JPH0572182U - Printed board soldering structure - Google Patents
Printed board soldering structureInfo
- Publication number
- JPH0572182U JPH0572182U JP009976U JP997692U JPH0572182U JP H0572182 U JPH0572182 U JP H0572182U JP 009976 U JP009976 U JP 009976U JP 997692 U JP997692 U JP 997692U JP H0572182 U JPH0572182 U JP H0572182U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- soldered
- soldering
- solder
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
(57)【要約】
【目的】不安定な状態で半田付けされる部分を無くし、
温度変化等による不安定な接触不良等の発生を防止す
る。
【構成】プリント板２を半田付けする金属ケース１の平
面には、プリント板２の大きさに応じて複数の溝部３を
設ける。この場合、半田の濡れ性や半田の表面張力、お
よび半田付け時の熱分布状態等を考慮して、最適の半田
面積となるように溝部３の幅および数を選定する。半田
付け時に各溝部３で発生するガス等は、金属ケース１と
プリント板２との間隙から逃がすことができるが、プリ
ント板側の各溝部に対応する位置に、それぞれガス抜き
穴４を設けてもよい。
(57) [Summary] [Purpose] Eliminate the parts that are soldered in an unstable state,
Prevents unstable contact failure due to temperature changes. [Structure] A plurality of groove portions 3 are provided on the plane of a metal case 1 to which a printed board 2 is soldered, depending on the size of the printed board 2. In this case, the width and the number of the groove portions 3 are selected so as to obtain the optimum solder area in consideration of the wettability of the solder, the surface tension of the solder, the heat distribution state at the time of soldering, and the like. Gas or the like generated in each groove 3 at the time of soldering can escape from the gap between the metal case 1 and the printed board 2, but by providing a gas vent hole 4 at a position corresponding to each groove on the printed board side. Good.
Description
【０００１】[0001]
本考案はプリント板半田付け構造に関し、特に金属平面上にプリント板を半田 付けするプリント板半田付け構造に関する。 The present invention relates to a printed board soldering structure, and more particularly to a printed board soldering structure for soldering a printed board on a metal plane.
【０００２】[0002]
従来、金属平面上にプリント板を半田付けする場合、プリント板の裏面全体お よび金属平面全体に予備半田を施した後、全面を半田付けしている。 Conventionally, when a printed board is soldered on a metal plane, the entire back surface of the printed board and the entire metal plane are pre-soldered, and then the entire surface is soldered.
【０００３】[0003]
上述したように金属平面上にプリント板を半田付けする場合、プリント板が大 きくなると熱が均一に分布しないために半田付けされない部分が生じ、半田付け が不均一となる。これを改善するために半田量を増やした場合は、余分な半田で プリント板が浮いてしまい、金属面にプリント板を密着させた安定状態で半田付 けできない。 As described above, when a printed board is soldered on a metal flat surface, if the printed board is large, heat is not evenly distributed, so that some parts are not soldered, resulting in non-uniform soldering. If the amount of solder is increased to improve this, the printed board will float due to excess solder, and it will not be possible to perform soldering in a stable state where the printed board is in close contact with the metal surface.
【０００４】 このため、特に、マイクロ波帯の発振回路等が形成されたプリント板を金属ケ ースに半田付けした場合に、温度変化に対する各部の膨張率が異なることから不 安定な接触不良等が発生し、発振周波数が不連続に変化するという問題点を有し ている。Therefore, particularly when a printed board on which a microwave band oscillation circuit or the like is formed is soldered to a metal case, the expansion coefficient of each part is different with respect to temperature change, resulting in unstable contact failure and the like. Occurs and the oscillation frequency changes discontinuously.
【０００５】 本考案の目的は、不安定な状態で半田付けされる部分を無くして、温度変化等 による不安定な接触不良等の発生を防止できるプリント板半田付け構造を提供す ることにある。An object of the present invention is to provide a printed circuit board soldering structure capable of preventing an unstable contact failure due to temperature change or the like by eliminating a portion to be soldered in an unstable state. ..
【０００６】[0006]
本考案のプリント板半田付け構造は、金属平面上にプリント板を半田付けする プリント板半田付け構造において、前記金属平面に前記プリント板の大きさに応 じて複数の溝部を設けると共に、前記プリント板と前記複数の溝部とで形成され る空洞領域にそれぞれガス抜き部分を少なくとも１つ形成する構造である。 The printed board soldering structure of the present invention solders a printed board on a metal plane. In the printed board soldering structure, a plurality of groove portions are provided on the metal plane according to the size of the printed board, and the printed board is printed. It is a structure in which at least one degassing portion is formed in each cavity region formed by the plate and the plurality of groove portions.
【０００７】[0007]
次に本考案について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
【０００８】 図１は本考案の一実施例を示す図であり、（ａ）は上面図、（ｂ）はＡ−Ａ線 で切断した断面図である。ここで、金属ケース１にプリント板２を半田付けする 場合を示している。1A and 1B are views showing an embodiment of the present invention. FIG. 1A is a top view and FIG. 1B is a sectional view taken along line AA. Here, the case where the printed board 2 is soldered to the metal case 1 is shown.
【０００９】 さて、プリント板２を半田付けする金属ケース１の平面には、プリント板２の 大きさに応じて複数の溝部３を設ける。この場合、半田の濡れ性や半田の表面張 力、および半田付け時の熱分布状態等を考慮して、最適の半田面積となるように 溝部３の幅および数を選定する。このようにすることにより、不安定な状態で半 田付けされる部分を無くすことができる。A plurality of groove portions 3 are provided on the plane of the metal case 1 to which the printed board 2 is soldered, depending on the size of the printed board 2. In this case, the width and the number of the groove portions 3 are selected so as to obtain the optimum solder area in consideration of the wettability of the solder, the surface tension of the solder, the heat distribution state during soldering, and the like. By doing this, it is possible to eliminate the part that is padded in an unstable state.
【００１０】 また、半田量が多目になっている場合は、余分な半田が溝部３に溜るので、プ リント板２が余分な半田で浮くこともない。Further, when the amount of solder is large, excess solder collects in the groove portion 3, so that the print plate 2 does not float with excess solder.
【００１１】 ところで、半田付け時に各溝部３で発生するガス等は、本実施例では金属ケー ス１とプリント板２との間隙から逃がすことができるが、プリント板側の各溝部 に対応する位置に、それぞれガス抜き穴４を設けてもよい。By the way, the gas or the like generated in each groove 3 at the time of soldering can be escaped from the gap between the metal case 1 and the printed board 2 in the present embodiment, but at a position corresponding to each groove on the printed board side. Alternatively, the gas vent holes 4 may be provided respectively.
【００１２】[0012]
以上説明したように本考案によれば、プリント板を半田付けする金属ケースの 平面に、プリント板の大きさに応じて複数の溝部を設ける構造とすると共に、各 溝部で発生するガス等を逃がす部分を形成することにより、不安定な状態で半田 付けされる部分を無くすことができ、温度変化等による不安定な接触不良等の発 生を防止できる。 As described above, according to the present invention, a plurality of grooves are provided on the flat surface of the metal case to which the printed board is soldered according to the size of the printed board, and the gas generated in each groove is released. By forming the portion, the portion to be soldered in an unstable state can be eliminated, and the occurrence of unstable contact failure due to temperature change or the like can be prevented.
【図面の簡単な説明】[Brief description of drawings]
【図１】本考案の一実施例を示す図であり、（ａ）は上
面図、（ｂ）はＡ−Ａ線で切断した断面図である。1A and 1B are views showing an embodiment of the present invention, in which FIG. 1A is a top view and FIG. 1B is a sectional view taken along line AA.
１ 金属ケース ２ プリント板 ３ 溝部 ４ ガス抜き穴 1 Metal case 2 Printed board 3 Groove 4 Gas vent hole
Claims (1)
プリント板半田付け構造において、前記金属平面に前記
プリント板の大きさに応じて複数の溝部を設けると共
に、前記プリント板と前記複数の溝部とで形成される空
洞領域にそれぞれガス抜き部分を少なくとも１つ形成す
ることを特徴とするプリント板半田付け構造。1. In a printed board soldering structure for soldering a printed board on a metal plane, a plurality of groove portions are provided on the metal plane according to the size of the printed board, and the printed board and the plurality of groove portions are provided. A printed board soldering structure, characterized in that at least one degassing portion is formed in each of the hollow regions formed by.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP009976U JPH0572182U (en) | 1992-03-02 | 1992-03-02 | Printed board soldering structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP009976U JPH0572182U (en) | 1992-03-02 | 1992-03-02 | Printed board soldering structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0572182U true JPH0572182U (en) | 1993-09-28 |
Family
ID=18529390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP009976U Withdrawn JPH0572182U (en) | 1992-03-02 | 1992-03-02 | Printed board soldering structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0572182U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005260165A (en) * | 2004-03-15 | 2005-09-22 | Denso Corp | Electronic apparatus |
-
1992
- 1992-03-02 JP JP009976U patent/JPH0572182U/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005260165A (en) * | 2004-03-15 | 2005-09-22 | Denso Corp | Electronic apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19960606 |