JPH0584055B2 - - Google Patents

Info

Publication number
JPH0584055B2
JPH0584055B2 JP59190578A JP19057884A JPH0584055B2 JP H0584055 B2 JPH0584055 B2 JP H0584055B2 JP 59190578 A JP59190578 A JP 59190578A JP 19057884 A JP19057884 A JP 19057884A JP H0584055 B2 JPH0584055 B2 JP H0584055B2
Authority
JP
Japan
Prior art keywords
pellet
imager
recognition device
substrate
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59190578A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6169139A (ja
Inventor
Hisaya Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Mechatronics Co Ltd
Original Assignee
Toshiba Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Seiki Co Ltd filed Critical Toshiba Seiki Co Ltd
Priority to JP19057884A priority Critical patent/JPS6169139A/ja
Publication of JPS6169139A publication Critical patent/JPS6169139A/ja
Publication of JPH0584055B2 publication Critical patent/JPH0584055B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
JP19057884A 1984-09-13 1984-09-13 ペレツトボンデイング装置における認識装置 Granted JPS6169139A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19057884A JPS6169139A (ja) 1984-09-13 1984-09-13 ペレツトボンデイング装置における認識装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19057884A JPS6169139A (ja) 1984-09-13 1984-09-13 ペレツトボンデイング装置における認識装置

Publications (2)

Publication Number Publication Date
JPS6169139A JPS6169139A (ja) 1986-04-09
JPH0584055B2 true JPH0584055B2 (ko) 1993-11-30

Family

ID=16260388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19057884A Granted JPS6169139A (ja) 1984-09-13 1984-09-13 ペレツトボンデイング装置における認識装置

Country Status (1)

Country Link
JP (1) JPS6169139A (ko)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57147245A (en) * 1981-03-05 1982-09-11 Shinkawa Ltd Positioning method and device for chip bonding
JPS5919338A (ja) * 1982-07-23 1984-01-31 Hitachi Ltd 微小物品検査装置
JPS5968936A (ja) * 1982-10-14 1984-04-19 Toshiba Seiki Kk ペレツトボンデイング方法
JPS5972145A (ja) * 1982-10-19 1984-04-24 Shinkawa Ltd フリップチップボンディング装置及び方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57147245A (en) * 1981-03-05 1982-09-11 Shinkawa Ltd Positioning method and device for chip bonding
JPS5919338A (ja) * 1982-07-23 1984-01-31 Hitachi Ltd 微小物品検査装置
JPS5968936A (ja) * 1982-10-14 1984-04-19 Toshiba Seiki Kk ペレツトボンデイング方法
JPS5972145A (ja) * 1982-10-19 1984-04-24 Shinkawa Ltd フリップチップボンディング装置及び方法

Also Published As

Publication number Publication date
JPS6169139A (ja) 1986-04-09

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term