CN111690247A - 树脂组合物及其应用 - Google Patents
树脂组合物及其应用 Download PDFInfo
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- CN111690247A CN111690247A CN201910193387.XA CN201910193387A CN111690247A CN 111690247 A CN111690247 A CN 111690247A CN 201910193387 A CN201910193387 A CN 201910193387A CN 111690247 A CN111690247 A CN 111690247A
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- 239000003999 initiator Substances 0.000 claims abstract description 52
- 229920005989 resin Polymers 0.000 claims abstract description 43
- 239000011347 resin Substances 0.000 claims abstract description 43
- 229920001955 polyphenylene ether Polymers 0.000 claims abstract description 35
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 claims abstract description 13
- 239000011888 foil Substances 0.000 claims description 36
- 229910052751 metal Inorganic materials 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 36
- -1 butyl peroxyisopropyl Chemical group 0.000 claims description 31
- 239000003063 flame retardant Substances 0.000 claims description 18
- 239000003431 cross linking reagent Substances 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 14
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 12
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 9
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 claims description 9
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- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
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- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 claims description 6
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 claims description 6
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- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 claims description 4
- AQGZJQNZNONGKY-UHFFFAOYSA-N 1-[4-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=C(N2C(C=CC2=O)=O)C=C1 AQGZJQNZNONGKY-UHFFFAOYSA-N 0.000 claims description 4
- 239000005995 Aluminium silicate Substances 0.000 claims description 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 4
- 125000003342 alkenyl group Chemical group 0.000 claims description 4
- 235000012211 aluminium silicate Nutrition 0.000 claims description 4
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 4
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052794 bromium Inorganic materials 0.000 claims description 4
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- SPTHWAJJMLCAQF-UHFFFAOYSA-M ctk4f8481 Chemical compound [O-]O.CC(C)C1=CC=CC=C1C(C)C SPTHWAJJMLCAQF-UHFFFAOYSA-M 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 4
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- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- 239000010453 quartz Substances 0.000 claims description 4
- XSZYESUNPWGWFQ-UHFFFAOYSA-N 1-(2-hydroperoxypropan-2-yl)-4-methylcyclohexane Chemical compound CC1CCC(C(C)(C)OO)CC1 XSZYESUNPWGWFQ-UHFFFAOYSA-N 0.000 claims description 3
- PUKLCKVOVCZYKF-UHFFFAOYSA-N 1-[2-(2,5-dioxopyrrol-1-yl)ethyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CCN1C(=O)C=CC1=O PUKLCKVOVCZYKF-UHFFFAOYSA-N 0.000 claims description 3
- FJKKJQRXSPFNPM-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)-4-methylphenyl]pyrrole-2,5-dione Chemical compound CC1=CC=C(N2C(C=CC2=O)=O)C=C1N1C(=O)C=CC1=O FJKKJQRXSPFNPM-UHFFFAOYSA-N 0.000 claims description 3
- PSBWYHXUAUUQTO-UHFFFAOYSA-N 1-[4-[5-[4-(2,5-dioxopyrrol-1-yl)phenyl]pyridin-3-yl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=C(C=2C=C(C=NC=2)C=2C=CC(=CC=2)N2C(C=CC2=O)=O)C=C1 PSBWYHXUAUUQTO-UHFFFAOYSA-N 0.000 claims description 3
- PYVHLZLQVWXBDZ-UHFFFAOYSA-N 1-[6-(2,5-dioxopyrrol-1-yl)hexyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CCCCCCN1C(=O)C=CC1=O PYVHLZLQVWXBDZ-UHFFFAOYSA-N 0.000 claims description 3
- RIJSFLCTBDHBBS-UHFFFAOYSA-N 1-[6-(2,5-dioxopyrrol-1-yl)pyridin-2-yl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=N1 RIJSFLCTBDHBBS-UHFFFAOYSA-N 0.000 claims description 3
- FLNMXNRQDBBBJL-UHFFFAOYSA-N 1-[[3-[(2,5-dioxopyrrol-1-yl)methyl]cyclohexyl]methyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CC1CC(CN2C(C=CC2=O)=O)CCC1 FLNMXNRQDBBBJL-UHFFFAOYSA-N 0.000 claims description 3
- LYCKDYZIIOVFCX-UHFFFAOYSA-N 1-[[3-[(2,5-dioxopyrrol-1-yl)methyl]phenyl]methyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CC1=CC=CC(CN2C(C=CC2=O)=O)=C1 LYCKDYZIIOVFCX-UHFFFAOYSA-N 0.000 claims description 3
- JJRDRFZYKKFYMO-UHFFFAOYSA-N 2-methyl-2-(2-methylbutan-2-ylperoxy)butane Chemical group CCC(C)(C)OOC(C)(C)CC JJRDRFZYKKFYMO-UHFFFAOYSA-N 0.000 claims description 3
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- 125000006539 C12 alkyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 3
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- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 3
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
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- BXIQXYOPGBXIEM-UHFFFAOYSA-N butyl 4,4-bis(tert-butylperoxy)pentanoate Chemical compound CCCCOC(=O)CCC(C)(OOC(C)(C)C)OOC(C)(C)C BXIQXYOPGBXIEM-UHFFFAOYSA-N 0.000 claims description 3
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- XXKOQQBKBHUATC-UHFFFAOYSA-N cyclohexylmethylcyclohexane Chemical compound C1CCCCC1CC1CCCCC1 XXKOQQBKBHUATC-UHFFFAOYSA-N 0.000 claims description 3
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- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 claims description 3
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Abstract
一种树脂组合物,其包含以下成分:(A)末端具有不饱和基团的聚苯醚树脂;(B)具马来酰亚胺结构的成分;(C)第一起始剂,该第一起始剂具有第一1分钟半衰期温度;以及(D)第二起始剂,该第二起始剂具有第二1分钟半衰期温度,其中第一1分钟半衰期温度高于第二1分钟半衰期温度20℃至50℃,且第一1分钟半衰期温度为170℃至220℃。
Description
技术领域
本发明提供一种树脂组合物,特别是关于一种包含两种具有特定半衰期温度的起始剂的聚苯醚树脂系树脂组合物。本发明树脂组合物可与补强材料构成复合材料或半固化片(prepreg),或可进一步作为金属箔的接着剂,以制备金属箔积层板(metal-cladlaminate)及印刷电路板(printed circuit board,PCB)。
背景技术
金属箔积层板是用于制造印刷电路板的常用材料之一,且可通过如下方法而制备。首先,将补强材(例如玻璃织物)含浸于热固化型树脂组合物(例如聚苯醚树脂系树脂组合物)中或将热固化型树脂组合物涂布于补强材上,并烘烤经树脂组合物含浸或涂布的补强材至半固化状态(即B-阶段(B-stage))以形成半固化片。随后,将预定层数的半固化片层合以提供一介电层。在介电层的至少一外侧层合一金属箔(例如铜箔)以提供一层合物,接着对该层合物进行一热压操作(即C-阶段(C-stage)),可得到一金属箔积层板。
近来,在电子通讯技术领域中对于资料传输量的需求不断增加,使得电子产品的应用进入高频及高速传输领域。在信号传输高频化与高速化、电子元件小型化及电路板线路高密度化的趋势下,对于相关电子材料的介电性质及储存稳定性的要求也不断提高。为了得到具有高密度的印刷电路板,印刷电路板通常被形成为多层结构,以尽可能地布有更多的线路。多层板(即,具有多层结构的印刷电路板)可通过如下方式制备。首先,将适当的导电材料(例如金属箔)与介电材料(例如半固化片)压合以形成核心层(core layer),并对核心层进行图案化。随后,利用适当的导电材料(例如金属箔)与介电材料(例如半固化片)形成增层结构(build-up structure)。将增层结构依序堆叠且压合至核心层上,之后同样对增层结构进行图案化,由此形成多层板。上述方式也称为增层法。然而,增层法的工艺时间较长,若介电材料(例如半固化片)的储存稳定性不佳,半固化片在压合前可能因交联反应已达到一定程度而老化(aged)(即,动态黏度过高),从而导致半固化片无法顺利地与金属箔黏合。此外,若半固化片在压合工艺中需要更长的压合时间来达到完全固化的状态,将导致工艺时间的增加,造成工艺成本上升及产率下降的问题。
发明内容
本发明提供一种热固化性树脂组合物及使用其所制得的半固化片、金属箔积层板与印刷电路板。
本发明解决问题的技术手段在于,在聚苯醚树脂系树脂组合物中组合使用两种具有不同半衰期温度且半衰期温度差在特定范围内的起始剂。本发明树脂组合物所制得的半固化片在经过长时间放置后仍不会老化而具有适宜的动态黏度,储存稳定性优良,且所制得的半固化片于制备金属箔积层板时,所需的压合时间较短,能够降低工艺成本及提高产率,此外,所制得的电子材料具有令人满意的介电性质及耐热性质。因此,本发明涉及以下发明目的。
本发明的一个目的在于提供一种树脂组合物,其包含以下成分:
(A)末端具有不饱和基团的聚苯醚树脂;
(B)具马来酰亚胺结构的成分;
(C)第一起始剂,该第一起始剂具有第一1分钟半衰期温度;以及
(D)第二起始剂,该第二起始剂具有第二1分钟半衰期温度,
其中第一1分钟半衰期温度高于第二1分钟半衰期温度20℃至50℃,且第一1分钟半衰期温度为170℃至220℃。
于本发明的部分实施方案中,第一1分钟半衰期温度高于第二1分钟半衰期温度21℃至35℃,且第一1分钟半衰期温度为170℃至190℃。
于本发明的部分实施方案中,该第一起始剂(C)对该第二起始剂(D)的重量比为6:1至1:6,较佳为6:1至3:4,更佳为6:1至4:3。
于本发明的部分实施方案中,该末端具有不饱和基团的聚苯醚树脂(A)由下式(I)表示:
于式(I)中,
R3、R4、R5及R6各自独立为H或者经或未经取代的C1至C5烷基,且R3、R4、R5及R6较佳为-CH3;
m与n各自独立为0至100的整数,条件为m与n不同时为0;
X与Y各自独立为不存在、羰基(carbonyl group)或具有烯基的基团,且X与Y较佳为不存在;以及
于本发明的部分实施方案中,该具马来酰亚胺结构的成分(B)是选自以下群组:1,2-双马来酰亚胺基乙烷、1,6-双马来酰亚胺基己烷、1,3-双马来酰亚胺基苯、1,4-双马来酰亚胺基苯、2,4-双马来酰亚胺基甲苯、4,4'-双马来酰亚胺基二苯基甲烷、4,4'-双马来酰亚胺基二苯基醚、3,3'-双马来酰亚胺基二苯基砜、4,4'-双马来酰亚胺基二苯基砜、4,4'-双马来酰亚胺基二环己基甲烷、3,5-双(4-马来酰亚胺基苯基)吡啶、2,6-双马来酰亚胺基吡啶、1,3-双(马来酰亚胺基甲基)环己烷、1,3-双(马来酰亚胺基甲基)苯、1,1-双(4-马来酰亚胺基苯基)环己烷、1,3-双(二氯马来酰亚胺基)苯、4,4'-双柠康酰亚胺基二苯基甲烷(4,4'-biscitraconimidodiphenylmethane)、2,2-双(4-马来酰亚胺基苯基)丙烷、1-苯基-1,1-双(4-马来酰亚胺基苯基)乙烷、3,3'-二甲基-5,5'-二乙基-4,4'-二苯甲烷基双马来酰亚胺、α,α-双(4-马来酰亚胺基苯基)甲苯、3,5-双马来酰亚胺基-1,2,4-三唑、N,N'-伸乙基双马来酰亚胺、N,N'-六亚甲基双马来酰亚胺、N,N'-间-伸苯基双马来酰亚胺、N,N'-对-伸苯基双马来酰亚胺、N,N'-4,4'-二苯基甲烷双马来酰亚胺、N,N'-4,4'-二苯基醚双马来酰亚胺、N,N'-4,4'-二苯基砜双马来酰亚胺、N,N'-4,4'-二环己基甲烷双马来酰亚胺、N,N'-α,α'-4,4'-二亚甲基环己烷双马来酰亚胺、N,N'-间二甲苯双马来酰亚胺、N,N'-4,4'-二苯基环己烷双马来酰亚胺、N,N'-亚甲基双(3-氯-对-伸苯基)双马来酰亚胺及前述的组合。
于本发明的部分实施方案中,该第一起始剂(C)选自以下群组:4,4-二(三级丁基过氧化)戊酸正丁酯(n-butyl 4,4-bis(tert-butylperoxy)valerate)(1分钟半衰期温度:172.5℃)、过氧化三级丁基异丙苯((tert-butylcumyl peroxide)(1分钟半衰期温度:173.3℃)、过氧化二异丙苯(dicumyl peroxide)(1分钟半衰期温度:175.2℃)、1,3-双-(2-三级丁基过氧化异丙基)苯(1,3-di-(2-tert-butyl-peroxyisopropyl)benzene)(1分钟半衰期温度:175.4℃)、2,5-二甲基-2,5-二-(三级丁基过氧化)己烷(2,5-dimethyl-2,5-di-(tert-butylperoxy)hexane)(1分钟半衰期温度:179.8℃)、二-三级丁基过氧化物(di-tert-butylperoxide)(1分钟半衰期温度:185.9℃)、2,5-二甲基-2,5-二(三级丁基过氧化)-3-己炔(2,5-dimethyl-2,5-di(tert-butylperoxy)-3-hexyne)(1分钟半衰期温度:194.3℃)、氢过氧化二异丙基苯(diisopropylbenzene hydroperoxide)(1分钟半衰期温度:207℃)、氢过氧化对薄荷烷(p-menthane hydroperoxide)(1分钟半衰期温度:199.5℃)及前述的组合。
于本发明的部分实施方案中,该第二起始剂(D)选自以下群组:1,1,3,3-四甲基丁基过氧化-2-乙基己酸酯(1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate)(1分钟半衰期温度:124.3℃)、过氧化三级戊基-2-乙基己酸酯(tert-amylperoxy-2-ethylhexanoate)(1分钟半衰期温度:128℃)、过氧化二苯甲酰(dibenzoyl peroxide)(1分钟半衰期温度:130℃)、三级己基过氧化-2-乙基己酸酯(tert-hexylperoxy-2-ethylhexanoate)(1分钟半衰期温度:132.6℃)、三级丁基过氧化-2-乙基己酸酯(tert-butylperoxy-2-ethylhexanoate)(1分钟半衰期温度:134℃)、过氧化三级丁基异丁酸酯(tert-butylperoxyisobutyrate)(1分钟半衰期温度:136℃)、1,1-二(三级丁基过氧化)-3,3,5-三甲基环己烷(1,1-di(tert-butylperoxy)-3,3,5-trimethylcyclohexane)(1分钟半衰期温度:148℃)、1,1-二(三级己基过氧化)环己烷(1,1-di(tert-hexylperoxy)cyclohexane)(1分钟半衰期温度:149.2℃)、过氧化三级戊基-2-乙基己基碳酸酯(tert-amylperoxy-2-ethyl hexylcarbonate)(1分钟半衰期温度:151℃)、1,1-二(三级丁基过氧化)环己烷(1,1-di(tert-butylperoxy)cyclohexane)(1分钟半衰期温度:153.8℃)、三级丁基过氧化异丙基碳酸酯(tert-butylperoxyisopropylcarbonate)(1分钟半衰期温度:158.8℃)、2,2-二(三级丁基过氧化)丁烷(2,2-di(tert-butylperoxy)butane)(1分钟半衰期温度:159.9℃)、三级丁基过氧化醋酸酯(tert-butylperoxyacetate)(1分钟半衰期温度:159.9℃)、三级丁基过氧化-2-乙基己基碳酸酯(tert-butylperoxy-2-ethylhexylcarbonate)(1分钟半衰期温度:161.4℃)、过氧化三级丁基-3,3,5-三甲基己酸酯(tert-butylperoxy-3,3,5-trimethylhexanoate)(1分钟半衰期温度:166℃)、三级丁基过氧化苯甲酸酯(tert-butylperoxybenzoate)(1分钟半衰期温度:166.8℃)、二-三级戊基过氧化物(di-tert-amylperoxide)(1分钟半衰期温度:169℃)、过氧化三级丁基异丙苯、过氧化二异丙苯、1,3-双-(2-三级丁基过氧化异丙基)苯、2,5-二甲基-2,5-二(三级丁基过氧化)己烷、二-三级丁基过氧化物、2,5-二甲基-2,5-二(三级丁基过氧化)-3-己炔及前述的组合。
于本发明的部分实施方案中,树脂组合物还包含选自以下群组的交联剂:多官能型烯丙基系化合物(polyfunctional allylic compound)、多官能型丙烯酸酯(polyfunctional acrylate)、多官能型丙烯酰胺(polyfunctional acrylamide)、多官能型苯乙烯系化合物(polyfunctional styrenic compound)及前述的组合。
于本发明的部分实施方案中,树脂组合物还包含选自以下群组的阻燃剂:含磷阻燃剂、含溴阻燃剂、含氮化合物及前述的组合。
于本发明的部分实施方案中,树脂组合物还包含选自以下群组的填料:二氧化硅、氧化镁、氢氧化镁、碳酸钙、滑石、黏土、氮化铝、氧化铝、氢氧化铝、氮化硼、氮化硅、碳化铝硅、碳化硅、碳酸钠、碳酸镁、二氧化钛、氧化锌、氧化锆、石英、钻石粉、类钻石粉、石墨、煅烧高岭土、白岭土、云母、水滑石、聚四氟乙烯(polytetrafluoroethylene,PTFE)粉体、玻璃珠、陶瓷晶须、奈米碳管、奈米级无机粉体及前述的组合。
本发明的另一目的在于提供一种半固化片,其是通过将一基材含浸于或在一基材上涂布如上所述的树脂组合物,并干燥经含浸或涂布的基材而制得。
本发明的又一目的在于提供一种金属箔积层板,其是通过使用如上所述的半固化片与金属箔加以层合而制得。
本发明的再一目的在于提供一种印刷电路板,其是通过使用如上所述的金属箔积层板制得。
为使本发明的上述目的、技术特征及优点能更明显易懂,下文以部分具体实施方案进行详细说明。
具体实施方式
以下将具体地描述根据本发明的部分具体实施方案;但是,在不背离本发明的精神下,本发明还可以多种不同形式的方案来实践,不应将本发明保护范围限于所述具体实施方案。
除非文中有另外说明,于本说明书中(尤其是在权利要求书中)所使用的“一”、“该”及类似用语应理解为包含单数及复数形式。
除非另有说明,于本说明书中(尤其是在权利要求书中),所使用的“第一”、“第二”及类似用语仅用于区隔所描述的元件或成分,本身并无特殊涵意,且不指代先后顺序。
除非文中有另外说明,于本说明书中描述溶液、混合物或组合物中所含的成分时,是以固含量(solid content)计算,即,未纳入溶剂的重量。
本文中,用词“树脂固体成分”是指在树脂组合物中排除填料以外的其他所有固体成分,也即包括末端具有不饱和基团的聚苯醚树脂(A)、具马来酰亚胺结构的成分(B)、第一起始剂(C)及第二起始剂(D)等必要成分以及视需要的选用成分(例如交联剂及阻燃剂)。
本发明对照现有技术的功效在于,本发明树脂组合物组合使用聚苯醚树脂、具马来酰亚胺结构的成分以及两种具有特定半衰期温度差的起始剂,借此使得所制得的半固化片具备良好的储存稳定性及较短的所需压合时间,从而降低成本并提高产率,且所制得的电子材料也具备令人满意的介电性质及耐热性。以下就本发明树脂组合物的各成分及制备方式提供详细说明。
1.树脂组合物
本发明树脂组合物包含末端具有不饱和基团的聚苯醚树脂(A)、具马来酰亚胺结构的成分(B)、第一起始剂(C)及第二起始剂(D)等必要成分,以及其他视需要的选用成分。
1.1.末端具有不饱和基团的聚苯醚树脂(A)
本文中,末端具有不饱和基团的聚苯醚树脂是指在分子主链中至少具有重复单元且在末端具有不饱和基团的树脂,其中R各自独立为H或C1至C5的烷基,且v为1至100的整数。所述不饱和基团是指能够与其他具有不饱和基团的成分发生加成聚合反应的基团,所述加成聚合反应可于存在有聚合起始剂的情况下通过光或热而引发。不饱和基团的实例包括但不限于乙烯基(vinyl)、乙烯苄基(vinyl benzyl)、烯丙基(allyl)、丙烯酸酯基(acrylic)及甲基丙烯酸酯基(methacrylic)。末端具有不饱和基团的聚苯醚树脂的实例包括但不限于含乙烯基的聚苯醚树脂、含烯丙基的聚苯醚树脂、含乙烯苄基的聚苯醚树脂、含丙烯酸酯基的聚苯醚树脂及含甲基丙烯酸酯基的聚苯醚树脂。各聚苯醚树脂可单独使用或任意组合使用。
末端具有不饱和基团的聚苯醚树脂的制备方式并非本发明的技术重点,且乃本发明所属技术领域中普通技术人员可基于本说明书的记载与所具备的公知常识而进行,于此不加赘述。有关末端具有不饱和基团的聚苯醚树脂的相关制备方式的文献可列举US 6,995,195 B2(含乙烯苄基的聚苯醚树脂)、US 5,218,030 A(含烯丙基的聚苯醚树脂)、US 5,352,745 A(含甲基丙烯酸酯基的聚苯醚树脂)、US 6,352,782 B2及US 2016/0280913 A1,这些文献全文在此引入作为参考。
于本发明的部分实施方案中,末端具有不饱和基团的聚苯醚树脂(A)由下式(I)表示:
于式(I)中,R3、R4、R5及R6各自独立为H或者经或未经取代的C1至C5烷基;m与n各自独立为0至100的整数,条件为m与n不同时为0;Z为不存在、-O-、 或芳基,其中R7与R8各自独立为H或C1至C12烷基;X与Y各自独立为不存在、羰基或具有烯基的基团;以及A1与A2各自独立为 于本发明的较佳实施方案中,式(I)的R3、R4、R5及R6为-CH3,Z为X与Y为不存在,且A1与A2各自独立为
于本发明树脂组合物中,末端具有不饱和基团的聚苯醚树脂(A)的重量平均分子量(weight average molecular weight,Mw)可为1000至50000,较佳为1000至10000,更佳为1000至5000。若聚苯醚树脂的Mw高于上述范围(例如高于50000),则树脂组合物的流动性、溶解度等可能变差,造成后续加工困难。反之,若聚苯醚树脂的Mw低于上述范围(例如低于1000),则树脂组合物的介电性质及热稳定性可能变差。
商业上可购得的末端具有不饱和基团的聚苯醚树脂(A)的实例包括可购自三菱瓦斯化学(MITSUBISHI GAS CHEMICAL)的型号为OPE-2st及OPE-2EA的产品,可购自沙特基础工业(SABIC)的型号为SA-9000的产品,可购自晋一化工的型号为PP807的产品,以及可购自旭化成(ASAHI KASEI)的聚苯醚产品。
于本发明树脂组合物中,以100重量份的树脂固体成分计,末端具有不饱和基团的聚苯醚树脂(A)的含量可为20重量份至70重量份,更特定而言为25重量份至65重量份,例如27重量份、30重量份、33重量份、35重量份、38重量份、40重量份、42重量份、45重量份、47重量份、50重量份、53重量份、55重量份、58重量份、60重量份或63重量份。
1.2.具马来酰亚胺结构的成分(B)
本文中,马来酰亚胺结构是指具有反应性双键的不饱和酰亚胺结构。具马来酰亚胺结构的成分因具有反应性双键而能够与其他具有不饱和基团的成分发生反应。于本发明的部分实施方案中,具马来酰亚胺结构的成分(B)包括一个或多个由下式(II)表示的化合物:
于式(II)中,M1为一有机基团,且R1及R2各自独立为H、卤素或C1至C5烷基。具体言之,M1为C2至C40的2价基团,所述2价基团包括但不限于2价脂肪族基团、2价脂环族基团、2价芳族基团或2价杂环基团。于本发明的较佳实施方案中,R1及R2为H,且M1选自以下群组:亚甲基(-CH2-)、4,4'-二苯甲烷基间伸苯基双酚A二苯醚基3,3'-二甲基-5,5'-二乙基-4,4'-二苯甲烷基4-甲基-1,3-伸苯基及(2,2,4-三甲基)-1,6-伸己基
由式(II)表示的化合物的具体实例包括但不限于1,2-双马来酰亚胺基乙烷、1,6-双马来酰亚胺基己烷、1,3-双马来酰亚胺基苯、1,4-双马来酰亚胺基苯、2,4-双马来酰亚胺基甲苯、4,4'-双马来酰亚胺基二苯基甲烷、4,4'-双马来酰亚胺基二苯基醚、3,3'-双马来酰亚胺基二苯基砜、4,4'-双马来酰亚胺基二苯基砜、4,4'-双马来酰亚胺基二环己基甲烷、3,5-双(4-马来酰亚胺基苯基)吡啶、2,6-双马来酰亚胺基吡啶、1,3-双(马来酰亚胺基甲基)环己烷、1,3-双(马来酰亚胺基甲基)苯、1,1-双(4-马来酰亚胺基苯基)环己烷、1,3-双(二氯马来酰亚胺基)苯、4,4'-双柠康酰亚胺基二苯基甲烷、2,2-双(4-马来酰亚胺基苯基)丙烷、1-苯基-1,1-双(4-马来酰亚胺基苯基)乙烷、3,3'-二甲基-5,5'-二乙基-4,4'-二苯甲烷基双马来酰亚胺、α,α-双(4-马来酰亚胺基苯基)甲苯、3,5-双马来酰亚胺基-1,2,4-三唑、N,N'-伸乙基双马来酰亚胺、N,N'-六亚甲基双马来酰亚胺、N,N'-间-伸苯基双马来酰亚胺、N,N'-对-伸苯基双马来酰亚胺、N,N'-4,4'-二苯基甲烷双马来酰亚胺、N,N'-4,4'-二苯基醚双马来酰亚胺、N,N'-4,4'-二苯基砜双马来酰亚胺、N,N'-4,4'-二环己基甲烷双马来酰亚胺、N,N'-α,α'-4,4'-二亚甲基环己烷双马来酰亚胺、N,N'-间二甲苯双马来酰亚胺、N,N'-4,4'-二苯基环己烷双马来酰亚胺、及N,N'-亚甲基双(3-氯-对-伸苯基)双马来酰亚胺。各该化合物可单独使用或任意组合使用。于后附实施例中,使用3,3'-二甲基-5,5'-二乙基-4,4'-二苯甲烷基双马来酰亚胺(即,式(II)的R1及R2为H,且M1为3,3'-二甲基-5,5'-二乙基-4,4'-二苯甲烷基
于本发明树脂组合物中,以100重量份的树脂固体成分计,具马来酰亚胺结构的成分(B)的含量可为20重量份至70重量份,更特定而言为25重量份至65重量份,例如27重量份、30重量份、33重量份、35重量份、38重量份、40重量份、42重量份、45重量份、48重量份、50重量份、52重量份、55重量份、58重量份、60重量份或62重量份。
1.3.第一起始剂(C)及第二起始剂(D)
虽然聚合反应也可能在不存在聚合起始剂的情况下通过热引发,但通常需要在极高的温度下才能进行无聚合起始剂的聚合反应。然而,由于温度上的限制,无聚合起始剂的聚合反应难以在一般电子材料的工业工艺条件下进行。因此,在一般电子材料的工业工艺条件下,聚合反应通常在存在有聚合起始剂的情况下进行。本文中,起始剂是指可引发聚合反应的物质,且可大概分为光起始剂与热起始剂。光起始剂的实例包括但不限于鎓盐类、重氮盐类、苯偶姻醚类、芳香族酮类及金属有机物类。热起始剂的实例包括但不限于有机过氧化合物及偶氮类。有机过氧化物是一种热不稳定的物质,容易随着温度升高而加速分解,因此有机过氧化物的反应特性通常可通过“半衰期温度”来表示。具体言之,半衰期温度可根据分解时间的长短而分为1分钟半衰期温度、1小时半衰期温度及10小时半衰期温度,其中1分钟半衰期温度表示在该温度下一定量的有机过氧化物可于1分钟内分解至初始量的一半。
有机过氧化物的1分钟半衰期温度可依本发明所属技术领域普通技术人员所知的方式来测量。具体而言,可将有机过氧化物溶于惰性溶剂中以形成浓度为0.1莫耳/公升(mol/L)的有机过氧化物溶液,并利用微差扫描量热计-热活性测定仪(differentialscanning calorimetry-thermal activity monitoring,DSC-TAM)来测定有机过氧化物的分解量可在1分钟内达到初始量的50%时的温度。所使用的惰性溶剂可为苯或氯苯。
本发明树脂组合物是并用两种不同的起始剂来改善所制得半固化片的储存稳定性及所需压合时间,其中具有较高的1分钟半衰期温度的起始剂称为第一起始剂(C),具有较低的1分钟半衰期温度的起始剂称为第二起始剂(D)。第一起始剂(C)具有介于170℃至220℃之间的第一1分钟半衰期温度,较佳具有介于170℃至210℃之间的第一1分钟半衰期温度,且更佳具有介于170℃至190℃之间的第一1分钟半衰期温度。第二起始剂(D)具有低于第一1分钟半衰期温度20℃至50℃的第二1分钟半衰期温度。换言之,第一1分钟半衰期温度比第二1分钟半衰期温度高20℃至50℃。于本发明的较佳实施方案中,第一1分钟半衰期温度高于第二1分钟半衰期温度21℃至35℃,例如高22℃、23℃、24℃、25℃、26℃、27℃、28℃、29℃、30℃、31℃、32℃、33℃或34℃。当第一1分钟半衰期温度在指定范围内且第一1分钟半衰期温度与第二1分钟半衰期温度的差也在指定范围内时,由树脂组合物所制得的半固化片可具有优良的储存稳定性及较短的所需压合时间,也即,在储存稳定性与所需压合时间两者之间可达到适当的平衡。反之,当第一1分钟半衰期温度不在指定范围内时或第一1分钟半衰期温度与第二1分钟半衰期温度的差不在指定范围内时,所制得的半固化片可能无法同时具备优良的储存稳定性及较短的所需压合时间,也即,在储存稳定性与所需压合时间两者之间将无法达到适当的平衡。
第一起始剂(C)的实例包括但不限于4,4-二(三级丁基过氧化)戊酸正丁酯(1分钟半衰期温度:172.5℃)、过氧化三级丁基异丙苯(1分钟半衰期温度:173.3℃)、过氧化二异丙苯(1分钟半衰期温度:175.2℃)、1,3-双-(2-三级丁基过氧化异丙基)苯(1分钟半衰期温度:175.4℃)、2,5-二甲基-2,5-二-(三级丁基过氧化)己烷(1分钟半衰期温度:179.8℃)、二-三级丁基过氧化物(1分钟半衰期温度:185.9℃)、2,5-二甲基-2,5-二(三级丁基过氧化)-3-己炔(1分钟半衰期温度:194.3℃)、氢过氧化二异丙基苯(1分钟半衰期温度:207℃)及氢过氧化对薄荷烷(1分钟半衰期温度:199.5℃)。各起始剂可单独使用或任意组合使用。
第二起始剂(D)的具体实例包括但不限于1,1,3,3-四甲基丁基过氧化-2-乙基己酸酯(1分钟半衰期温度:124.3℃)、过氧化三级戊基-2-乙基己酸酯(1分钟半衰期温度:128℃)、过氧化二苯甲酰(1分钟半衰期温度:130℃)、三级己基过氧化-2-乙基己酸酯(1分钟半衰期温度:132.6℃)、三级丁基过氧化-2-乙基己酸酯(1分钟半衰期温度:134℃)、过氧化三级丁基异丁酸酯(1分钟半衰期温度:136℃)、1,1-二(三级丁基过氧化)-3,3,5-三甲基环己烷(1分钟半衰期温度:148℃)、1,1-二(三级己基过氧化)环己烷(1分钟半衰期温度:149.2℃)、过氧化三级戊基-2-乙基己基碳酸酯(1分钟半衰期温度:151℃)、1,1-二(三级丁基过氧化)环己烷(1分钟半衰期温度:153.8℃)、三级丁基过氧化异丙基碳酸酯(1分钟半衰期温度:158.8℃)、2,2-二(三级丁基过氧化)丁烷(1分钟半衰期温度:159.9℃)、三级丁基过氧化醋酸酯(1分钟半衰期温度:159.9℃)、三级丁基过氧化-2-乙基己基碳酸酯(1分钟半衰期温度:161.4℃)、过氧化三级丁基-3,3,5-三甲基己酸酯(1分钟半衰期温度:166℃)、三级丁基过氧化苯甲酸酯(1分钟半衰期温度:166.8℃)、二-三级戊基过氧化物(1分钟半衰期温度:169℃)、过氧化三级丁基异丙苯、过氧化二异丙苯、1,3-双-(2-三级丁基过氧化异丙基)苯、2,5-二甲基-2,5-二(三级丁基过氧化)己烷、二-三级丁基过氧化物及2,5-二甲基-2,5-二(三级丁基过氧化)-3-己炔。各起始剂可单独使用或任意组合使用。
于本发明的部分实施方案中,第一起始剂(C)选自以下群组:1,3-双-(2-三级丁基过氧化异丙基)苯、二-三级丁基过氧化物、氢过氧化二异丙基苯及2,5-二甲基-2,5-二(三级丁基过氧化)-3-己炔。
于本发明的部分实施方案中,第二起始剂(D)选自以下群组:1,1-二(三级丁基过氧化)环己烷、三级丁基过氧化-2-乙基己基碳酸酯、1,1-二(三级己基过氧化)环己烷及过氧化二苯甲酰。
于本发明树脂组合物中,以100重量份的树脂固体成分计,第一起始剂(C)及第二起始剂(D)的总含量可为0.01重量份至2重量份,例如0.02重量份、0.03重量份、0.05重量份、0.07重量份、0.09重量份、0.1重量份、0.2重量份、0.3重量份、0.5重量份、0.7重量份、0.9重量份、1重量份、1.2重量份、1.3重量份、1.5重量份或1.8重量份。
于本发明树脂组合物中,第一起始剂(C)与第二起始剂(D)的重量比可为6:1至1:6,较佳为6:1至3:4,且更佳为6:1至4:3,例如5:1、4:1、3:1、5:2、2:1、5:3或3:2。当第一起始剂(C)与第二起始剂(D)的重量比在指定范围内时,由树脂组合物制得的半固化片可具有较佳的储存稳定性及较短的所需压合时间。
1.4.其他视需要的选用成分
本发明树脂组合物可视需要进一步包含其他选用成分,例如下文将例举说明的交联剂、阻燃剂、填料及本领域现有的添加剂,以适应性改良树脂组合物在制造过程中的可加工性,或改良树脂组合物所制电子材料的物化性质。本领域现有的添加剂包括但不限于弹性体、共交联剂及固化促进剂。
[交联剂]
本文中,交联剂是指具有不饱和基团而能够与聚苯醚树脂及具马来酰亚胺结构的成分发生交联反应以形成立体网状结构的成分,不饱和基团的定义如前文所述。于本发明树脂组合物中,交联剂较佳与聚苯醚树脂及具马来酰亚胺结构的成分具有良好的相容性,以利所形成的树脂组合物于固化后可具有良好的外观。一般而言,交联剂可依据所含不饱和基团的数量而大概分为单官能型(monofunctional)交联剂及多官能型交联剂,其中单官能型交联剂仅具有一个不饱和基团,而多官能型交联剂则具有至少两个不饱和基团。于本发明的部分实施方案中,为使树脂组合物于固化后具有较高的交联密度,较佳使用多官能型交联剂。
具体言之,交联剂的实例包括但不限于多官能型烯丙基系化合物、多官能型丙烯酸酯、多官能型丙烯酰胺及多官能型苯乙烯系化合物。各交联剂可单独使用或任意组合使用。
多官能型烯丙基系化合物是指含有至少两个烯丙基的化合物。多官能型烯丙基系化合物的实例包括但不限于二烯丙基邻苯二甲酸酯(diallyl phthalate)、二烯丙基间苯二甲酸酯(diallyl isophthalate)、三烯丙基偏苯三甲酸酯(triallyl trimellitate)、三烯丙基均苯三甲酸酯(triallyl mesate)、三烯丙基异氰尿酸酯(triallyl isocyanurate,TAIC)、三烯丙基氰尿酸酯(triallyl cyanurate,TAC)及前述化合物的预聚物。
多官能型丙烯酸酯是指含有至少两个丙烯酸酯基的化合物。多官能型丙烯酸酯的实例包括但不限于三羟甲基丙烷三(甲基)丙烯酸酯(trimethylolpropane tri(meth)acrylate)、1,6-己二醇二(甲基)丙烯酸酯(1,6-hexanediol di(meth)acrylate)、乙二醇二(甲基)丙烯酸酯(ethyleneglycol di(meth)acrylate)、丙二醇二(甲基)丙烯酸酯(propyleneglycol di(meth)acrylate)、1,3-丁二醇二(甲基)丙烯酸酯(1,3-butanedioldi(meth)acrylate)、1,4-丁二醇二(甲基)丙烯酸酯(1,4-butanediol di(meth)acrylate)、环己烷二甲醇二(甲基)丙烯酸酯(cyclohexane dimethanol di(methyl)acrylate)、二乙二醇二(甲基)丙烯酸酯(diethylene glycol di(meth)acrylate)、三乙二醇二(甲基)丙烯酸酯(triethylene glycol di(meth)acrylate)及含有前述化合物的预聚物。
多官能型苯乙烯系化合物是指在芳香环上连接有至少两个烯基(alkenyl)的化合物。多官能型苯乙烯系化合物的实例包括但不限于1,3-二乙烯基苯(1,3-divinylbenzene)、1,4-二乙烯基苯(1,4-divinylbenzene)、三乙烯基苯(trivinylbenzene)、1,3-二异丙烯基苯(1,3-diisopropenylbenzene)、1,4-二异丙烯基苯(1,4-diisopropenylbenzene)、1,2-双(对乙烯基苯基)乙烷(1,2-bis(p-vinylphenyl)ethane)、1,2-双(间乙烯基苯基)乙烷(1,2-bis(m-vinylphenyl)ethane)、1-(对乙烯基苯基)-2-(间乙烯基苯基)乙烷(1-(p-vinylphenyl)-2-(m-vinylphenyl)-ethane)、1,4-双(对乙烯基苯基乙基)苯(1,4-bis(p-vinylphenylethyl)benzene)、1,4-双(间乙烯基苯基乙基)苯(1,4-bis(m-vinylphenylethyl)benzene)、1,3-双(对乙烯基苯基乙基)苯(1,3-bis(p-vinylphenylethyl)benzene)、1,3-双(间乙烯基苯基乙基)苯(1,3-bis(m-vinylphenylethyl)benzene)、1-(对乙烯基苯基乙基)-4-(间乙烯基苯基乙基)苯(1-(p-vinylphenylethyl)-4-(m-vinylphenylethyl)benzene)、1-(对乙烯基苯基乙基)-3-(间乙烯基苯基乙基)苯(1-(p-vinylphenylethyl)-3-(m-vinylphenylethyl)benzene)及含有前述化合物的预聚物。
考量到本发明树脂组合物各成分间的相容性,交联剂较佳选自以下群组:TAIC、TAC、1,3-二乙烯基苯、1,4-二乙烯基苯、1,2-双(对乙烯基苯基)乙烷、1,2-双(间乙烯基苯基)乙烷、1-(对乙烯基苯基)-2-(间乙烯基苯基)乙烷及前述的组合。于后附实施例中,是使用TAIC做为交联剂。
于本发明树脂组合物中,以100重量份的树脂固体成分计,交联剂的含量可为0重量份至40重量份,更特定而言为5重量份至35重量份,例如7重量份、10重量份、12重量份、15重量份、18重量份、20重量份、23重量份、25重量份、27重量份、30重量份或32重量份。
[阻燃剂]
树脂组合物可视需要进一步含有阻燃剂以增益所制得的电子材料的耐热性及阻燃性。阻燃剂的类型包括但不限于含磷阻燃剂、含溴阻燃剂及含氮化合物,且各类型阻燃剂可单独使用或任意组合使用。
含磷阻燃剂的实例包括但不限于磷酸酯类(phosphate ester)、磷腈类(phosphazene)、聚磷酸铵(ammonium polyphosphate)、次磷酸金属盐类(metalphosphinate)及磷酸三聚氰胺(melamine phosphate)。各含磷阻燃剂可单独使用或任意组合使用。次磷酸金属盐类的实例包括但不限于二烷基次磷酸铝、三(二乙基次磷酸)铝、三(甲基乙基次磷酸)铝、三(二苯基次磷酸)铝、双(二乙基次磷酸)锌、双(甲基乙基次磷酸)锌、双(二苯基次磷酸)锌、双(二乙基次磷酸)氧钛、双(甲基乙基次磷酸)氧钛及双(二苯基次磷酸)氧钛。商业上可购得的次磷酸金属盐包括可购自科莱恩(CLARIANT)的型号为OP935的产品。
含溴阻燃剂的实例包括但不限于四溴双酚A(tetrabromobisphenol A)、十溴二苯基氧化物(decabromodiphenyl oxide)、十溴化二苯基乙烷(decabrominated diphenylethane)、1,2-二(三溴苯基)乙烷(1,2-bis(tribromophenyl)ethane)、溴化环氧寡聚物(brominated epoxy oligomer)、八溴三甲基苯基茚(octabromotrimethylphenylindane)、双(2,3-二溴丙醚)(bis(2,3-dibromopropyl ether))、三(三溴苯基)三嗪(tris(tribromophenyl)triazine)、溴化脂肪烃(brominated aliphatic hydrocarbon)及溴化芳香烃(brominated aromatic hydrocarbon)。含氮化合物的实例包括但不限于三聚氰胺及其衍生物。
于本发明树脂组合物中,以100重量份的树脂固体成分计,阻燃剂的含量可为0重量份至30重量份,更特定而言为5重量份至25重量份,例如7重量份、10重量份、12重量份、15重量份、18重量份、20重量份或23重量份。但是本发明不限于此,本发明所属技术领域中普通技术人员可依实际需求调整。
[填料]
树脂组合物可进一步包含填料以改善所制得电子材料的机械强度、导热性及尺寸稳定性。合适的填料的实例包括但不限于选自以下群组的填料:二氧化硅、氧化镁、氢氧化镁、碳酸钙、滑石、黏土、氮化铝、氧化铝、氢氧化铝、氮化硼、氮化硅、碳化铝硅、碳化硅、碳酸钠、碳酸镁、二氧化钛、氧化锌、氧化锆、石英、钻石粉、类钻石粉、石墨、煅烧高岭土、白岭土、云母、水滑石、PTFE粉体、玻璃珠、陶瓷晶须、奈米碳管、奈米级无机粉体及前述的组合。
一般而言,以100重量份的树脂组合物的总固含量计,填料的含量可为0重量份至40重量份,例如5重量份、7重量份、10重量份、12重量份、15重量份、18重量份、20重量份、25重量份、30重量份或35重量份,但本发明不限于此,本发明所属技术领域中普通技术人员可依实际需求调整。
1.5.树脂组合物的制备
关于本发明树脂组合物的制备,可通过将树脂组合物各成分,包括末端具有不饱和基团的聚苯醚树脂、具马来酰亚胺结构的成分、第一起始剂、第二起始剂及其他选用成分,以搅拌器均匀混合并溶解或分散于溶剂中而制成清漆状的形式,供后续加工利用。所述溶剂可为任何可溶解或分散树脂组合物各成分、但不与这些成分反应的惰性溶剂。举例言之,可用以溶解或分散树脂组合物各成分的溶剂包含但不限于:甲苯、γ-丁内酯、甲乙酮、环己酮、丁酮、丙酮、二甲苯、甲基异丁基酮、N,N-二甲基甲酰胺(N,N-dimethyl formamide,DMF)、N,N-二甲基乙酰胺(N,N-dimethyl acetamide,DMAc)及N-甲基吡咯烷酮(N-methyl-pyrolidone,NMP)。各溶剂可单独使用或混合使用。溶剂的用量并无特殊限制,原则上只要能使树脂组合物各组分均匀溶解或分散于其中即可。于后附实施例中,是使用甲乙酮作为溶剂。
2.半固化片
本发明也提供一种由上述树脂组合物所制得的半固化片,其中是通过将一基材含浸于或在一基材上涂布上述的树脂组合物,并干燥该经含浸或涂布后的基材而制得。含浸或涂布树脂组合物的方法包括但不限于浸渍、辊式涂布、模具涂布、棒式涂布、凹版涂布、旋转涂布、狭缝涂布及喷雾。经含浸或涂布的基材可在80℃至180℃的温度下干燥1至20分钟,从而获得呈半固化状态(B-阶段)的半固化片。于后附实施例中,干燥是在175℃下进行2至15分钟。
常用的基材包括但不限于由选自下列群组的材料所制得的纸、布或毡:纸纤维、玻璃纤维、石英纤维、有机高分子纤维、碳纤维及前述的组合。有机高分子纤维的实例包括但不限于高模量聚丙烯(high-modulus polypropylene,HMPP)纤维、聚酰胺纤维、超高分子量聚乙烯(ultra-high molecular weight polyethylene,UHMWPE)纤维及液晶聚合物(liquid crystal polymer,LCP)。于本发明的部分实施方案中,是使用玻璃纤维布作为基材,例如E级玻璃纤维布(E-glass fiber cloth)、NE级玻璃纤维布、Q级玻璃纤维布、D级玻璃纤维布、S级玻璃纤维布及L级玻璃纤维布,且所述玻璃纤维布可为织物或非织物。于后附实施例中,是使用E级玻璃纤维布作为基材。
3.金属箔积层板及印刷电路板
本发明也提供一种由上述半固化片制得的金属箔积层板,其包含一合成层及一金属层,其中该合成层是由前文所述的半固化片提供。具体而言,本发明的金属箔积层板可通过以下方式制备:层叠多层的半固化片,接着在经层叠的半固化片所构成的合成层的至少一外侧表面层叠一金属箔(如铜箔)以提供一包含合成层及金属层的层叠物,对该层叠物进行热压操作而得到金属箔积层板。热压操作的条件可如下所述:在180℃至220℃的温度下及5公斤/平方厘米(kg/cm2)至15公斤/平方厘米的压力下,进行60至200分钟的热压。
上述金属箔积层板可通过进一步图案化其外侧的金属箔,而形成印刷电路板。
4.实施例
4.1.测量方式说明
现以下列具体实施方案进一步例示说明本发明,其中,所采用的测量仪器及方法分别如下:
[玻璃转移温度(Tg)测试]
利用动态机械分析仪(differential scanning calorimeter,DSC)来测量金属箔积层板的玻璃转移温度(Tg)。Tg的测试规范为电子电路互联与封装学会(the Institutefor Interconnecting and Packaging Electronic Circuits,IPC)的IPC-TM-650.2.4.24C及25C号检测方法。由本发明树脂组合物所制得的金属箔积层板可通过所测得的Tg来判断固化程度。具体言之,在以聚苯醚树脂与马来酰亚胺系成分为主成分的树脂组合物系统中,当Tg达到220℃时表示金属箔积层板达到全固化状态(即C-阶段(C-stage))。换言之,若通过120分钟热压操作所制得的金属箔积层板的Tg仍未能达到220℃,表示未达到全固化状态,需要更长的压合时间。
[耐浸焊性测试]
将干燥过的金属箔积层板在288℃的锡焊浴中浸泡20秒后取出,重复上述浸泡-取出动作,并观察是否出现爆板情形,例如观察金属箔积层板是否产生分层或胀泡情形。纪录金属箔积层板出现爆板情形的浸泡次数。
[介电常数(Dk)与介电耗损因子(Df)测试]
根据IPC-TM-650 2.5.5.13规范,在工作频率10GHz下,测量介电层(树脂含量(resin content,RC)为70%)的介电常数(Dk)与介电耗损因子(Df),所述介电层是指将金属箔积层板的双面金属箔蚀刻去除所得之物。
[动态黏度测试]
对刚制备完成的半固化片及分别放置1周至11周后的半固化片搓揉以产生粉末,取0.45克的粉末并置于流变仪(型号:HR-1,由TA仪器(TA Instrument)制造)中进行动态黏度的测量。分别放置1周至11周后的半固化片的测量间隔为一周,即,依以下间隔测量:放置1周后、放置2周后、…、放置10周后、放置11周后。测量条件如下:升温速率为2.5℃/分钟,测量温度范围为50℃至180℃,取最低黏度值并记录。动态黏度的单位为「帕.秒(Pa·s)」。
4.2.实施例及比较例用的原物料资讯列表
表1:原物料资讯列表
4.3.树脂组合物的制备
以表2-1至表2-3所示的比例配制实施例1至6及比较例1至8的树脂组合物,其中将各成分于室温下使用搅拌器混合,并加入MEK作为溶剂,接着将所得混合物于室温下搅拌60至120分钟后,制得各树脂组合物。
表2-1:实施例的树脂组合物的组成
表2-2:比较例1至4的树脂组合物的组成
表2-3:比较例5至8的树脂组合物的组成
4.4.半固化片与金属箔积层板的制备及性质测量
分别使用实施例1至6及比较例1至8的树脂组合物来制备半固化片与金属箔积层板。首先,通过辊式涂布机,将玻璃纤维布(型号:2116,厚度:0.09毫米)分别浸渍于实施例1至6及比较例1至8的树脂组合物中,并控制玻璃纤维布的厚度至合适程度。接着,将浸渍后的玻璃纤维布置于175℃的干燥机中加热干燥2至15分钟,借此制得半固化状态(B阶段)的半固化片(半固化片的树脂含量为70%)。之后,将四片半固化片层合,并在其两侧的最外层各层合一张0.5盎司的铜箔,随后置于热压机中进行高温热压固化。热压条件为:以3.0℃/分钟的升温速度升温至200℃,并在200℃下,以全压15公斤/平方厘米(初压8公斤/平方厘米)的压力热压120分钟。借此制得金属箔积层板。
依照前文所载测量方法测量实施例1至6及比较例1至8的半固化片与金属箔积层板的各项性质,包括动态黏度、Tg、耐浸焊性、Dk及Df,并将结果纪录于表3-1、表3-2、表4-1及表4-2中。
表3-1:实施例的半固化片的动态黏度
表3-2:实施例的半固化片与金属箔积层板的性质
表4-1:比较例的半固化片的动态黏度
表4-2:比较例的半固化片与金属箔积层板的性质
如表3-1及表3-2所示,采用本发明树脂组合物所制得的电子材料在所有物化性质及介电性质(如Dk、Df、耐浸焊性等)表现上均可达到令人满意的程度。尤其,采用本发明树脂组合物所制得的半固化片可同时具备良好的储存稳定性(即,较低的长期动态黏度变化率)及较短的所需压合时间(120分钟压合后Tg均达220℃以上,显示已达到全固化状态,即C-阶段)。此外,实施例1、2、3及5与实施例4及6的比较显示,当第一1分钟半衰期温度高于第二1分钟半衰期温度20℃至35℃时,所制得的半固化片的长期动态黏度变化率可被进一步降低,也即储存稳定性可被进一步改善。
相较之下,如表4-1及表4-2所示,采用非本发明树脂组合物所制得的半固化片并无法同时具备良好的储存稳定性及较短的所需压合时间,也即,在储存稳定性及压合时间二者之间无法取得适当平衡,无法提供本发明的功效。具体言之,比较例1及2显示,当树脂组合物仅包含一种起始剂时,所制得的半固化片无法同时具备良好的储存稳定性及较短的所需压合时间。比较例3、4、7及8显示,在树脂组合物包含两种起始剂的情况下,若第一1分钟半衰期温度与第二1分钟半衰期温度的差超出本发明指定的范围时,即使第一1分钟半衰期温度在指定范围内,所制得的半固化片仍无法同时具备良好的储存稳定性及较短的所需压合时间。此外,比较例5及6显示,在树脂组合物包含两种起始剂的情况下,若第一1分钟半衰期温度高于或低于本发明指定的范围时,即使第一1分钟半衰期温度与第二1分钟半衰期温度的差在指定范围内,所制得的半固化片仍无法同时具备良好的储存稳定性及较短的所需压合时间。以上实验结果充分显示,本发明树脂组合物通过特定成分组合,包括具特定半衰期温度条件的起始剂,确实可提供非预期的效果。
上述实施例仅为例示性说明本发明的原理及其功效,并阐述本发明的技术特征,而非用于限制本发明的保护范畴。任何本领域技术人员在不违背本发明的技术原理及精神下,可轻易完成的改变或安排,均属本发明所主张的范围。因此,本发明的权利保护范围如权利要求书所列。
Claims (13)
1.一种树脂组合物,其特征在于,包含:
(A)末端具有不饱和基团的聚苯醚树脂;
(B)具马来酰亚胺结构的成分;
(C)第一起始剂,该第一起始剂具有第一1分钟半衰期温度;以及
(D)第二起始剂,该第二起始剂具有第二1分钟半衰期温度,
其中第一1分钟半衰期温度高于第二1分钟半衰期温度20℃至50℃,且第一1分钟半衰期温度为170℃至220℃。
2.如权利要求1所述的树脂组合物,其特征在于,其中第一1分钟半衰期温度高于第二1分钟半衰期温度21℃至35℃。
3.如权利要求1所述的树脂组合物,其特征在于,其中该第一起始剂(C)对该第二起始剂(D)的重量比为6:1至1:6。
5.如权利要求1所述的树脂组合物,其特征在于,其中该具马来酰亚胺结构的成分(B)是选自以下群组:1,2-双马来酰亚胺基乙烷、1,6-双马来酰亚胺基己烷、1,3-双马来酰亚胺基苯、1,4-双马来酰亚胺基苯、2,4-双马来酰亚胺基甲苯、4,4'-双马来酰亚胺基二苯基甲烷、4,4'-双马来酰亚胺基二苯基醚、3,3'-双马来酰亚胺基二苯基砜、4,4'-双马来酰亚胺基二苯基砜、4,4'-双马来酰亚胺基二环己基甲烷、3,5-双(4-马来酰亚胺基苯基)吡啶、2,6-双马来酰亚胺基吡啶、1,3-双(马来酰亚胺基甲基)环己烷、1,3-双(马来酰亚胺基甲基)苯、1,1-双(4-马来酰亚胺基苯基)环己烷、1,3-双(二氯马来酰亚胺基)苯、4,4'-双柠康酰亚胺基二苯基甲烷、2,2-双(4-马来酰亚胺基苯基)丙烷、1-苯基-1,1-双(4-马来酰亚胺基苯基)乙烷、3,3'-二甲基-5,5'-二乙基-4,4'-二苯甲烷基双马来酰亚胺、α,α-双(4-马来酰亚胺基苯基)甲苯、3,5-双马来酰亚胺基-1,2,4-三唑、N,N'-伸乙基双马来酰亚胺、N,N'-六亚甲基双马来酰亚胺、N,N'-间-伸苯基双马来酰亚胺、N,N'-对-伸苯基双马来酰亚胺、N,N'-4,4'-二苯基甲烷双马来酰亚胺、N,N'-4,4'-二苯基醚双马来酰亚胺、N,N'-4,4'-二苯基砜双马来酰亚胺、N,N'-4,4'-二环己基甲烷双马来酰亚胺、N,N'-α,α'-4,4'-二亚甲基环己烷双马来酰亚胺、N,N'-间二甲苯双马来酰亚胺、N,N'-4,4'-二苯基环己烷双马来酰亚胺、N,N'-亚甲基双(3-氯-对-伸苯基)双马来酰亚胺及前述的组合。
6.如权利要求1所述的树脂组合物,其特征在于,该第一起始剂(C)选自以下群组:4,4-二(三级丁基过氧化)戊酸正丁酯、过氧化三级丁基异丙苯、过氧化二异丙苯、1,3-双-(2-三级丁基过氧化异丙基)苯、2,5-二甲基-2,5-二-(三级丁基过氧化)己烷、二-三级丁基过氧化物、2,5-二甲基-2,5-二(三级丁基过氧化)-3-己炔、氢过氧化二异丙基苯、氢过氧化对薄荷烷及前述的组合。
7.如权利要求1所述的树脂组合物,其特征在于,该第二起始剂(D)选自以下群组:2,5-二甲基-2,5-二(2-乙基己酰基过氧化)己烷、1,1,3,3-四甲基丁基过氧化-2-乙基己酸酯、过氧化三级戊基-2-乙基己酸酯、过氧化二苯甲酰、三级己基过氧化-2-乙基己酸酯、三级丁基过氧化-2-乙基己酸酯、过氧化三级丁基异丁酸酯、1,1-二(三级丁基过氧化)-3,3,5-三甲基环己烷、1,1-二(三级己基过氧化)环己烷、过氧化三级戊基2-乙基己基碳酸酯、1,1-二(三级丁基过氧化)环己烷、三级丁基过氧化异丙基碳酸酯、2,2-二(三级丁基过氧化)丁烷、三级丁基过氧化醋酸酯、三级丁基过氧化-2-乙基己基碳酸酯、过氧化三级丁基-3,3,5-三甲基己酸酯、三级丁基过氧化苯甲酸酯、二-三级戊基过氧化物、过氧化三级丁基异丙苯、过氧化二异丙苯、1,3-双-(2-三级丁基过氧化异丙基)苯、2,5-二甲基-2,5-二(三级丁基过氧化)己烷、二-三级丁基过氧化物、2,5-二甲基-2,5-二(三级丁基过氧化)-3-己炔及前述的组合。
8.如权利要求1至7中任一项所述的树脂组合物,其特征在于,还包含选自以下群组的交联剂:多官能型烯丙基系化合物、多官能型丙烯酸酯、多官能型丙烯酰胺、多官能型苯乙烯系化合物及前述的组合。
9.如权利要求1至7中任一项所述的树脂组合物,其特征在于,还包含选自以下群组的阻燃剂:含磷阻燃剂、含溴阻燃剂、含氮化合物及前述的组合。
10.如权利要求1至7中任一项所述的树脂组合物,其特征在于,还包含选自以下群组的填料:二氧化硅、氧化镁、氢氧化镁、碳酸钙、滑石、黏土、氮化铝、氧化铝、氢氧化铝、氮化硼、氮化硅、碳化铝硅、碳化硅、碳酸钠、碳酸镁、二氧化钛、氧化锌、氧化锆、石英、钻石粉、类钻石粉、石墨、煅烧高岭土、白岭土、云母、水滑石、聚四氟乙烯粉体、玻璃珠、陶瓷晶须、奈米碳管、奈米级无机粉体及前述的组合。
11.一种半固化片,其特征在于,其是将一基材含浸于或在一基材上涂布如权利要求1至10中任一项所述的树脂组合物,并干燥经含浸或涂布的基材而制得。
12.一种金属箔积层板,其特征在于,其是将如权利要求11所述的半固化片与金属箔加以层合而制得。
13.一种印刷电路板,其特征在于,其是使用如权利要求12所述的金属箔积层板制得。
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