JPH0579174B2 - - Google Patents

Info

Publication number
JPH0579174B2
JPH0579174B2 JP61202442A JP20244286A JPH0579174B2 JP H0579174 B2 JPH0579174 B2 JP H0579174B2 JP 61202442 A JP61202442 A JP 61202442A JP 20244286 A JP20244286 A JP 20244286A JP H0579174 B2 JPH0579174 B2 JP H0579174B2
Authority
JP
Japan
Prior art keywords
pad
leads
tape
lead
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61202442A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6356948A (ja
Inventor
Katsufusa Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui High Tec Inc
Original Assignee
Mitsui High Tec Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui High Tec Inc filed Critical Mitsui High Tec Inc
Priority to JP20244286A priority Critical patent/JPS6356948A/ja
Publication of JPS6356948A publication Critical patent/JPS6356948A/ja
Publication of JPH0579174B2 publication Critical patent/JPH0579174B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP20244286A 1986-08-27 1986-08-27 リ−ドフレ−ム Granted JPS6356948A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20244286A JPS6356948A (ja) 1986-08-27 1986-08-27 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20244286A JPS6356948A (ja) 1986-08-27 1986-08-27 リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS6356948A JPS6356948A (ja) 1988-03-11
JPH0579174B2 true JPH0579174B2 (en, 2012) 1993-11-01

Family

ID=16457591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20244286A Granted JPS6356948A (ja) 1986-08-27 1986-08-27 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS6356948A (en, 2012)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5021864A (en) * 1989-09-05 1991-06-04 Micron Technology, Inc. Die-mounting paddle for mechanical stress reduction in plastic IC packages
US5949132A (en) * 1995-05-02 1999-09-07 Texas Instruments Incorporated Dambarless leadframe for molded component encapsulation

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0519958Y2 (en, 2012) * 1985-08-20 1993-05-25

Also Published As

Publication number Publication date
JPS6356948A (ja) 1988-03-11

Similar Documents

Publication Publication Date Title
EP0354696B1 (en) Semiconductor device assembly comprising a lead frame structure
US4865193A (en) Tape carrier for tape automated bonding process and a method of producing the same
JPS62259450A (ja) 集積回路ダイ・リ−ドフレ−ム相互接続組立体及び方法
JPH0273660A (ja) 半導体装置用リードフレーム
US6441400B1 (en) Semiconductor device and method of fabricating the same
JP3837215B2 (ja) 個別半導体装置およびその製造方法
US4951120A (en) Lead frame and semiconductor device using the same
JPS63148670A (ja) リ−ドフレ−ム材
JP2732767B2 (ja) 樹脂封止型半導体装置
JPH0579174B2 (en, 2012)
US3723833A (en) Heat sinking of semiconductor integrated circuit devices
EP0474224B1 (en) Semiconductor device comprising a plurality of semiconductor chips
JP3136029B2 (ja) 半導体装置
JP2507852B2 (ja) 半導体装置
JPH0519958Y2 (en, 2012)
JPH0870087A (ja) リードフレーム
KR100575859B1 (ko) 볼 그리드 어레이 패키지
KR200169976Y1 (ko) 반도체 패키지
JP3998528B2 (ja) 半導体装置
JPS63160262A (ja) リ−ドフレ−ムおよびそれを用いた半導体装置
JPH01119045A (ja) リードフレーム
JPH01173747A (ja) 樹脂封止形半導体装置
JPS6151953A (ja) 半導体装置
JPS61288454A (ja) マルチチツプ搭載半導体デバイスのリ−ドフレ−ム
JPH031562A (ja) リードフレーム、リードフレームの製造方法、半導体装置および半導体装置の製造方法