JPH0573066B2 - - Google Patents

Info

Publication number
JPH0573066B2
JPH0573066B2 JP60110722A JP11072285A JPH0573066B2 JP H0573066 B2 JPH0573066 B2 JP H0573066B2 JP 60110722 A JP60110722 A JP 60110722A JP 11072285 A JP11072285 A JP 11072285A JP H0573066 B2 JPH0573066 B2 JP H0573066B2
Authority
JP
Japan
Prior art keywords
lsi
wiring board
lsi chip
chip
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60110722A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61268049A (ja
Inventor
Mitsuru Nitsuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP60110722A priority Critical patent/JPS61268049A/ja
Publication of JPS61268049A publication Critical patent/JPS61268049A/ja
Publication of JPH0573066B2 publication Critical patent/JPH0573066B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP60110722A 1985-05-23 1985-05-23 Ｌｓｉパッケージ Granted JPS61268049A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60110722A JPS61268049A (ja) 1985-05-23 1985-05-23 Ｌｓｉパッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60110722A JPS61268049A (ja) 1985-05-23 1985-05-23 Ｌｓｉパッケージ

Publications (2)

Publication Number Publication Date
JPS61268049A JPS61268049A (ja) 1986-11-27
JPH0573066B2 true JPH0573066B2 (enExample) 1993-10-13

Family

ID=14542827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60110722A Granted JPS61268049A (ja) 1985-05-23 1985-05-23 Ｌｓｉパッケージ

Country Status (1)

Country Link
JP (1) JPS61268049A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03112969U (enExample) * 1990-03-02 1991-11-19

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4829373A (enExample) * 1971-05-04 1973-04-18
JPS59198737A (ja) * 1983-04-26 1984-11-10 Nec Corp リ−ドレスマルチチツプチツプキヤリア
US4598308A (en) * 1984-04-02 1986-07-01 Burroughs Corporation Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die

Also Published As

Publication number Publication date
JPS61268049A (ja) 1986-11-27

Similar Documents

Publication Publication Date Title
JP2974552B2 (ja) 半導体装置
JP3004578B2 (ja) 熱放散増強のための多熱導伝路とパッケージ統合性及び信頼性向上のための縁の周りを囲むキャップからなる集積回路パッケージ
US4764846A (en) High density electronic package comprising stacked sub-modules
US6330158B1 (en) Semiconductor package having heat sinks and method of fabrication
US4703339A (en) Package having a heat sink suitable for a ceramic substrate
JPS6376444A (ja) チツプキヤリア
EP0253295A1 (en) Thermally enhanced LSI integrated circuit package
JPH03195053A (ja) インバータ装置
JPS63308943A (ja) 半導体装置
JPH03174749A (ja) 半導体装置
JPH0573066B2 (enExample)
KR20230144969A (ko) 디스크리트 전력 반도체 패키지
JPS6063952A (ja) レジン封止半導体装置の実装方法
CN100386870C (zh) 半导体装置
JPS60226149A (ja) ヒ−トシンク付セラミツクパツケ−ジ
US7754976B2 (en) Compact circuit carrier package
JP2901401B2 (ja) マルチチップモジュール
JP3372169B2 (ja) 半導体パッケージ
JPS6220701B2 (enExample)
JPS63289847A (ja) Ｌｓｉパッケ−ジの放熱構造
JPH01282846A (ja) 混成集積回路
JP2804765B2 (ja) 電子部品塔載用基板
JPS61212045A (ja) 半導体装置
JPS60250655A (ja) 集積回路パツケ−ジ
JPS61133649A (ja) 半導体装置