JPH0578414B2 - - Google Patents
Info
- Publication number
- JPH0578414B2 JPH0578414B2 JP60015807A JP1580785A JPH0578414B2 JP H0578414 B2 JPH0578414 B2 JP H0578414B2 JP 60015807 A JP60015807 A JP 60015807A JP 1580785 A JP1580785 A JP 1580785A JP H0578414 B2 JPH0578414 B2 JP H0578414B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- laminate
- amino
- metal
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60015807A JPS61173932A (ja) | 1985-01-30 | 1985-01-30 | 金属と樹脂層との積層体の製造法 |
| KR1019850004563A KR890004583B1 (ko) | 1984-06-29 | 1985-06-26 | 금속표면 처리공정 |
| DE8585304636T DE3582531D1 (de) | 1984-06-29 | 1985-06-28 | Verfahren zur behandlung von metalloberflaechen. |
| EP85304636A EP0170414B1 (en) | 1984-06-29 | 1985-06-28 | Process for treating metal surface |
| US06/750,780 US4643793A (en) | 1984-06-29 | 1985-07-01 | Process for treating metal surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60015807A JPS61173932A (ja) | 1985-01-30 | 1985-01-30 | 金属と樹脂層との積層体の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61173932A JPS61173932A (ja) | 1986-08-05 |
| JPH0578414B2 true JPH0578414B2 (enrdf_load_html_response) | 1993-10-28 |
Family
ID=11899115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60015807A Granted JPS61173932A (ja) | 1984-06-29 | 1985-01-30 | 金属と樹脂層との積層体の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61173932A (enrdf_load_html_response) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2758634B2 (ja) * | 1988-03-14 | 1998-05-28 | シャープ株式会社 | データ伝送装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59219459A (ja) * | 1983-05-27 | 1984-12-10 | Nec Corp | 無電解銅メツキ膜の活性保持溶液 |
| JPS6017080A (ja) * | 1983-07-08 | 1985-01-28 | Nec Corp | 無電解銅めつき液 |
-
1985
- 1985-01-30 JP JP60015807A patent/JPS61173932A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61173932A (ja) | 1986-08-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4902551A (en) | Process for treating copper surface | |
| KR890004583B1 (ko) | 금속표면 처리공정 | |
| US4868071A (en) | Thermally stable dual metal coated laminate products made from textured polyimide film | |
| KR930002220B1 (ko) | 구리와 수지와의 접착방법 | |
| US7704562B2 (en) | Process for improving the adhesion of polymeric materials to metal surfaces | |
| TW201041995A (en) | Process for improving adhesion of polymeric materials to metal surfaces | |
| JPH05304361A (ja) | 回路板の銅回路の処理方法 | |
| JPS63168077A (ja) | プリント配線板の製造法 | |
| JPH0578414B2 (enrdf_load_html_response) | ||
| JP2000151096A (ja) | プリント配線板の製造方法 | |
| JP2006093625A (ja) | 金属体付き絶縁体、アディティブメッキ用絶縁体、アディティブメッキ金属皮膜付き基板 | |
| JPH0419306B2 (enrdf_load_html_response) | ||
| JPH045754B2 (enrdf_load_html_response) | ||
| JPS623942A (ja) | 金属と樹脂層との積層体の製造法 | |
| JPS62169497A (ja) | 金属と樹脂層との積層体の製造法 | |
| JPS62270780A (ja) | 銅と樹脂との接着方法 | |
| JP4366632B2 (ja) | 内層回路付金属張積層板、多層プリント配線板及びそれらの製造方法 | |
| JPS6235843A (ja) | 金属と樹脂層との積層体の製造方法 | |
| KR20060048413A (ko) | 수지 표면 처리제 및 수지 표면 처리법 | |
| JPS6412215B2 (enrdf_load_html_response) | ||
| JPH0851280A (ja) | 多層プリント配線板 | |
| JPS6115981A (ja) | 銅の表面処理法 | |
| JPS63190179A (ja) | 銅の表面処理法 | |
| JPH0739574B2 (ja) | 酸化銅表面の耐酸性を向上させる処理液 | |
| JPH01124292A (ja) | 金属薄層付絶縁基板の製造法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |