JPH0573268B2 - - Google Patents
Info
- Publication number
- JPH0573268B2 JPH0573268B2 JP61283245A JP28324586A JPH0573268B2 JP H0573268 B2 JPH0573268 B2 JP H0573268B2 JP 61283245 A JP61283245 A JP 61283245A JP 28324586 A JP28324586 A JP 28324586A JP H0573268 B2 JPH0573268 B2 JP H0573268B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- lsi
- cooling
- heat dissipation
- electronic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 claims description 34
- 230000017525 heat dissipation Effects 0.000 claims description 18
- 239000007788 liquid Substances 0.000 claims description 7
- 239000002826 coolant Substances 0.000 claims description 3
- 239000003507 refrigerant Substances 0.000 description 13
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 101100075512 Oryza sativa subsp. japonica LSI2 gene Proteins 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003351 stiffener Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61283245A JPS63136656A (ja) | 1986-11-28 | 1986-11-28 | 電子回路パツケ−ジの放熱構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61283245A JPS63136656A (ja) | 1986-11-28 | 1986-11-28 | 電子回路パツケ−ジの放熱構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63136656A JPS63136656A (ja) | 1988-06-08 |
| JPH0573268B2 true JPH0573268B2 (fr) | 1993-10-14 |
Family
ID=17662967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61283245A Granted JPS63136656A (ja) | 1986-11-28 | 1986-11-28 | 電子回路パツケ−ジの放熱構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63136656A (fr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0992994A (ja) * | 1995-09-21 | 1997-04-04 | Asia Electron Inc | 冷却板 |
| DE102007008753A1 (de) * | 2007-02-22 | 2008-08-28 | Rohde & Schwarz Gmbh & Co. Kg | Hochlastkoppler |
| ES2724227T3 (es) * | 2011-07-20 | 2019-09-09 | Daikin Ind Ltd | Estructura de instalación para tubo de refrigerante |
-
1986
- 1986-11-28 JP JP61283245A patent/JPS63136656A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63136656A (ja) | 1988-06-08 |
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