JPH0574935B2 - - Google Patents

Info

Publication number
JPH0574935B2
JPH0574935B2 JP59214099A JP21409984A JPH0574935B2 JP H0574935 B2 JPH0574935 B2 JP H0574935B2 JP 59214099 A JP59214099 A JP 59214099A JP 21409984 A JP21409984 A JP 21409984A JP H0574935 B2 JPH0574935 B2 JP H0574935B2
Authority
JP
Japan
Prior art keywords
molybdenum
punching
plate
cracks
hardness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59214099A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6193633A (ja
Inventor
Hideyuki Kameyasu
Akira Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Tungsten Co Ltd
Original Assignee
Tokyo Tungsten Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Tungsten Co Ltd filed Critical Tokyo Tungsten Co Ltd
Priority to JP59214099A priority Critical patent/JPS6193633A/ja
Publication of JPS6193633A publication Critical patent/JPS6193633A/ja
Publication of JPH0574935B2 publication Critical patent/JPH0574935B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Punching Or Piercing (AREA)
  • Die Bonding (AREA)
JP59214099A 1984-10-15 1984-10-15 半導体基板用モリブデン板の製造方法 Granted JPS6193633A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59214099A JPS6193633A (ja) 1984-10-15 1984-10-15 半導体基板用モリブデン板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59214099A JPS6193633A (ja) 1984-10-15 1984-10-15 半導体基板用モリブデン板の製造方法

Publications (2)

Publication Number Publication Date
JPS6193633A JPS6193633A (ja) 1986-05-12
JPH0574935B2 true JPH0574935B2 (cs) 1993-10-19

Family

ID=16650205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59214099A Granted JPS6193633A (ja) 1984-10-15 1984-10-15 半導体基板用モリブデン板の製造方法

Country Status (1)

Country Link
JP (1) JPS6193633A (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2567104Y2 (ja) * 1991-07-26 1998-03-30 京セラ株式会社 半導体素子収納用パッケージ

Also Published As

Publication number Publication date
JPS6193633A (ja) 1986-05-12

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