JPH0570930B2 - - Google Patents
Info
- Publication number
- JPH0570930B2 JPH0570930B2 JP58194311A JP19431183A JPH0570930B2 JP H0570930 B2 JPH0570930 B2 JP H0570930B2 JP 58194311 A JP58194311 A JP 58194311A JP 19431183 A JP19431183 A JP 19431183A JP H0570930 B2 JPH0570930 B2 JP H0570930B2
- Authority
- JP
- Japan
- Prior art keywords
- plasma
- plasma processing
- high frequency
- frequency power
- processing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003672 processing method Methods 0.000 claims description 9
- 230000005611 electricity Effects 0.000 claims 1
- 230000000737 periodic effect Effects 0.000 claims 1
- 238000005530 etching Methods 0.000 description 47
- 150000002500 ions Chemical class 0.000 description 40
- 238000000034 method Methods 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32146—Amplitude modulation, includes pulsing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32155—Frequency modulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32155—Frequency modulation
- H01J37/32165—Plural frequencies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19431183A JPS6086831A (ja) | 1983-10-19 | 1983-10-19 | プラズマ処理方法およびその装置 |
KR1019840006435A KR890004881B1 (ko) | 1983-10-19 | 1984-10-17 | 플라즈마 처리 방법 및 그 장치 |
DE8484112571T DE3482076D1 (de) | 1983-10-19 | 1984-10-18 | Plasmabearbeitungsverfahren und geraet zur anwendung dieses verfahrens. |
US06/662,014 US4808258A (en) | 1983-10-19 | 1984-10-18 | Plasma processing method and apparatus for carrying out the same |
EP84112571A EP0140294B1 (en) | 1983-10-19 | 1984-10-18 | Plasma processing method and apparatus for carrying out the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19431183A JPS6086831A (ja) | 1983-10-19 | 1983-10-19 | プラズマ処理方法およびその装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6300525A Division JP2791287B2 (ja) | 1994-12-05 | 1994-12-05 | プラズマエッチング処理方法及びその装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6086831A JPS6086831A (ja) | 1985-05-16 |
JPH0570930B2 true JPH0570930B2 (zh) | 1993-10-06 |
Family
ID=16322492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19431183A Granted JPS6086831A (ja) | 1983-10-19 | 1983-10-19 | プラズマ処理方法およびその装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6086831A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001274099A (ja) * | 2000-03-24 | 2001-10-05 | Mitsubishi Heavy Ind Ltd | 放電電極への給電方法、高周波プラズマ発生方法および半導体製造方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2974512B2 (ja) * | 1992-08-21 | 1999-11-10 | 日新電機株式会社 | エッチング方法及び装置 |
US5900103A (en) | 1994-04-20 | 1999-05-04 | Tokyo Electron Limited | Plasma treatment method and apparatus |
US6391147B2 (en) | 1994-04-28 | 2002-05-21 | Tokyo Electron Limited | Plasma treatment method and apparatus |
JP2006260857A (ja) * | 2005-03-16 | 2006-09-28 | Nagano Japan Radio Co | プラズマ処理装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5633839A (en) * | 1979-08-29 | 1981-04-04 | Hitachi Ltd | Plasma treatment and device therefor |
JPH0454373A (ja) * | 1990-06-22 | 1992-02-21 | Jatco Corp | 変速機の制御装置 |
-
1983
- 1983-10-19 JP JP19431183A patent/JPS6086831A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5633839A (en) * | 1979-08-29 | 1981-04-04 | Hitachi Ltd | Plasma treatment and device therefor |
JPH0454373A (ja) * | 1990-06-22 | 1992-02-21 | Jatco Corp | 変速機の制御装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001274099A (ja) * | 2000-03-24 | 2001-10-05 | Mitsubishi Heavy Ind Ltd | 放電電極への給電方法、高周波プラズマ発生方法および半導体製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6086831A (ja) | 1985-05-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR890004881B1 (ko) | 플라즈마 처리 방법 및 그 장치 | |
US9502217B2 (en) | Plasma processing apparatus and plasma processing method | |
KR100807131B1 (ko) | 단일 주파수 rf전력을 이용하여 웨이퍼를 처리하는 플라즈마 처리시스템, 웨이퍼를 식각하기 위한 플라즈마 처리장치, 및 단일 주파수 rf전력을 이용하여 플라즈마 처리챔버에서 웨이퍼를 처리하는 방법 | |
EP0395415B1 (en) | Apparatus for and method of processing a semiconductor device using microwave-generated plasma | |
JPS60126832A (ja) | ドライエツチング方法および装置 | |
US20180274089A1 (en) | Deposition or treatment of diamond-like carbon in a plasma reactor | |
JP3424182B2 (ja) | 表面処理装置 | |
CN106653550A (zh) | 用双峰工艺气体组合物进行等离子体蚀刻的方法和系统 | |
JPS5947733A (ja) | プラズマプロセス方法および装置 | |
JP2791287B2 (ja) | プラズマエッチング処理方法及びその装置 | |
JPS6113625A (ja) | プラズマ処理装置 | |
JPH0570930B2 (zh) | ||
JP3186689B2 (ja) | プラズマ処理方法およびその装置 | |
JPH08255782A (ja) | プラズマ表面処理装置 | |
JP2000150196A (ja) | プラズマ処理方法およびその装置 | |
KR20160125164A (ko) | 대면적 고밀도 플라즈마 발생방법 | |
JPH07142400A (ja) | プラズマ処理方法及び装置 | |
JPS63103088A (ja) | エッチング方法及びその装置 | |
JPH0982494A (ja) | プラズマ処理装置およびプラズマ処理方法 | |
KR102077512B1 (ko) | 멀티 채널 rf 전원 공급장치 | |
JPS627131A (ja) | ドライエツチング装置 | |
JP3071450B2 (ja) | マイクロ波プラズマ処理装置 | |
JP2675000B2 (ja) | プラズマ処理装置 | |
JPH0252855B2 (zh) | ||
JP2974512B2 (ja) | エッチング方法及び装置 |