JPH0580540B2 - - Google Patents

Info

Publication number
JPH0580540B2
JPH0580540B2 JP23638285A JP23638285A JPH0580540B2 JP H0580540 B2 JPH0580540 B2 JP H0580540B2 JP 23638285 A JP23638285 A JP 23638285A JP 23638285 A JP23638285 A JP 23638285A JP H0580540 B2 JPH0580540 B2 JP H0580540B2
Authority
JP
Japan
Prior art keywords
strength
bendability
alloy
heat resistance
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP23638285A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6296644A (ja
Inventor
Haruyumi Kosuge
Katsuaki Kamio
Tomoaki Sano
Koichi Ito
Nobuaki Nakajima
Sumyo Uzawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Nippon Light Metal Co Ltd
Original Assignee
Toshiba Corp
Nippon Light Metal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Nippon Light Metal Co Ltd filed Critical Toshiba Corp
Priority to JP23638285A priority Critical patent/JPS6296644A/ja
Publication of JPS6296644A publication Critical patent/JPS6296644A/ja
Publication of JPH0580540B2 publication Critical patent/JPH0580540B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49579Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
JP23638285A 1985-10-24 1985-10-24 リ−ドフレ−ム用アルミニウム合金 Granted JPS6296644A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23638285A JPS6296644A (ja) 1985-10-24 1985-10-24 リ−ドフレ−ム用アルミニウム合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23638285A JPS6296644A (ja) 1985-10-24 1985-10-24 リ−ドフレ−ム用アルミニウム合金

Publications (2)

Publication Number Publication Date
JPS6296644A JPS6296644A (ja) 1987-05-06
JPH0580540B2 true JPH0580540B2 (enrdf_load_html_response) 1993-11-09

Family

ID=16999956

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23638285A Granted JPS6296644A (ja) 1985-10-24 1985-10-24 リ−ドフレ−ム用アルミニウム合金

Country Status (1)

Country Link
JP (1) JPS6296644A (enrdf_load_html_response)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6389640A (ja) * 1986-10-01 1988-04-20 Sky Alum Co Ltd 電子電気機器導電部品材料
JPH0674479B2 (ja) * 1986-10-09 1994-09-21 スカイアルミニウム株式会社 リードフレーム、コネクタもしくはスイッチ用導電圧延材料
US20160099200A1 (en) * 2014-10-01 2016-04-07 Stmicroelectronics S.R.L. Aluminum alloy lead frame for a semiconductor device and corresponding manufacturing process

Also Published As

Publication number Publication date
JPS6296644A (ja) 1987-05-06

Similar Documents

Publication Publication Date Title
JP2542370B2 (ja) 半導体リ−ド用銅合金
JPS61183426A (ja) 高力高導電性耐熱銅合金
JPS6045698B2 (ja) 半導体機器用リ−ド材
US4908078A (en) Material for conductive parts of electronic or electric devices
JPH0555582B2 (enrdf_load_html_response)
JPS63143230A (ja) 析出強化型高力高導電性銅合金
KR950013291B1 (ko) 전자 전기기기 도전부품용 재료
JP3049137B2 (ja) 曲げ加工性が優れた高力銅合金及びその製造方法
US4687633A (en) Lead material for ceramic package IC
JPS6254852B2 (enrdf_load_html_response)
JPH0580540B2 (enrdf_load_html_response)
JPH0571656B2 (enrdf_load_html_response)
JPH0788549B2 (ja) 半導体機器用銅合金とその製造法
JPH0572455B2 (enrdf_load_html_response)
JPH0440417B2 (enrdf_load_html_response)
JPH10183274A (ja) 電子機器用銅合金
JP4132451B2 (ja) 耐熱性に優れた高強度高導電性銅合金
JPH0717982B2 (ja) リードフレーム、コネクタもしくはスイッチ用導電圧延材料
JPS6311418B2 (enrdf_load_html_response)
JPS63109132A (ja) 高力導電性銅合金及びその製造方法
JP2576853B2 (ja) はんだ接合強度に優れた電子機器用銅合金とその製造法
JPH0699791B2 (ja) 高強度・高導電型リードフレーム用金属板の製造方法
JPH0380856B2 (enrdf_load_html_response)
JPH0518892B2 (enrdf_load_html_response)
JPH0788552B2 (ja) 電子電気機器導電部品用板材