JPH0577706B2 - - Google Patents

Info

Publication number
JPH0577706B2
JPH0577706B2 JP7598690A JP7598690A JPH0577706B2 JP H0577706 B2 JPH0577706 B2 JP H0577706B2 JP 7598690 A JP7598690 A JP 7598690A JP 7598690 A JP7598690 A JP 7598690A JP H0577706 B2 JPH0577706 B2 JP H0577706B2
Authority
JP
Japan
Prior art keywords
polyphenylene oxide
resin composition
flame retardant
triallyl
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP7598690A
Other languages
English (en)
Japanese (ja)
Other versions
JPH03275761A (ja
Inventor
Hideto Misawa
Takayoshi Koseki
Tokio Yoshimitsu
Toshiharu Takada
Yoshihide Sawa
Takaaki Sakamoto
Takahiro Heiuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP7598690A priority Critical patent/JPH03275761A/ja
Publication of JPH03275761A publication Critical patent/JPH03275761A/ja
Publication of JPH0577706B2 publication Critical patent/JPH0577706B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
JP7598690A 1990-03-26 1990-03-26 ポリフェニレンオキサイド系樹脂組成物 Granted JPH03275761A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7598690A JPH03275761A (ja) 1990-03-26 1990-03-26 ポリフェニレンオキサイド系樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7598690A JPH03275761A (ja) 1990-03-26 1990-03-26 ポリフェニレンオキサイド系樹脂組成物

Publications (2)

Publication Number Publication Date
JPH03275761A JPH03275761A (ja) 1991-12-06
JPH0577706B2 true JPH0577706B2 (xx) 1993-10-27

Family

ID=13592098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7598690A Granted JPH03275761A (ja) 1990-03-26 1990-03-26 ポリフェニレンオキサイド系樹脂組成物

Country Status (1)

Country Link
JP (1) JPH03275761A (xx)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4007911B2 (ja) * 2000-08-30 2007-11-14 旭化成エレクトロニクス株式会社 硬化性樹脂組成物
JP4325337B2 (ja) 2003-09-19 2009-09-02 日立化成工業株式会社 樹脂組成物、それを用いたプリプレグ、積層板及び多層プリント配線板
JP2005171075A (ja) * 2003-12-11 2005-06-30 Hitachi Chem Co Ltd プリント配線板樹脂組成物、およびこれを用いた樹脂ワニス、プリプレグおよび積層板
JP4561534B2 (ja) * 2005-08-25 2010-10-13 パナソニック電工株式会社 ポリフェニレンエーテル樹脂組成物、プリプレグ及び積層体

Also Published As

Publication number Publication date
JPH03275761A (ja) 1991-12-06

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