JPH0573062B2 - - Google Patents
Info
- Publication number
- JPH0573062B2 JPH0573062B2 JP21215785A JP21215785A JPH0573062B2 JP H0573062 B2 JPH0573062 B2 JP H0573062B2 JP 21215785 A JP21215785 A JP 21215785A JP 21215785 A JP21215785 A JP 21215785A JP H0573062 B2 JPH0573062 B2 JP H0573062B2
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- heat sink
- cooling pipe
- pipe
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 claims description 62
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000009792 diffusion process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 2
- 239000002826 coolant Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Details Of Measuring And Other Instruments (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21215785A JPS6273649A (ja) | 1985-09-27 | 1985-09-27 | ヒ−トシンクの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21215785A JPS6273649A (ja) | 1985-09-27 | 1985-09-27 | ヒ−トシンクの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6273649A JPS6273649A (ja) | 1987-04-04 |
| JPH0573062B2 true JPH0573062B2 (enrdf_load_html_response) | 1993-10-13 |
Family
ID=16617837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21215785A Granted JPS6273649A (ja) | 1985-09-27 | 1985-09-27 | ヒ−トシンクの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6273649A (enrdf_load_html_response) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100373601C (zh) * | 2005-04-15 | 2008-03-05 | 广达电脑股份有限公司 | 二次曲线型热管鳍片散热器 |
| JP5427325B2 (ja) * | 2011-11-30 | 2014-02-26 | パナソニック株式会社 | 窒化物半導体発光装置 |
-
1985
- 1985-09-27 JP JP21215785A patent/JPS6273649A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6273649A (ja) | 1987-04-04 |
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