JPH0569666B2 - - Google Patents

Info

Publication number
JPH0569666B2
JPH0569666B2 JP56115089A JP11508981A JPH0569666B2 JP H0569666 B2 JPH0569666 B2 JP H0569666B2 JP 56115089 A JP56115089 A JP 56115089A JP 11508981 A JP11508981 A JP 11508981A JP H0569666 B2 JPH0569666 B2 JP H0569666B2
Authority
JP
Japan
Prior art keywords
pad
holder
polishing
polished
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56115089A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5822657A (ja
Inventor
Masaru Tsukahara
Kazuhiko Watanabe
Michio Horiuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56115089A priority Critical patent/JPS5822657A/ja
Publication of JPS5822657A publication Critical patent/JPS5822657A/ja
Publication of JPH0569666B2 publication Critical patent/JPH0569666B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP56115089A 1981-07-24 1981-07-24 ラツピング装置 Granted JPS5822657A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56115089A JPS5822657A (ja) 1981-07-24 1981-07-24 ラツピング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56115089A JPS5822657A (ja) 1981-07-24 1981-07-24 ラツピング装置

Publications (2)

Publication Number Publication Date
JPS5822657A JPS5822657A (ja) 1983-02-10
JPH0569666B2 true JPH0569666B2 (de) 1993-10-01

Family

ID=14653918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56115089A Granted JPS5822657A (ja) 1981-07-24 1981-07-24 ラツピング装置

Country Status (1)

Country Link
JP (1) JPS5822657A (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60262A (ja) * 1983-06-17 1985-01-05 株式会社日立製作所 冷凍サイクル
FR2677293A1 (fr) * 1991-06-06 1992-12-11 Commissariat Energie Atomique Machine de polissage a tete support de plaquettes perfectionnee.
US5443416A (en) * 1993-09-09 1995-08-22 Cybeq Systems Incorporated Rotary union for coupling fluids in a wafer polishing apparatus
JP3795198B2 (ja) 1997-09-10 2006-07-12 株式会社荏原製作所 基板保持装置及び該基板保持装置を備えたポリッシング装置
US6722963B1 (en) 1999-08-03 2004-04-20 Micron Technology, Inc. Apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
JP2004040011A (ja) * 2002-07-08 2004-02-05 Toyo Kohan Co Ltd 基板の供給取出治具、供給取出装置および供給取出方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS498163A (de) * 1972-05-10 1974-01-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS498163A (de) * 1972-05-10 1974-01-24

Also Published As

Publication number Publication date
JPS5822657A (ja) 1983-02-10

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