JPH0584211B2 - - Google Patents
Info
- Publication number
- JPH0584211B2 JPH0584211B2 JP61051065A JP5106586A JPH0584211B2 JP H0584211 B2 JPH0584211 B2 JP H0584211B2 JP 61051065 A JP61051065 A JP 61051065A JP 5106586 A JP5106586 A JP 5106586A JP H0584211 B2 JPH0584211 B2 JP H0584211B2
- Authority
- JP
- Japan
- Prior art keywords
- prepreg
- tables
- prepregs
- supply
- construction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010276 construction Methods 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 description 8
- 239000000843 powder Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61051065A JPS62207631A (ja) | 1986-03-07 | 1986-03-07 | プリプレグの構成方法及び構成装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61051065A JPS62207631A (ja) | 1986-03-07 | 1986-03-07 | プリプレグの構成方法及び構成装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62207631A JPS62207631A (ja) | 1987-09-12 |
| JPH0584211B2 true JPH0584211B2 (enrdf_load_stackoverflow) | 1993-12-01 |
Family
ID=12876396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61051065A Granted JPS62207631A (ja) | 1986-03-07 | 1986-03-07 | プリプレグの構成方法及び構成装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62207631A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111634103B (zh) * | 2020-06-09 | 2021-11-30 | 江苏胜帆电子科技有限公司 | 基于5g高频信号传输的lcp覆铜板压合工艺 |
-
1986
- 1986-03-07 JP JP61051065A patent/JPS62207631A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62207631A (ja) | 1987-09-12 |
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