JPH0572097B2 - - Google Patents
Info
- Publication number
- JPH0572097B2 JPH0572097B2 JP58216136A JP21613683A JPH0572097B2 JP H0572097 B2 JPH0572097 B2 JP H0572097B2 JP 58216136 A JP58216136 A JP 58216136A JP 21613683 A JP21613683 A JP 21613683A JP H0572097 B2 JPH0572097 B2 JP H0572097B2
- Authority
- JP
- Japan
- Prior art keywords
- plasma
- magnetic field
- vacuum vessel
- generating means
- microwave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000005672 electromagnetic field Effects 0.000 claims description 2
- 238000009832 plasma treatment Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 10
- 230000005684 electric field Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21613683A JPS60109232A (ja) | 1983-11-18 | 1983-11-18 | マイクロ波プラズマ処理方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21613683A JPS60109232A (ja) | 1983-11-18 | 1983-11-18 | マイクロ波プラズマ処理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60109232A JPS60109232A (ja) | 1985-06-14 |
JPH0572097B2 true JPH0572097B2 (ko) | 1993-10-08 |
Family
ID=16683827
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21613683A Granted JPS60109232A (ja) | 1983-11-18 | 1983-11-18 | マイクロ波プラズマ処理方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60109232A (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63207131A (ja) * | 1987-02-24 | 1988-08-26 | Japan Steel Works Ltd:The | プラズマ処理装置 |
JP2656503B2 (ja) * | 1987-09-24 | 1997-09-24 | 株式会社日立製作所 | マイクロ波プラズマ処理方法 |
JP2781712B2 (ja) * | 1993-03-18 | 1998-07-30 | 株式会社日立製作所 | プラズマ処理方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58168230A (ja) * | 1982-03-30 | 1983-10-04 | Fujitsu Ltd | マイクロ波プラズマ処理方法 |
-
1983
- 1983-11-18 JP JP21613683A patent/JPS60109232A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58168230A (ja) * | 1982-03-30 | 1983-10-04 | Fujitsu Ltd | マイクロ波プラズマ処理方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS60109232A (ja) | 1985-06-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4610770A (en) | Method and apparatus for sputtering | |
KR940008368B1 (ko) | 마이크로파로 생성한 플라즈마를 사용하는 플라즈마 처리장치 | |
EP0413282B1 (en) | Method and apparatus for producing magnetically-coupled planar plasma | |
US5401351A (en) | Radio frequency electron cyclotron resonance plasma etching apparatus | |
US6716762B1 (en) | Plasma confinement by use of preferred RF return path | |
JPH06283470A (ja) | プラズマ処理装置 | |
JP2001035839A (ja) | プラズマ生成装置および半導体製造方法 | |
JPH0216731A (ja) | プラズマ反応装置 | |
JP3254069B2 (ja) | プラズマ装置 | |
JP7001456B2 (ja) | プラズマ処理装置 | |
JP2546405B2 (ja) | プラズマ処理装置ならびにその運転方法 | |
JPH03262119A (ja) | プラズマ処理方法およびその装置 | |
JPS63155728A (ja) | プラズマ処理装置 | |
JPS61213377A (ja) | プラズマデポジシヨン法及びその装置 | |
CN110770880B (zh) | 等离子处理装置 | |
US6835279B2 (en) | Plasma generation apparatus | |
JPH0572097B2 (ko) | ||
JP3294839B2 (ja) | プラズマ処理方法 | |
JPH0774115A (ja) | プラズマ処理装置 | |
JP3883615B2 (ja) | プラズマ発生装置およびプラズマ処理装置 | |
JP2001015297A (ja) | プラズマ装置 | |
JP4004146B2 (ja) | プラズマ生成装置及び基板表面処理方法 | |
JP4384295B2 (ja) | プラズマ処理装置 | |
JPH05182785A (ja) | マイクロ波放電反応装置及び電極装置 | |
JP2019121514A (ja) | プラズマ処理装置 |