JPH0534428B2 - - Google Patents

Info

Publication number
JPH0534428B2
JPH0534428B2 JP59006117A JP611784A JPH0534428B2 JP H0534428 B2 JPH0534428 B2 JP H0534428B2 JP 59006117 A JP59006117 A JP 59006117A JP 611784 A JP611784 A JP 611784A JP H0534428 B2 JPH0534428 B2 JP H0534428B2
Authority
JP
Japan
Prior art keywords
substrate
plating method
fluid
plating
selective plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59006117A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60149783A (ja
Inventor
Kyoshi Inoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inoue Japax Research Inc
Original Assignee
Inoue Japax Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inoue Japax Research Inc filed Critical Inoue Japax Research Inc
Priority to JP611784A priority Critical patent/JPS60149783A/ja
Priority to US06/691,877 priority patent/US4639378A/en
Priority to EP85100466A priority patent/EP0151413A3/en
Publication of JPS60149783A publication Critical patent/JPS60149783A/ja
Priority to US06/882,498 priority patent/US4822633A/en
Publication of JPH0534428B2 publication Critical patent/JPH0534428B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
JP611784A 1984-01-17 1984-01-17 選択的メツキ方法 Granted JPS60149783A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP611784A JPS60149783A (ja) 1984-01-17 1984-01-17 選択的メツキ方法
US06/691,877 US4639378A (en) 1984-01-17 1985-01-16 Auto-selective metal deposition on dielectric surfaces
EP85100466A EP0151413A3 (en) 1984-01-17 1985-01-17 Auto-selective metal deposition on dielectric surfaces
US06/882,498 US4822633A (en) 1984-01-17 1986-07-07 Auto-selective metal deposition on dielectric surfaces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP611784A JPS60149783A (ja) 1984-01-17 1984-01-17 選択的メツキ方法

Publications (2)

Publication Number Publication Date
JPS60149783A JPS60149783A (ja) 1985-08-07
JPH0534428B2 true JPH0534428B2 (enrdf_load_stackoverflow) 1993-05-24

Family

ID=11629560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP611784A Granted JPS60149783A (ja) 1984-01-17 1984-01-17 選択的メツキ方法

Country Status (1)

Country Link
JP (1) JPS60149783A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63262476A (ja) * 1987-04-17 1988-10-28 Meiban Kogei Kk パタ−ンの形成方法
US5260108A (en) * 1992-03-10 1993-11-09 International Business Machines Corporation Selective seeding of Pd by excimer laser radiation through the liquid
CN109072436A (zh) 2016-04-26 2018-12-21 株式会社村田制作所 陶瓷电子部件的制造方法
LT6518B (lt) * 2016-09-13 2018-04-25 Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras Būdas, skirtas elektrai laidžioms sritims ant polimerinio gaminio paviršiaus formuoti

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4920030A (enrdf_load_stackoverflow) * 1972-06-15 1974-02-22
JPS515626A (ja) * 1974-07-04 1976-01-17 Matsushita Electric Ind Co Ltd Ryuryoseigyoki
JPS5362176A (en) * 1976-11-15 1978-06-03 Nippon Telegraph & Telephone Method of forming printed circuit
DE2847298A1 (de) * 1978-10-27 1980-05-08 Schering Ag Verfahren zur herstellung von metallmustern auf einem isolierenden traegerstoff
US4217183A (en) * 1979-05-08 1980-08-12 International Business Machines Corporation Method for locally enhancing electroplating rates

Also Published As

Publication number Publication date
JPS60149783A (ja) 1985-08-07

Similar Documents

Publication Publication Date Title
US4822633A (en) Auto-selective metal deposition on dielectric surfaces
US3772056A (en) Sensitized substrates for chemical metallization
US3269861A (en) Method for electroless copper plating
US4349583A (en) Laser enhanced maskless method for plating and simultaneous plating and etching of patterns
US3772078A (en) Process for the formation of real images and products produced thereby
JP3153682B2 (ja) 回路板の製造方法
US4981715A (en) Method of patterning electroless plated metal on a polymer substrate
US3628999A (en) Plated through hole printed circuit boards
CN109844178B (zh) 一种在聚合物制品表面上形成导电迹线的方法
US8529738B2 (en) In situ plating and etching of materials covered with a surface film
US4440801A (en) Method for depositing a metal layer on polyesters
US3959547A (en) Process for the formation of real images and products produced thereby
US20110042201A1 (en) In situ Plating And Soldering Of Materials Covered With A Surface Film
US4165394A (en) Method of preparation of a substrate made of plastic material for its subsequent metallization
EP0109920A2 (de) Verfahren zum Reinigen von Löchern in gedruckten Schaltungsplatten mit permanganathaltigen und basischen Lösungen
JP2005022956A (ja) セラミックの金属化
EP0357124B1 (en) Method of selectively providing a metal from the liquid phase on a substrate by means of a laser
US3791340A (en) Method of depositing a metal pattern on a surface
JPH0326816B2 (enrdf_load_stackoverflow)
PT788728E (pt) Processo para o revestimento de superficies electricamente nao condutoras com estruturas metalicas ligadas entre si
JPH0534428B2 (enrdf_load_stackoverflow)
JPH0577748B2 (enrdf_load_stackoverflow)
US3839083A (en) Selective metallization process
DD157989A3 (de) Verfahren zur strukturierten chemisch-reduktiven metallabscheidung
US3676213A (en) Process for the selective formation of coatings by electroless deposition