JPH0575032B2 - - Google Patents
Info
- Publication number
- JPH0575032B2 JPH0575032B2 JP17534586A JP17534586A JPH0575032B2 JP H0575032 B2 JPH0575032 B2 JP H0575032B2 JP 17534586 A JP17534586 A JP 17534586A JP 17534586 A JP17534586 A JP 17534586A JP H0575032 B2 JPH0575032 B2 JP H0575032B2
- Authority
- JP
- Japan
- Prior art keywords
- formula
- epoxy resin
- ethyl
- ink composition
- resist ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Epoxy Resins (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61175345A JPS6330578A (ja) | 1986-07-24 | 1986-07-24 | エポキシ樹脂系レジストインク組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61175345A JPS6330578A (ja) | 1986-07-24 | 1986-07-24 | エポキシ樹脂系レジストインク組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6330578A JPS6330578A (ja) | 1988-02-09 |
JPH0575032B2 true JPH0575032B2 (enrdf_load_stackoverflow) | 1993-10-19 |
Family
ID=15994441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61175345A Granted JPS6330578A (ja) | 1986-07-24 | 1986-07-24 | エポキシ樹脂系レジストインク組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6330578A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018081985A (ja) * | 2016-11-15 | 2018-05-24 | 株式会社京写 | プリント配線板 |
US10759890B2 (en) | 2013-09-30 | 2020-09-01 | Taiyo Ink Mfg. Co., Ltd. | Curable composition for printed circuit board, and cured coating film and printed circuit board incorporating same |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11302401A (ja) * | 1998-04-17 | 1999-11-02 | Matsushita Electric Works Ltd | エポキシ樹脂組成物およびこのエポキシ樹脂組成物を用いた絶縁基板 |
WO2006038262A1 (ja) * | 2004-09-30 | 2006-04-13 | Ceramission Co., Ltd. | ソルダーレジスト塗料、その硬化物及びその被膜を備えたプリント配線板 |
JP2006229127A (ja) * | 2005-02-21 | 2006-08-31 | Showa Denko Kk | ソルダーレジスト用熱硬化性組成物及びその硬化物 |
JP6540963B2 (ja) * | 2016-02-09 | 2019-07-10 | 株式会社ナノマテックス | 受け治具及び受け治具の製造方法 |
-
1986
- 1986-07-24 JP JP61175345A patent/JPS6330578A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10759890B2 (en) | 2013-09-30 | 2020-09-01 | Taiyo Ink Mfg. Co., Ltd. | Curable composition for printed circuit board, and cured coating film and printed circuit board incorporating same |
JP2018081985A (ja) * | 2016-11-15 | 2018-05-24 | 株式会社京写 | プリント配線板 |
Also Published As
Publication number | Publication date |
---|---|
JPS6330578A (ja) | 1988-02-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6432541B1 (en) | Resin composition of polyepoxide and polyisocyanate, prepreg, and metallic foil laminate | |
JP6196621B2 (ja) | 銀被覆粒子含有導電性接着剤 | |
JP6392273B2 (ja) | エポキシ樹脂組成物およびその利用 | |
KR20060108508A (ko) | 난연성 접착제 조성물 및 그것을 이용한 접착 시트,커버레이 필름 및 가요성 동장 적층판 | |
KR20060108506A (ko) | 난연성 접착제 조성물 및 그것을 이용한 접착 시트,커버레이 필름 및 가요성 동장 적층판 | |
CN109415613B (zh) | 粘合剂组合物以及使用其的覆盖膜、挠性覆铜层压板和粘合片 | |
KR100632169B1 (ko) | 다층 인쇄 회로 기판용 층간 절연 접착제 | |
US20070299218A1 (en) | Solder-resistant flexible thermosetting epoxy resin system | |
JP2010222408A (ja) | フレキシブルプリント配線板用樹脂組成物、樹脂フィルム、プリプレグ、樹脂付き金属箔、フレキシブルプリント配線板 | |
JP5974134B2 (ja) | エポキシ樹脂を調製するためのオリゴマー性ハロゲン化鎖延長剤 | |
JP3810954B2 (ja) | 難燃性接着剤組成物、フレキシブル銅張積層板、カバーレイおよび接着剤フィルム | |
JPH0575032B2 (enrdf_load_stackoverflow) | ||
JP3975728B2 (ja) | 導電性接着剤及びそれを用いた半導体等の回路基板 | |
EP0166588B1 (en) | Epoxy resin composition | |
JP4087468B2 (ja) | 接着剤組成物 | |
JP2006241365A (ja) | 導電性接着剤 | |
JPWO2016121668A1 (ja) | 導電性ペースト | |
KR20030061445A (ko) | 적층판 또는 프리프레그용 바니시, 이 바니시로부터얻어지는 적층판 또는 프리프레그 및 이 적층판 또는프리프레그를 사용한 프린트 배선판 | |
JP2001011415A (ja) | フレキシブルプリント配線板用接着剤組成物 | |
JPS61221279A (ja) | 金属及びフレキシブルフイルム用一液型絶縁性接着剤 | |
JP2004339279A (ja) | 樹脂組成物およびフレキシブルプリント配線板 | |
JP3017562B2 (ja) | 配線基板用エポキシ樹脂組成物 | |
EP3227355A1 (en) | Conductive adhesive composition | |
JPS6176579A (ja) | 耐燃性接着剤組成物 | |
JPH1161073A (ja) | 接着剤組成物 |