JPH0571673B2 - - Google Patents
Info
- Publication number
- JPH0571673B2 JPH0571673B2 JP59049424A JP4942484A JPH0571673B2 JP H0571673 B2 JPH0571673 B2 JP H0571673B2 JP 59049424 A JP59049424 A JP 59049424A JP 4942484 A JP4942484 A JP 4942484A JP H0571673 B2 JPH0571673 B2 JP H0571673B2
- Authority
- JP
- Japan
- Prior art keywords
- gold
- silver
- tellurium
- cyanide
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Physical Vapour Deposition (AREA)
- Electrolytic Production Of Metals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19833309397 DE3309397A1 (de) | 1983-03-16 | 1983-03-16 | Elektrolytisches bad zum abscheiden von niederkaraetigen, glaenzenden gold-silber-legierungsueberzuegen |
| DE33093970 | 1983-03-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59179794A JPS59179794A (ja) | 1984-10-12 |
| JPH0571673B2 true JPH0571673B2 (en:Method) | 1993-10-07 |
Family
ID=6193635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59049424A Granted JPS59179794A (ja) | 1983-03-16 | 1984-03-16 | 低カラツトの光沢ある金銀合金被覆を析出する電解浴 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4487664A (en:Method) |
| EP (1) | EP0119424B1 (en:Method) |
| JP (1) | JPS59179794A (en:Method) |
| AT (1) | ATE27007T1 (en:Method) |
| BR (1) | BR8401131A (en:Method) |
| DE (2) | DE3309397A1 (en:Method) |
| HK (1) | HK102891A (en:Method) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3505473C1 (de) * | 1985-02-16 | 1986-06-05 | Degussa Ag, 6000 Frankfurt | Bad zur galvanischen Abscheidung von Gold-Indium-Legierungsueberzuegen |
| KR20070043936A (ko) * | 2004-05-11 | 2007-04-26 | 테크닉,인코포레이티드 | 금-주석 공융 합금용 전기도금액 |
| SG127854A1 (en) | 2005-06-02 | 2006-12-29 | Rohm & Haas Elect Mat | Improved gold electrolytes |
| US20090104463A1 (en) | 2006-06-02 | 2009-04-23 | Rohm And Haas Electronic Materials Llc | Gold alloy electrolytes |
| CN104271534B (zh) | 2012-03-22 | 2019-11-12 | 圣戈本陶瓷及塑料股份有限公司 | 烧结结合陶瓷制品 |
| US9290311B2 (en) | 2012-03-22 | 2016-03-22 | Saint-Gobain Ceramics & Plastics, Inc. | Sealed containment tube |
| CN107061873A (zh) | 2012-03-22 | 2017-08-18 | 圣戈本陶瓷及塑料股份有限公司 | 加长管结构及其形成方法 |
| ITFI20120103A1 (it) | 2012-06-01 | 2013-12-02 | Bluclad Srl | Bagni galvanici per l'ottenimento di una lega di oro a bassa caratura e processo galvanico che utilizza detti bagni. |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE750185C (de) * | 1939-07-08 | 1944-12-27 | Baeder zur elektrolytischen Abscheidung von glaenzenden Metallniederschlaegen | |
| NL277803A (en:Method) * | 1961-05-01 | |||
| US3475292A (en) * | 1966-02-10 | 1969-10-28 | Technic | Gold plating bath and process |
| JPS4410363Y1 (en:Method) * | 1966-12-08 | 1969-04-25 | ||
| GB1283024A (en) * | 1970-01-22 | 1972-07-26 | B J S Electro Plating Company | Electro-depositing silver alloys |
| US3864222A (en) * | 1973-03-26 | 1975-02-04 | Technic | Baths for Electrodeposition of Gold and Gold Alloys and Method Therefore |
| US4121982A (en) * | 1978-02-03 | 1978-10-24 | American Chemical & Refining Company Incorporated | Gold alloy plating bath and method |
| CH629260A5 (en) * | 1978-02-22 | 1982-04-15 | Systemes Traitements Surfaces | Process for gold-silver electrolytic deposition, bath for its use and alloy thus obtained |
-
1983
- 1983-03-16 DE DE19833309397 patent/DE3309397A1/de not_active Withdrawn
-
1984
- 1984-02-04 EP EP84101158A patent/EP0119424B1/de not_active Expired
- 1984-02-04 AT AT84101158T patent/ATE27007T1/de not_active IP Right Cessation
- 1984-02-04 DE DE8484101158T patent/DE3463528D1/de not_active Expired
- 1984-03-13 BR BR8401131A patent/BR8401131A/pt not_active IP Right Cessation
- 1984-03-13 US US06/589,216 patent/US4487664A/en not_active Expired - Lifetime
- 1984-03-16 JP JP59049424A patent/JPS59179794A/ja active Granted
-
1991
- 1991-12-19 HK HK1028/91A patent/HK102891A/xx not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| DE3309397A1 (de) | 1984-09-20 |
| DE3463528D1 (en) | 1987-06-11 |
| ATE27007T1 (de) | 1987-05-15 |
| EP0119424A1 (de) | 1984-09-26 |
| US4487664A (en) | 1984-12-11 |
| HK102891A (en) | 1991-12-27 |
| JPS59179794A (ja) | 1984-10-12 |
| BR8401131A (pt) | 1984-10-23 |
| EP0119424B1 (de) | 1987-05-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3980531A (en) | Bath and process for the electrolytic separation of rare metal alloys | |
| US3940319A (en) | Electrodeposition of bright tin-nickel alloy | |
| US20060137991A1 (en) | Method for bronze galvanic coating | |
| EP1272691B1 (fr) | Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages | |
| JPH06173074A (ja) | 電気メッキされた金−銅−銀の合金 | |
| EP1423557B1 (fr) | Bain electrolytique pour le depot electrochimique de l'or et de ses alliages | |
| JPH0571673B2 (en:Method) | ||
| US4617096A (en) | Bath and process for the electrolytic deposition of gold-indium alloys | |
| EP1268347B1 (fr) | Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot du palladium ou d'un de ses alliages | |
| JPH03100194A (ja) | 金合金メツキ浴 | |
| US4048023A (en) | Electrodeposition of gold-palladium alloys | |
| US3586611A (en) | Process for the electrolytic deposition of gold-copper-cadmium alloys | |
| US4465564A (en) | Gold plating bath containing tartrate and carbonate salts | |
| IE56353B1 (en) | Bath for the galvanic deposition of gold alloys | |
| JPS61223194A (ja) | 金/スズ合金被膜の電着浴 | |
| JPH09170094A (ja) | 錫−銀合金酸性めっき浴 | |
| US4741818A (en) | Alkaline baths and methods for electrodeposition of palladium and palladium alloys | |
| CH418085A (fr) | Electrolyte pour le dépôt galvanique d'alliages d'or | |
| CA1045577A (en) | Electrodeposition of bright tin-nickel alloy | |
| JPS62164889A (ja) | 金銀銅合金めつき液 | |
| US3520785A (en) | Electroplating gold and thiomalate electrolyte therefor | |
| JPS5823478B2 (ja) | 硬質金合金被膜の製造方法 | |
| JPH0470394B2 (en:Method) | ||
| KR0168321B1 (ko) | 동 합금 및 철-니켈 합금 소재의 하지도금 조성물 및 하지도금 방법 | |
| JPS6358919B2 (en:Method) |