JPH0587971B2 - - Google Patents

Info

Publication number
JPH0587971B2
JPH0587971B2 JP5179185A JP5179185A JPH0587971B2 JP H0587971 B2 JPH0587971 B2 JP H0587971B2 JP 5179185 A JP5179185 A JP 5179185A JP 5179185 A JP5179185 A JP 5179185A JP H0587971 B2 JPH0587971 B2 JP H0587971B2
Authority
JP
Japan
Prior art keywords
waste gas
gas decomposition
decomposition device
meandering
heated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP5179185A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61210619A (ja
Inventor
Kazumi Kasai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP5179185A priority Critical patent/JPS61210619A/ja
Publication of JPS61210619A publication Critical patent/JPS61210619A/ja
Publication of JPH0587971B2 publication Critical patent/JPH0587971B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
JP5179185A 1985-03-14 1985-03-14 廃ガス分解装置 Granted JPS61210619A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5179185A JPS61210619A (ja) 1985-03-14 1985-03-14 廃ガス分解装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5179185A JPS61210619A (ja) 1985-03-14 1985-03-14 廃ガス分解装置

Publications (2)

Publication Number Publication Date
JPS61210619A JPS61210619A (ja) 1986-09-18
JPH0587971B2 true JPH0587971B2 (cs) 1993-12-20

Family

ID=12896761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5179185A Granted JPS61210619A (ja) 1985-03-14 1985-03-14 廃ガス分解装置

Country Status (1)

Country Link
JP (1) JPS61210619A (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2739940B2 (ja) * 1987-08-24 1998-04-15 株式会社東芝 未反応ガス処理装置
CN110709974B (zh) * 2017-05-19 2023-08-01 应用材料公司 用于将液体和固体流出物收集并随后反应成气体流出物的设备

Also Published As

Publication number Publication date
JPS61210619A (ja) 1986-09-18

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees