JPH0574964B2 - - Google Patents
Info
- Publication number
- JPH0574964B2 JPH0574964B2 JP11341384A JP11341384A JPH0574964B2 JP H0574964 B2 JPH0574964 B2 JP H0574964B2 JP 11341384 A JP11341384 A JP 11341384A JP 11341384 A JP11341384 A JP 11341384A JP H0574964 B2 JPH0574964 B2 JP H0574964B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric element
- cylindrical body
- conductive
- rectangular piezoelectric
- rectangular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 description 8
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明はチツプ形圧電共振子の中でも、主とし
てLSI、マイクロコンピユータ応用分野での基準
信号発生用の発振子や、テレビジヨン受像機、ビ
デオテープレコーダ等の映像機器分野のSIF帯信
号処理用のトラツプ、デイスクリミネータとして
使用されるものに関する。[Detailed Description of the Invention] Industrial Fields of Use The present invention is particularly applicable to chip-type piezoelectric resonators, which are mainly applied to LSI and microcomputer application fields, such as reference signal generation oscillators, television receivers, video tape recorders, etc. This invention relates to traps and discriminators for SIF band signal processing in the field of video equipment.
従来例の構成とその問題点
従来、この種の用途に使用される圧電共振子は
第１図〜第３図のように構成されている。つま
り、第１図に示すように、矩形状圧電素子１の対
向する面ａ，ｂにはそれぞれ端部，からそれ
ぞれ他端に向つて電極２ａ，２ｂを設け、面ａ，
ｂには電極２ａ，２ｂが設けられていない余白部
３ａ，３ｂが形成されている。Conventional Structure and its Problems Conventionally, a piezoelectric resonator used for this type of application has been structured as shown in FIGS. 1 to 3. That is, as shown in FIG. 1, electrodes 2a and 2b are provided on opposing surfaces a and b of a rectangular piezoelectric element 1 from one end to the other end, respectively, and
Margin portions 3a and 3b where the electrodes 2a and 2b are not provided are formed in b.
この圧電素子１を第２図に示すように両端部に
導通部４ａ，４ｂが形成されたプリント基板５に
載置して半田または導電性接着剤６ａ，６ｂで固
定して電極２ａと導通部４ａ、電極２ｂと導通部
４ｂとが電気的に接続されている。なお、７ａ，
７ｂは導通部４ａ，４ｂに半田付け等により接続
されたリード線である。 As shown in FIG. 2, this piezoelectric element 1 is placed on a printed circuit board 5 with conductive parts 4a and 4b formed at both ends, and fixed with solder or conductive adhesive 6a and 6b to connect the electrode 2a and the conductive parts. 4a, the electrode 2b and the conductive portion 4b are electrically connected. In addition, 7a,
7b is a lead wire connected to the conductive portions 4a, 4b by soldering or the like.
第２図のように組み上つたものを第３図のよう
にリード線７ａ，７ｂの根元まで全体が外装保護
されている。 As shown in FIG. 3, the assembly assembled as shown in FIG. 2 is protected entirely up to the base of the lead wires 7a and 7b.
しかし、このようなこの構造では外装のために
部品形状が大きくなる欠点があり、回路の実装密
度を高めることが困難であつた。また、リード線
７ａ，７ｂがあるため自動挿入に適さないのが現
状である。 However, this structure has the disadvantage that the shape of the components becomes large due to the exterior packaging, and it has been difficult to increase the packaging density of the circuit. Furthermore, because of the presence of lead wires 7a and 7b, it is currently not suitable for automatic insertion.
発明の目的
本発明は従来のリード線を無くして自動挿入機
での取扱いも他のチツプ部品と同様に行えるよう
にすると共に、高信頼性で、しかも実装密度を高
めることができるチツプ形圧電共振子を提供する
ことを目的とする。Purpose of the Invention The present invention provides a chip-type piezoelectric resonator that eliminates conventional lead wires, allows it to be handled in the same way as other chip parts by an automatic insertion machine, and also provides high reliability and increases packaging density. The purpose is to provide children.
発明の構成
本発明のチツプ形圧電共振子は、矩形状圧電素
子と、内周面の対向する位置に長手方向に沿つて
溝が形成された筒状体と、この筒状体の両端に装
着される導電性キヤツプとを設けると共に、前記
溝の幅を矩形状圧電素子の厚みよりも若干大きく
形成してこの溝に矩形状圧電素子を挿入し、矩形
状圧電素子の電極をそれぞれ前記導電性キヤツプ
に接続したことを特徴とする。Structure of the Invention The chip-shaped piezoelectric resonator of the present invention includes a rectangular piezoelectric element, a cylindrical body in which grooves are formed along the longitudinal direction at opposing positions on the inner peripheral surface, and a cylindrical body attached to both ends of the cylindrical body. The width of the groove is formed to be slightly larger than the thickness of the rectangular piezoelectric element, the rectangular piezoelectric element is inserted into this groove, and the electrodes of the rectangular piezoelectric element are connected to the conductive cap, respectively. It is characterized by being connected to a cap.
実施例の説明
以下、本発明の一実施例を第４図〜第６図に基
づいて説明する。なお、使用される圧電素子は従
来と同じであるためその説明を省く。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 4 to 6. Note that the piezoelectric element used is the same as the conventional one, so its explanation will be omitted.
第４図ｂは筒状体８の構成を示す。この筒状体
８は絶縁磁器またはプラスチツク等で形成されて
おり、内周面の対向する位置には筒状体８の長手
方向に沿つて溝９，１０が形成されている。この
溝９，１０の幅Ｗは矩形状圧電素子１の厚みｔよ
りも若干大きく形成されている。 FIG. 4b shows the structure of the cylindrical body 8. This cylindrical body 8 is made of insulating porcelain, plastic, or the like, and grooves 9 and 10 are formed along the longitudinal direction of the cylindrical body 8 at opposing positions on its inner peripheral surface. The width W of the grooves 9 and 10 is slightly larger than the thickness t of the rectangular piezoelectric element 1.
第５図は分解斜視図を示し、組立て時には、溝
９，１０に沿つて圧電素子１を筒状体８に挿入
し、この圧電素子１の挿入された筒状体８の両端
に金属キヤツプ１１，１２を圧着挿入して、圧電
素子１の電極２ａと金属キヤツプ１１、電極２ｂ
と金属キヤツプ１２とを電気的に接続する。 FIG. 5 shows an exploded perspective view. During assembly, the piezoelectric element 1 is inserted into the cylindrical body 8 along the grooves 9 and 10, and metal caps 11 are attached to both ends of the cylindrical body 8 into which the piezoelectric element 1 is inserted. , 12 are crimped and inserted to connect the electrode 2a of the piezoelectric element 1, the metal cap 11, and the electrode 2b.
and the metal cap 12 are electrically connected.
なお、金属キヤツプ１１，１２と電極２ａ，２
ｂとの具体的な接続方法は、例えば金属キヤツプ
１１，１２の内側に導電性ゴムを入れて筒状体８
に装着して導電性ゴムを介して電気的に接続した
り、導電性ゴムに代つて導電性接着剤を金属キヤ
ツプ１１，１２の内側に塗布して筒状体８に装着
して電気的に接続したり、金属キヤツプ１１，１
２の内側にハンダペーストを塗布して筒状体に装
着して加熱して半田で電気的に接続したりするこ
とができる。第６図は仕上り形状を示す。 Note that the metal caps 11 and 12 and the electrodes 2a and 2
For example, conductive rubber is placed inside the metal caps 11 and 12, and the cylindrical body 8 is connected to the cylindrical body 8.
It can be attached to the cylindrical body 8 and connected electrically via conductive rubber, or it can be attached to the cylindrical body 8 by applying a conductive adhesive to the inside of the metal caps 11 and 12 instead of the conductive rubber. Connect or metal cap 11,1
It is possible to apply solder paste to the inside of 2, attach it to a cylindrical body, heat it, and connect it electrically with solder. Figure 6 shows the finished shape.
上記実施例において筒状体８は円筒状であつた
が、これは第４ａ図に示すような筒状体であつて
も同様である。 In the above embodiment, the cylindrical body 8 is cylindrical, but the same applies to a cylindrical body as shown in FIG. 4a.
発明の効果
以上説明のように本発明のチツプ形圧電共振子
によると、筒状体の両端に導電性キヤツプを装着
してその中に矩形状圧電素子を配設し、圧電素子
の電極を前記導電性キヤツプに接続したため、小
型で、しかも従来のようなリード線を無くするこ
とができ、実装密度を高められると共に、抵抗や
コンデンサのようなチツプ部品と同様に自動挿入
機による自動実装が可能となる。また、筒状体内
部に配設された圧電素子は筒状体内周面の溝によ
つてその位置が規制された安定した構造であつ
て、その信頼性を高いものとしている。Effects of the Invention As explained above, according to the chip-type piezoelectric resonator of the present invention, conductive caps are attached to both ends of a cylindrical body, a rectangular piezoelectric element is disposed therein, and the electrodes of the piezoelectric element are connected to the conductive caps. Because it is connected to a conductive cap, it is compact and can eliminate the conventional lead wires, increasing packaging density and allowing automatic mounting using an automatic insertion machine in the same way as chip components such as resistors and capacitors. becomes. Furthermore, the piezoelectric element disposed inside the cylindrical body has a stable structure in which its position is regulated by grooves on the circumferential surface of the cylindrical body, making the piezoelectric element highly reliable.
第１図は矩形状圧電素子の拡大斜視図、第２図
は従来の圧電共振子の外装前の斜視図、第３図は
従来の圧電共振子の外装後の正面図、第４図〜第
６図は本発明の実施例を示し、第４図ａ，ｂはそ
れぞれ筒状体の拡大斜視図、第５図は拡大分解斜
視図、第６図は組立て完了後の拡大外観斜視図で
ある。
１……矩形状圧電素子、２ａ，２ｂ……電極、
８……筒状体、９，１０……溝、１１，１２……
金属キヤツプ〔導電性キヤツプ〕。
Fig. 1 is an enlarged perspective view of a rectangular piezoelectric element, Fig. 2 is a perspective view of a conventional piezoelectric resonator before being packaged, Fig. 3 is a front view of a conventional piezoelectric resonator after being packaged, and Figs. 6 shows an embodiment of the present invention, FIGS. 4a and 4b are enlarged perspective views of the cylindrical body, FIG. 5 is an enlarged exploded perspective view, and FIG. 6 is an enlarged external perspective view after assembly is completed. . 1... Rectangular piezoelectric element, 2a, 2b... Electrode,
8... Cylindrical body, 9, 10... Groove, 11, 12...
Metal cap (conductive cap).
Claims (1)
長手方向に沿つて溝が形成された筒状体と、この
筒状体の両端に装着される導電性キヤツプとを設
けると共に、前記溝の幅を矩形状圧電素子の厚み
よりも若干大きく形成してこの溝に矩形状圧電素
子を挿入し、矩形状圧電素子の電極をそれぞれ前
記導電性キヤツプに接続したチツプ形圧電共振
子。 ２ 矩形状圧電素子の電極と導電性キヤツプと
を、導電性ゴム、導電性接着剤または半田付によ
つて接続したことを特徴とする特許請求の範囲第
１項記載のチツプ形圧電共振子。[Scope of Claims] 1. A rectangular piezoelectric element, a cylindrical body in which grooves are formed along the longitudinal direction at opposing positions on the inner peripheral surface, and conductive caps attached to both ends of the cylindrical body. and the width of the groove is formed to be slightly larger than the thickness of the rectangular piezoelectric element, the rectangular piezoelectric element is inserted into this groove, and the electrodes of the rectangular piezoelectric element are respectively connected to the conductive cap. Piezoelectric resonator. 2. The chip-shaped piezoelectric resonator according to claim 1, wherein the electrode of the rectangular piezoelectric element and the conductive cap are connected by conductive rubber, conductive adhesive, or soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11341384A JPS60256210A (en) | 1984-06-01 | 1984-06-01 | Chip type piezoelectric resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11341384A JPS60256210A (en) | 1984-06-01 | 1984-06-01 | Chip type piezoelectric resonator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60256210A JPS60256210A (en) | 1985-12-17 |
| JPH0574964B2 true JPH0574964B2 (en) | 1993-10-19 |
Family
ID=14611632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11341384A Granted JPS60256210A (en) | 1984-06-01 | 1984-06-01 | Chip type piezoelectric resonator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60256210A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2689766B2 (en) * | 1991-05-22 | 1997-12-10 | 株式会社村田製作所 | Method of manufacturing chip-type piezoelectric resonator |
-
1984
- 1984-06-01 JP JP11341384A patent/JPS60256210A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60256210A (en) | 1985-12-17 |
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