JPH057471B2 - - Google Patents
Info
- Publication number
- JPH057471B2 JPH057471B2 JP2767187A JP2767187A JPH057471B2 JP H057471 B2 JPH057471 B2 JP H057471B2 JP 2767187 A JP2767187 A JP 2767187A JP 2767187 A JP2767187 A JP 2767187A JP H057471 B2 JPH057471 B2 JP H057471B2
- Authority
- JP
- Japan
- Prior art keywords
- conductor roll
- metal
- roll
- plating
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2767187A JPS63195293A (ja) | 1987-02-09 | 1987-02-09 | 水平型電気メッキ装置用コンダクタ−ロ−ルの付着金属の除去方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2767187A JPS63195293A (ja) | 1987-02-09 | 1987-02-09 | 水平型電気メッキ装置用コンダクタ−ロ−ルの付着金属の除去方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63195293A JPS63195293A (ja) | 1988-08-12 |
| JPH057471B2 true JPH057471B2 (enrdf_load_stackoverflow) | 1993-01-28 |
Family
ID=12227411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2767187A Granted JPS63195293A (ja) | 1987-02-09 | 1987-02-09 | 水平型電気メッキ装置用コンダクタ−ロ−ルの付着金属の除去方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63195293A (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2719030B2 (ja) * | 1990-05-11 | 1998-02-25 | 川崎製鉄株式会社 | 金属帯の表面処理方法 |
| DE102009023767A1 (de) * | 2009-05-22 | 2010-11-25 | Hübel, Egon, Dipl.-Ing. (FH) | Vorrichtung und Verfahren zum elektrischen Kontaktieren von Gut in Galvanisieranlagen |
| DE102009057466A1 (de) * | 2009-12-03 | 2011-06-09 | Hübel, Egon, Dipl.-Ing. (FH) | Vorrichtung und Verfahren zum elektrischen Kontaktieren von Behandlungsgut in Galvanisieranlagen |
-
1987
- 1987-02-09 JP JP2767187A patent/JPS63195293A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63195293A (ja) | 1988-08-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4568431A (en) | Process for producing electroplated and/or treated metal foil | |
| US4529486A (en) | Anode for continuous electroforming of metal foil | |
| JP2000256898A (ja) | ウェーハの銅めっき方法 | |
| JPH08120499A (ja) | 液中集電法によるプリント回路用銅箔表面処理方法 | |
| US5360525A (en) | Apparatus for making metal foil | |
| JPH057471B2 (enrdf_load_stackoverflow) | ||
| JPH0524377A (ja) | 平版印刷版用支持体の陽極酸化方法 | |
| JPH05125597A (ja) | 平版印刷版用支持体の陽極酸化装置及び陽極酸化方法 | |
| JP2659911B2 (ja) | 金属箔の製造方法 | |
| EP0771370B1 (en) | Process for electrochemically dissolving a metal such as zinc or tin | |
| JP2659910B2 (ja) | カソード体表面への陽極酸化皮膜形成装置 | |
| US6270648B1 (en) | Process and apparatus for the manufacture of high peel-strength copper foil useful in the manufacture of printed circuit boards, and laminates made with such foil | |
| KR102333203B1 (ko) | 금속 박판 제조장치 | |
| JP2001140100A (ja) | 金属板電解処理装置及び金属板電解処理用電極 | |
| JP4465084B2 (ja) | 銅箔の製造方法及び製造装置 | |
| US4236977A (en) | Method for preplating steel surfaces | |
| EP0181430A1 (en) | Systems for producing electroplated and/or treated metal foil | |
| JPH01162798A (ja) | 電気めっき用コンダクターロールの付着金属除去装置 | |
| US5314607A (en) | Apparatus and method for anodizing supports for lithographic printing plate | |
| JPH11269688A (ja) | 電解用電極 | |
| JPH0885894A (ja) | 電 極 | |
| JPS5952717B2 (ja) | 錫メツキ板条材の連続製造方法 | |
| JP2868589B2 (ja) | ステンレス鋼帯の中性塩電解処理方法 | |
| JP2004099950A (ja) | 銅箔の連続電解厚めっき方法及び装置 | |
| JP4765426B2 (ja) | 電気錫めっき鋼帯の製造方法 |