JPH0577748B2 - - Google Patents

Info

Publication number
JPH0577748B2
JPH0577748B2 JP59006116A JP611684A JPH0577748B2 JP H0577748 B2 JPH0577748 B2 JP H0577748B2 JP 59006116 A JP59006116 A JP 59006116A JP 611684 A JP611684 A JP 611684A JP H0577748 B2 JPH0577748 B2 JP H0577748B2
Authority
JP
Japan
Prior art keywords
substrate
plating method
selective plating
fluid
palladium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59006116A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60149782A (ja
Inventor
Kyoshi Inoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inoue Japax Research Inc
Original Assignee
Inoue Japax Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inoue Japax Research Inc filed Critical Inoue Japax Research Inc
Priority to JP611684A priority Critical patent/JPS60149782A/ja
Priority to US06/691,877 priority patent/US4639378A/en
Priority to EP85100466A priority patent/EP0151413A3/en
Publication of JPS60149782A publication Critical patent/JPS60149782A/ja
Priority to US06/882,498 priority patent/US4822633A/en
Publication of JPH0577748B2 publication Critical patent/JPH0577748B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
JP611684A 1984-01-17 1984-01-17 選択的メツキ方法 Granted JPS60149782A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP611684A JPS60149782A (ja) 1984-01-17 1984-01-17 選択的メツキ方法
US06/691,877 US4639378A (en) 1984-01-17 1985-01-16 Auto-selective metal deposition on dielectric surfaces
EP85100466A EP0151413A3 (en) 1984-01-17 1985-01-17 Auto-selective metal deposition on dielectric surfaces
US06/882,498 US4822633A (en) 1984-01-17 1986-07-07 Auto-selective metal deposition on dielectric surfaces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP611684A JPS60149782A (ja) 1984-01-17 1984-01-17 選択的メツキ方法

Publications (2)

Publication Number Publication Date
JPS60149782A JPS60149782A (ja) 1985-08-07
JPH0577748B2 true JPH0577748B2 (enrdf_load_stackoverflow) 1993-10-27

Family

ID=11629529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP611684A Granted JPS60149782A (ja) 1984-01-17 1984-01-17 選択的メツキ方法

Country Status (1)

Country Link
JP (1) JPS60149782A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61143580A (ja) * 1984-12-14 1986-07-01 Furukawa Electric Co Ltd:The 非金属部材の部分化学メツキ法
DE102007010872A1 (de) * 2007-03-06 2008-09-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Präzisionsbearbeitung von Substraten und dessen Verwendung
EP3276042B1 (en) * 2015-03-24 2024-01-31 OM Sangyo Co., Ltd. Method for producing plated article
LT6518B (lt) * 2016-09-13 2018-04-25 Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras Būdas, skirtas elektrai laidžioms sritims ant polimerinio gaminio paviršiaus formuoti
JP2018101798A (ja) * 2018-02-13 2018-06-28 株式会社ニコン 湿式処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4920030A (enrdf_load_stackoverflow) * 1972-06-15 1974-02-22
JPS515626A (en) * 1974-07-04 1976-01-17 Matsushita Electric Industrial Co Ltd Ryuryoseigyoki
JPS5362176A (en) * 1976-11-15 1978-06-03 Nippon Telegraph & Telephone Method of forming printed circuit
DE2847298A1 (de) * 1978-10-27 1980-05-08 Schering Ag Verfahren zur herstellung von metallmustern auf einem isolierenden traegerstoff
US4217183A (en) * 1979-05-08 1980-08-12 International Business Machines Corporation Method for locally enhancing electroplating rates

Also Published As

Publication number Publication date
JPS60149782A (ja) 1985-08-07

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