JPH0574964B2 - - Google Patents
Info
- Publication number
- JPH0574964B2 JPH0574964B2 JP11341384A JP11341384A JPH0574964B2 JP H0574964 B2 JPH0574964 B2 JP H0574964B2 JP 11341384 A JP11341384 A JP 11341384A JP 11341384 A JP11341384 A JP 11341384A JP H0574964 B2 JPH0574964 B2 JP H0574964B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric element
- cylindrical body
- conductive
- rectangular piezoelectric
- rectangular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 8
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11341384A JPS60256210A (ja) | 1984-06-01 | 1984-06-01 | チツプ形圧電共振子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11341384A JPS60256210A (ja) | 1984-06-01 | 1984-06-01 | チツプ形圧電共振子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60256210A JPS60256210A (ja) | 1985-12-17 |
| JPH0574964B2 true JPH0574964B2 (US07714131-20100511-C00038.png) | 1993-10-19 |
Family
ID=14611632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11341384A Granted JPS60256210A (ja) | 1984-06-01 | 1984-06-01 | チツプ形圧電共振子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60256210A (US07714131-20100511-C00038.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2689766B2 (ja) * | 1991-05-22 | 1997-12-10 | 株式会社村田製作所 | チップ型圧電共振子の製造方法 |
-
1984
- 1984-06-01 JP JP11341384A patent/JPS60256210A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60256210A (ja) | 1985-12-17 |
