JPH057479B2 - - Google Patents
Info
- Publication number
- JPH057479B2 JPH057479B2 JP18487286A JP18487286A JPH057479B2 JP H057479 B2 JPH057479 B2 JP H057479B2 JP 18487286 A JP18487286 A JP 18487286A JP 18487286 A JP18487286 A JP 18487286A JP H057479 B2 JPH057479 B2 JP H057479B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- arm
- current
- carrying
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 20
- 230000000694 effects Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18487286A JPS6342398A (ja) | 1986-08-06 | 1986-08-06 | リードフレームのめっき用給電支持装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18487286A JPS6342398A (ja) | 1986-08-06 | 1986-08-06 | リードフレームのめっき用給電支持装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6342398A JPS6342398A (ja) | 1988-02-23 |
JPH057479B2 true JPH057479B2 (enrdf_load_stackoverflow) | 1993-01-28 |
Family
ID=16160787
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18487286A Granted JPS6342398A (ja) | 1986-08-06 | 1986-08-06 | リードフレームのめっき用給電支持装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6342398A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0526457U (ja) * | 1991-09-06 | 1993-04-06 | シオジマ企画株式会社 | 印影保護シール |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6695264B2 (ja) * | 2016-12-05 | 2020-05-20 | 三菱電機株式会社 | めっき装置、めっき方法およびめっき製品の製造方法 |
-
1986
- 1986-08-06 JP JP18487286A patent/JPS6342398A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0526457U (ja) * | 1991-09-06 | 1993-04-06 | シオジマ企画株式会社 | 印影保護シール |
Also Published As
Publication number | Publication date |
---|---|
JPS6342398A (ja) | 1988-02-23 |
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