungsten powder 6%, zinc powder 25%, silica flour 16%, cobalt powder 18%, carbon black 8%, adding diamond content by the volume of blade size is that the 0.66G/CBM diamond abrasive mixes with assistant metal filler, bonding agent.
Described bortz powder average grain diameter is 0.46 μ m.
Described blade is a toroidal, and apparent size external diameter * internal diameter * thickness is ￠ 70 * 40 * 0.5, and unit is mm.Again according to the technological process of production of this composite diamond section: 1) mix; 2) the dress mould feeds intake; 3) precompressed and cover half hot pressing; 4) mould unloading sclerosis; 5) atmosphere protection cooling; 6) machining; 7) examination and test of products; 8) branding and packing warehouse-in.
Its manufacturing technology steps is as follows:
1) mix:
A) match well raw material and auxiliary packing according to above-mentioned weight percent, tungsten powder, copper powder, zinc powder, silica flour, carbon black, molybdenum powder, Buddha's warrior attendant building stones are mixed; Then two class raw materials are carried out ball milling → vibration → ball milling through ball mill, evenly add dispersant ethanol again powder is uniformly dispersed the bonding agent phenolic resins of the above-mentioned percentage by weight raw material after with ball milling is bonding again, 80 orders sieve, compound is dried in vacuum tank, and baking temperature is not higher than 80 ℃.
B) mixing granulation: 1. the step a) powder is pressed into blocks in advance, uses 20 orders and 40 purpose sieve after smashing respectively, remove greater than 20 orders less than 40 purpose powders; 2. drum-type granulation forms through 60 minutes continuous rollings with ball milling bucket and ball mill;
2) the dress mould feeds intake
Mixed raw material is packed in the prefabricated mould, coat the zinc stearate antitack agent, will expect to drop in the film chamber and stir evenly, wipe off; Wherein, the mould selection is mainly high-carbon steel, alloy tool steel or heat resisting steel.
3) precompressed and cover half hot pressing:
Above-mentioned raw material after granulation is suppressed by composite diamond section mould, be pressed in advance on the press of regulation tonnage and be pressed, pressure is 600kg/cm
2Having on the press of heating plate, be hot-pressed onto given size then, temperature is 180 ℃, and temperature retention time is generally 30min because of the product size size is different.
4) mould unloading sclerosis
Insulation finishes to get final product the hot demoulding, and the slow cooling of product blank is to room temperature.Carry out hardening process then, thereby the internal stress that produces when eliminating moulding and carries out fully the hardening of resin reaction, hardening process by air blast Electric heat oven equipment in 185 ℃, temperature retention time: 8h.Strict control is wanted in intensification and cooling rate, in order to avoid cause the product distortion.
5) atmosphere protection cooling:
Base substrate is warming up to 1200 ℃ under vacuum state, adds the argon shield of 2MPa; When being warming up to 1850 ℃ then, be incubated 30 minutes, add the argon gas of 8MPa again, cool off with stove; Its true temp is respectively 400 ℃ and 1200 ℃;
6) machining:
Carry out sharpening with resin bond wheel and by the blade of C18WC grinding fluid after to above-mentioned processing, apparent size apparent size ￠ 50 * 40 * 0.1mm (external diameter * internal diameter * thickness) of machining mainly is the machining of endoporus, cylindrical and end face, size, form and position tolerance and the outward appearance etc. that must reach client or GB regulation require and pass through to check affirmation, and provide Certificate of Compliance.
7) examination and test of products;
8) branding; The packing warehouse-in.
Technological principle of the present invention is as follows:
The powder situation
Described bortz powder average grain diameter is 0.46 μ m, and density is 0.66g/cm
3(diamond abrasive content: 0.88G/CBM)
Mix
The purpose of this operation is to make the full and uniform mixing of various raw materials.The powder treatment process is: ball milling → vibration → ball milling.Ball milling+vibration total time should be controlled at about 72 hours, and is too short as the time, can cause powder undercompounding; As overlong time, can cause that agglomeration etc. appears in ball-milling medium.Adopt alcohol as dispersant, powder is uniformly dispersed and helps oven dry.Application 80 mesh sieve sieve before it should be noted that the slurry oven dry, and the impurity that produces in the mechanical milling process is filtered.In addition, metal-powder should place in the airtight container, avoids the moisture absorption, and the holding time preferably is no more than 3 months.The oven dry of compound should be carried out in vacuum tank, and baking temperature should not be higher than 80 ℃, so that alcohol reclaims and prevent the bonding agent volatilization.
The composite diamond section is a Main Ingredients and Appearance with the diamond dust, auxiliary packing mainly contains Cu, ZnO, SiC, carbon black, in order to adapt to the requirement of different cutting object and cutting process method, can finish by adjusting methods such as composition, proportioning, pressed density, hot pressing system.Choose the resin and the auxiliary material powder that meet technical conditions, after calculating according to proportioning, with electronic balance or the accurate weighing of counter balance, a small amount of bond can be in mortar manual mixing even, measure and must mix with machine when big, as the three-dimensional eddy current batch mixer.
After bond has been prepared, generally need to check following project:
(1) sample examination, whether composition, ratio be correct;
(2) get material and be placed on the plate glass, flatten, have or not the color spot of color and luster inequality in the microscopic examination material with leveling ruler.Preferably existing the mixing now of bond used.Otherwise in the port grinding bottle of packing into, and bottle is placed in the drier preserves.
According to product purpose, generally select the diamond of models such as RVD for use, granularity as 325/400, W40, W28 etc., mainly be to require to select according to working (machining) efficiency and crudy, concentration is defined as: the shared volume ratio of diamond is 25% in the abrasive material, and diamond content is 0.88g/cm
3, be defined as 100% concentration.Other concentration calculate as benchmark, and finally calculate adamantine interpolation quality, and generally life-span and the efficient according to product requires to determine concentration.Concentration commonly used has: 50%, 75%, 100%, 125% etc.
The mould selection is mainly high-carbon steel, alloy tool steel or heat resisting steel.Processing, arrangement mould, trial assembly is coated the zinc stearate antitack agent after confirming, will expect to drop in the film chamber to stir evenly, wipe off.Be pressed in advance on the press of regulation tonnage and be pressed, general pressure is 300-600kg/cm
2Having on the press of heating plate, be hot-pressed onto given size then, temperature is 170-180 ℃, and temperature retention time is generally 10-30min because of the product size size is different.Insulation finishes to get final product the hot demoulding, and the slow cooling of product blank is to room temperature.The internal stress that produces when eliminating moulding, and make the hardening of resin reaction carry out need carrying out hardening process fully, major parameter is: temperature: 185 ℃, and temperature retention time: 8h.Equipment is the air blast Electric heat oven.Strict control is wanted in intensification and cooling rate, in order to avoid cause the product distortion.
The dress mould feeds intake
The dry powder suppression process of composite diamond section is all very high to the granulation requirement of morphology microstructure, powder surface charge condition and mixed powder, so the pressing process difficulty is bigger.Low excessively as green density, be difficult to reach required density behind the sintering, simultaneously base substrate shrank conference and caused Sharpening a knife blade surplus deficiency behind the sintering; Too high as green density, then can cause the recessive crackle (these crackles are difficult to detect before the sintering) of base substrate inside.Add bonding agent and can improve suppression performance, but bonding agent too much can increase the blade hole, blade capabilities is descended; Bonding agent deficiency or Mold Making precision not Gao Zehui cause the base substrate lamination.For reducing the compacting defective, can when mfg. moulding die, increase pattern draft.
Precompressed and cover half hot pressing:
The precompressed and the cover half heat pressing process of composite diamond section are similar to traditional hard alloy cutter production technology.PEG (polyethylene glycol) temperature that the present invention adopts is controlled at 400 ℃.Should near its volatilization point temperature, be incubated the long period according to the characteristics of PEG when precompressed and cover half hot pressing.For preventing to enter vavuum pump after the PEG gasification, influence the serviceability of vavuum pump, can before pump, increase condensation PEG retracting device.In precompressed and cover half hot pressing, should note taking precautions against fortuitous events such as unexpected power failure, prevent that cold air from entering, otherwise can cause blade oxidation or pulverizing.Should compare with the base substrate weight before precompressed and the cover half hot pressing after precompressed and the cover half hot pressing, to determine whether emptying of PEG.Base substrate after precompressed and the cover half hot pressing is sintering in time, places the long period as need, then should guard against damp.
The mould unloading cure process
The mould unloading hardening process adopts gas-protecting sintering (GPS)+high temperature insostatic pressing (HIP) (HIP) treatment technology.The GPS sintering is that base substrate is warming up to 1200 ℃ under vacuum state, adds the argon shield of 2MPa; When being warming up to 1850 ℃ then, be incubated 30 minutes, add the argon gas of 8MPa again, cool off with stove.During sintering, the height of vacuum directly influences the eliminating of base substrate moisture, and the height of true temp then can influence hardness and the intensity behind the blade sintering.Process data shows: its HV hardness of blade that adopts true temp to be respectively the process program sintering of 400 ℃ and 1200 ℃ differs about 0.5GPa, and intensity differs more than the 50MPa.Blank density behind the GPS sintering should be controlled at 93%～98% of solid density.If continue to heat up or prolong temperature retention time, though can improve blank density, blank strength can sharply descend.Behind blank density＞93%, open pore is eliminated substantially, and sintering power is obviously not enough, heats up this moment or prolongs temperature retention time crystal grain is increased, thereby eliminate closed pore, increases blank density.When adopting GPS method sintering blade, if sintering protection air pressure＜20MPa (the protection air pressure of general GPS sintering furnace all is lower than 20MPa) does not then have obvious difference with low pressure (2MPa) sintering effect.In sintering process, adopt argon shield, can prevent that on the one hand TiCN from decomposing, can guarantee the uniformity (because the argon gas in the stove also can be used as heat transfer medium) of temperature in the kiln on the other hand.
Technique for hardening treatment application wide (comprise high temperature alloy, carbide alloy, pottery, synthetic material, diffusion bonding, foundry goods is densified and welding etc.), but because apparatus expensive, technical sophistication, it is bigger therefore to apply difficulty at home.Adopt the manufacturing of mould unloading technique for hardening treatment that the blade quality is increased substantially, kept the cold presswork method can make complex-shaped or with holes composite diamond section and production efficiency simultaneously than characteristics such as height.
Because technique for hardening treatment has relatively high expectations to sheath material and operating technology, the product and the production efficiency that therefore are generally used for making simple shape are lower.The composite diamond section that utilizes hardening furnace to handle through the GPS sintering does not then need jacket, this is because when blade blank density＞93%, open pore is eliminated fully, can form jacket naturally in billet surface, so the blade base substrate can not add any capsule device and directly places in the hardening furnace and handle.In processing procedure, as pressure medium, pressurization 150MPa is warming up to 1760 ℃, is incubated 1 hour, cools off with stove with argon gas.After cure process, the blade blank density can reach more than 99% of solid density, and blank strength can increase by 50～200MPa on the basis of GPS sintering, and the blade microhardness can improve 0.5～1GPa.The performance comparison of composite diamond section sees Table 1 (data are the mean value of one group of 12 test specimen in the table) before and after the cure process.
After cure process, the microstructure of composite diamond section can not change substantially, this is that crystal grain is grown owing to temperature is lower better, so the overall performance of blade significantly improves because the closed pore of blade base substrate is eliminated under high pressure (150MPa) by force.
Composite diamond section density＞99.2% of the present invention, hardness HV＞20.5GPa, toughness K
Ic＞5.5MPam
1/2, three-point bending resistance intensity＞700MPa.The SEM photo of blade microstructure as shown in Figure 3, TiCN is disperse in the material structure
Distribute the about 2 μ m of average grain size.Table 2 has been listed the performance indications of several typical diamond blades.
Machining:
Carry out sharpening with the blade of resin bond wheel after, by the C18WC grinding fluid to above-mentioned processing.Machining mainly is the machining of endoporus, cylindrical and end face, and size, form and position tolerance and the outward appearance etc. that must reach client or GB regulation requires and confirm by check.
The mechanical processing quality of composite diamond section is very big to the influence of cutter serviceability, should note following problem in blade machinery manufacturing procedure:
1) selection of emery wheel
The sharpening of composite diamond section should be selected resin bond wheel for use.Though the self-sharpening of resin bond wheel is relatively poor, sharpening efficiency is lower, can not destroy blade strength; Though and the metal bonded wheel self-sharpening is good, sharpening efficiency is high, can reduce by the intensity of sharpening blade, promptly emery wheel is got over " soft ", and the surface quality of sharpening blade is good more.The abrasive grain of skive is thin more, and grinding efficiency is low more, but the blade blemish is few more; Abrasive grain is thick more, and grinding efficiency is high more, but the blade blemish is also many more.For taking into account grinding efficiency and surface quality, can when corase grind, select the thicker emery wheel of granularity for use, reserve very little allowance; Then select the thinner emery wheel of granularity during correct grinding for use.The selection of grinding wheel shape is also very important, should adopt flat-faced wheel as far as possible, and the blade face quality of flaring cup wheel and saucer wheel processing is poor slightly.
2) grinding fluid selects for use
The sharpening difficulty of composite diamond section is bigger, and is also higher to the requirement of grinding fluid.The effect of grinding fluid also will be bonded at wheel face by timely cleaning, have the self-sharpening that guarantees emery wheel than the composite diamond section abrasive dust of big viscosity except that cooling.The C18WC grinding fluid effect of U.S. Master chemical company is better, and as adding cleaning agent simultaneously in this grinding fluid, effect can further improve.
The sharpening of the negative chamfered edge of blade requires: the negative chamfered edge of different processing occasions, workpiece material and cutting parameter blade has different requirements.The mode of negative chamfered edge mainly contains single chamfered edge and combination chamfered edge.Generally speaking, require to guarantee the uniformity of negative chamfered edge angle of blade and width.For reducing the initial wear of blade, on negative chamfered edge basis, can increase " passivation " operation.
Check
Composite diamond section for different batches, different time are produced except that its performance indications of monitoring, also should try cutter, with the cutting ability of check blade before dispatching from the factory.The examination cutter is generally finished on the lathe of factory.
Branding: the lot number and the brand that stamp production as requested again on the blade.
Claims (9)
1. formula of diamond ultrathin blade that is used for the PCB substrate cut is characterized in that: this section is that to add assistant metal filler sum by the phenolic resins bonding agent be that 100% proportioning is mixed, and wherein the phenolic resins bonding agent is 27%,, average grain diameter is 0.46 μ m; Auxiliary packing tungsten powder 6%, zinc powder 25%, silica flour 16%, cobalt powder 18%, carbon black 8%, adding diamond content by the volume of blade size is that the 0.66G/CBM diamond abrasive mixes with assistant metal filler, bonding agent.
2. a kind of formula of diamond ultrathin blade that is used for the PCB substrate cut according to claim 1 is characterized in that: described bortz powder average grain diameter is 0.46 μ m.
3. a kind of formula of diamond ultrathin blade that is used for the PCB substrate cut according to claim 1, it is characterized in that: described blade is a toroidal, and apparent size external diameter x internal diameter x thickness is ￠ 70 * 40 * 0.5, and unit is mm.
4. production technology that is used for the diamond ultrathin blade of PCB substrate cut is characterized in that: the technological process of production of above-mentioned composite diamond section is: 1) mix; 2) the dress mould feeds intake; 3) precompressed and cover half hot pressing; 4) mould unloading sclerosis; 5) atmosphere protection cooling; 6) machining; 7) examination and test of products; 8) branding and packing warehouse-in.
5. a kind of production technology that is used for the diamond ultrathin blade of PCB substrate cut according to claim 4 is characterized in that: the concrete processing step of described this diamond section is as follows:
1) mix:
A) according to above-mentioned weight percent proportioning with raw material: auxiliary condiment, Buddha's warrior attendant building stones mix; Then two kinds of raw materials are carried out 1 through ball mill) ball milling, 2) vibration, 3) ball milling, evenly add dispersant ethanol again powder is uniformly dispersed the bonding agent of the above-mentioned percentage by weight raw material after with ball milling is bonding again, 80 orders sieve, and compound is dried in vacuum tank;
B) mixing granulation: 1. the step a) powder is pressed into blocks in advance, uses 20 orders and 40 purpose sieve after smashing respectively, remove greater than 20 orders less than 40 purpose powders; 2. drum-type granulation forms with ball milling bucket and ball mill continuous rolling;
2) the dress mould feeds intake
Mixed raw material is packed in the prefabricated mould, coat the zinc stearate antitack agent, will expect to drop in the film chamber and stir evenly, wipe off;
3) precompressed and cover half hot pressing:
Above-mentioned raw material after granulation is suppressed by composite diamond section mould, be hot-pressed onto given size having on the press of heating plate then;
4) mould unloading sclerosis
Insulation finishes the hot demoulding, and the slow cooling of product blank is to room temperature; The sclerosis of air blast Electric heat oven;
5) atmosphere protection cooling:
Base substrate is warming up to 1200 ℃ under vacuum state, adds the argon shield of 2MPa; When being warming up to 1850 ℃ then, be incubated 30 minutes, add the argon gas of 8MPa again, cool off with stove; Its true temp is respectively 400 ℃ and 1200 ℃;
6) machining:
Carry out sharpening with resin bond wheel and by the blade of C18WC grinding fluid after to above-mentioned processing;
7) examination and test of products;
8) branding packing warehouse-in.
6. a kind of production technology that is used for the diamond ultrathin blade of PCB substrate cut according to claim 5 is characterized in that: baking temperature is not higher than 80 ℃ in the described vacuum tank.
7. a kind of production technology that is used for the diamond ultrathin blade of PCB substrate cut according to claim 5 is characterized in that: described drum-type granulation continuous rolling 30～60 minutes.
8. a kind of production technology that is used for the diamond ultrathin blade of PCB substrate cut according to claim 5 is characterized in that: described precompressed press pressure is 300-600kg/cm
2Hot pressing temperature is 170-180 ℃, insulation 10-30min.
9. a kind of production technology that is used for the diamond ultrathin blade of PCB substrate cut according to claim 5 is characterized in that: 185 ℃ of sclerosis of described Electric heat oven 8h.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910218576A CN101758213A (en) | 2009-10-30 | 2009-10-30 | Formula of diamond ultrathin blade for cutting PCB baseplate and manufacturing technique thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910218576A CN101758213A (en) | 2009-10-30 | 2009-10-30 | Formula of diamond ultrathin blade for cutting PCB baseplate and manufacturing technique thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101758213A true CN101758213A (en) | 2010-06-30 |
Family
ID=42489685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910218576A Pending CN101758213A (en) | 2009-10-30 | 2009-10-30 | Formula of diamond ultrathin blade for cutting PCB baseplate and manufacturing technique thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101758213A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103223525A (en) * | 2013-05-03 | 2013-07-31 | 鲁启华 | Ultrathin blade for cutting |
| CN106077669A (en) * | 2016-06-16 | 2016-11-09 | 河南黄河旋风股份有限公司 | Dimond synneusis sheet and matrix synchronize the manufacture method of the sintered sheets expanded |
-
2009
- 2009-10-30 CN CN200910218576A patent/CN101758213A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103223525A (en) * | 2013-05-03 | 2013-07-31 | 鲁启华 | Ultrathin blade for cutting |
| CN103223525B (en) * | 2013-05-03 | 2016-01-20 | 鲁启华 | A kind of cutting Ultrathin blade |
| CN106077669A (en) * | 2016-06-16 | 2016-11-09 | 河南黄河旋风股份有限公司 | Dimond synneusis sheet and matrix synchronize the manufacture method of the sintered sheets expanded |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101695822A (en) | Formula of diamond super-thin cutting disc for cutting of magnetic materials and production technology thereof | |
| CN110355699A (en) | A kind of aluminium base diamond composite ELID grinding wheel for grinding and preparation method thereof | |
| CN106007730A (en) | Method using coating cubic boron nitride to prepare polycrystalline cubic boron nitride | |
| CN101695823A (en) | Formula of diamond super-thin cutting disc for wafer cutting and production technology thereof | |
| CN113234950B (en) | Preparation method of Ti (C, N) -based metal ceramic | |
| CN101758465A (en) | Prescription and production process of diamond ultrathin slice for sapphire and crystal cutting | |
| CN105798307B (en) | Based on the cutting of IC package device laminated metallic base diamond saw blade and manufacture method | |
| CN101758442A (en) | Formula of diamond ultrathin blade for cutting QFN baseplate and manufacturing technique thereof | |
| CN101758214A (en) | Prescription and production process of diamond ultrathin slice for ferrite cutting | |
| CN114380611B (en) | Method for manufacturing reaction sintering silicon carbide ceramic grinding disc | |
| CN101758212A (en) | Prescription and production process of diamond ultrathin slice for hard alloy cutting | |
| CN101862827A (en) | Formula and production process of diamond ultrathin cutting blade for cutting quartz glass | |
| CN103387394A (en) | Preparation method of high-precision ceramic ball | |
| CN101698290A (en) | Diamond ultrathin section formula used for sectioning ceramics and production process | |
| CN101758443A (en) | Prescription and production process of diamond ultrathin slice for ceramic substrate cutting | |
| CN101844331A (en) | Formula and production process for diamond ultra-thin slice used for cutting optical flat glass | |
| CN101862828A (en) | Formula of diamond ultrathin section for glass cutting and production process | |
| CN108277413A (en) | A kind of 3D glass heats bender high temperature resistant soaking plate and its manufacturing process | |
| CN101758213A (en) | Formula of diamond ultrathin blade for cutting PCB baseplate and manufacturing technique thereof | |
| CN101758217A (en) | Formula and production process of diamond ultrathin slice for crystal glass cutting | |
| CN101700643A (en) | Formula of diamond ultrathin slice used for cutting carborundum product and production process | |
| CN101862985A (en) | Formula and production technology for diamond ultrathin blade for cutting quenched materials | |
| CN110509192B (en) | Metal glass bonding agent and preparation method thereof, grinding wheel and preparation method and application thereof | |
| CN111778436A (en) | Method for preparing WC-Y2O3 binderless hard alloy by cold pressing-hot pressing sintering | |
| CN101758441A (en) | Formula of diamond ultrathin blade for cutting semiconductor material and manufacturing technique thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100630 |