JPH0567480A - Anisotropic electrically conductive adhesive resin layer and manufacture thereof - Google Patents

Abstract

PURPOSE:To disperse electrically conductive particles uniformly, and enable connection at a fine pitch. CONSTITUTION:Electrically conductive particles 12 are dispersed in an insulating adhesive resin layer 11, and electrical continuity is carried out only in the width direction of the adhesive resin layer 11. After the electrically conductive particles 12 are electrified, the electrified particles 12 are dispersed on the surface of a roller 22, and next, the dispersed particles 12 are adhered on the surface of the adhesive resin layer 11, and afterwards, the adhered particles 12 are heated/pressurized, and are embedded in the adhesive resin layer 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive adhesive resin layer which can conduct electricity only in the thickness direction of the adhesive resin layer, and in particular, to improve the arrangement state and dispersion method of conductive particles. The present invention relates to a conductive adhesive resin layer and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, as a method for mounting a semiconductor device thinner and more compactly, instead of mounting a semiconductor package using solder, a semiconductor element is mounted on a substrate as a bare chip, or substrates are connected to each other. Various methods have been developed.

As one of them, an anisotropic conductive adhesive sheet in which conductive particles 2 are dispersed in an organic polymer adhesive sheet 1 as shown in FIG. 9 is used, and a semiconductor element and a substrate are formed as shown in FIG. There are a method of connecting and a method of connecting the substrates to each other as shown in FIG. In FIG. 10, the protruding electrode 4 formed on the A1 electrode portion of the semiconductor element 3 pushes the adhesive sheet 1 away,
The structure is such that it is connected to the wiring 6 on the substrate 5 via the conductive particles 2 dispersed in the sheet 1. Similarly for FIG.
The wiring 6 on the substrate 5 and the wiring 8 on the substrate 7 are the conductive particles 2
It is structured to be connected via.

The conventional anisotropic conductive adhesive resin layer has a thickness of several μm.
Conductive particles having a size of several tens of μm and a resin are mixed at a predetermined ratio and kneaded by a three-roll mill, etc., and then made into a certain thickness through a rolling roll or a blade, and coated on a release film such as polyester. Then, a method of producing by drying, or a method of kneading and kneading and pasting the resin into a sheet form by using a screen printing technique, followed by drying. There are also products that were made into a paste. Therefore, the conductive particles are randomly mixed in the adhesive resin layer, and the number of particles existing per unit area varies, and the conductive particles often aggregate.

If the conductive particles are dispersed or agglomerated, if the connection pitch is made fine, a short circuit will occur between the adjacent electrodes and between the wirings in the connection between the semiconductor element and the substrate or between the substrate and the substrate. There are problems such as the occurrence of a short circuit and, conversely, the occurrence of an open state in which conductive particles are not present in the connection portion and electrical continuity cannot be obtained, and it is difficult to connect with a fine pitch. Note that FIG. 10 shows an open state, and FIG. 11 shows a state close to a short circuit.

Further, the conductive particles 2 are generally embedded in an adhesive resin layer, and in order to establish continuity in the thickness direction of the resin layer,
It is necessary to apply a large bonding weight to the resin layer 1. For this reason, conventionally, the protruding electrode 4 is formed on the semiconductor element 3, and the sheet 1 is sufficiently pressed between the protruding electrode 4 and the wiring 6.

However, forming the protruding electrodes on the semiconductor element has problems that the number of steps increases and the yield decreases. Further, in order for the semiconductor element to push away the resin and make contact with the conductive particles, it is necessary to increase the bonding weight. When the bonding load is increased, cracks are generated in the passivation of the lower layer of the electrode portion, which is a factor that reduces the reliability of the semiconductor element.

[0008]

As described above, in the conventional anisotropically conductive adhesive resin layer, there is a problem that short-circuiting or open-circuiting occurs when the connection pitch becomes fine because of dispersion and aggregation of the conductive particles. It was difficult to connect the fine pitch.

Further, in the conventional anisotropic conductive adhesive resin layer,
When mounting a semiconductor element, it is necessary to provide a protruding electrode on the semiconductor element, which causes an increase in cost. Furthermore, it is necessary to increase the bonding weight, which has been a factor that reduces the reliability of the semiconductor element.

The present invention has been made in consideration of the above circumstances, and an object thereof is to provide an anisotropic conductive adhesive resin which can disperse conductive particles evenly and enables fine pitch connection. It is to provide a layer and a manufacturing method thereof.

Another object of the present invention is to connect the semiconductor element and the substrate without forming a protruding electrode or the like on the semiconductor element, and to make a sufficient connection even if the bonding weight is reduced. An object is to provide an anisotropic conductive adhesive resin layer that can be used.

[0012]

In order to achieve the above-mentioned object, the present invention (claim 1) is to disperse conductive particles in an insulating adhesive resin layer and only in the thickness direction of the adhesive resin layer. In the anisotropic conductive adhesive resin layer capable of conduction, the diameter of the conductive particles is set to be equal to or larger than the thickness of the adhesive resin layer, and the conductive particles are provided on at least one surface of the adhesive resin layer. The resin layer is made to project beyond the resin layer surface.

Further, according to the present invention (claim 2), conductive particles are dispersed in an insulating adhesive resin layer to produce an anisotropic conductive adhesive resin layer capable of conducting only in the thickness direction of the resin layer. In this method, before the conductive particles are dispersed in the adhesive resin layer, the particles are electrically charged in advance, and the repulsive force between the conductive particles is utilized to make the dispersion uniform.

Further, according to the present invention (claim 3), in the method for producing an anisotropic conductive adhesive resin layer, after electrically conductive particles are charged, the electrically charged particles are supported by a substrate, a roll or a drum. This is a method in which the particles are dispersed on the surface, then the dispersed particles are attached to the surface of the organic polymer adhesive resin layer, and then the attached particles are embedded in the adhesive resin layer.

[0015]

According to the present invention (claim 1), the diameter of the conductive particles (preferably charged conductive particles) is equal to or larger than that of the adhesive resin layer, and the conductive particles are formed on at least one surface. Is more prominent than the adhesive resin layer, it is possible to establish electrical continuity in the vertical direction only by applying a slight bonding load to the adhesive resin layer. Therefore, when connecting the semiconductor element and the substrate, it is not necessary to increase the bonding weight,
There is no inconvenience such as damage to the semiconductor element. further,
Since it is not necessary to provide a protruding electrode on the semiconductor element, it is advantageous in terms of cost.

According to the present invention (claims 2 and 3),
By charging the conductive particles, a repulsive force acts on the conductive particles, and the repulsive force causes the conductive particles to be dispersed at regular intervals. Or the variation is reduced. Therefore,
It is possible to prevent occurrence of short-circuit or open at the time of connection due to dispersion or aggregation of the conductive particles, and it is possible to surely perform fine-pitch connection.

[0017]

Embodiments of the present invention will be described below with reference to the drawings. <Example 1>

FIG. 1 (a) is a sectional view showing an anisotropic conductive adhesive resin layer according to the first embodiment of the present invention. The anisotropic conductive adhesive resin layer is composed of a thin adhesive resin layer 11 made of an organic polymer and fine conductive particles 12. The conductive particles 12 have a structure in which the conductive particles are dispersed in the adhesive resin layer 11 without contacting each other. Alternatively, it is in a paste form as shown in FIG. 1 (b).

Here, the adhesive resin layer 11 may contain any resin as a main component. For example, if it is a thermoplastic resin, it is a styrene-butadiene resin, and if it is a thermosetting resin, it is an epoxy resin. In this example, in consideration of reliability after connection, an epoxy resin was used as a main component of the adhesive sheet. The method of dispersing the conductive particles 12 in the adhesive resin layer 11 is performed as follows. First, the conductive particles 12 are charged by frictional charging or corona discharge. As a result, the conductive particles repel each other and are dispersed at a constant interval proportional to the charge amount. The electrically conductive particles 12 which are charged and dispersed are mixed with the adhesive resin 11 in a desired ratio and kneaded. Although it is a paste when kneaded, it can be used for connecting semiconductor elements in a paste state. Alternatively, after kneading, it is possible to make the thickness substantially uniform by screen printing or a method of passing it through a rolling roller or a blade, and printing or coating on a release film such as polyester to form a sheet. Finally, a paste-like material is applied in a fixed amount by screen printing or a dispenser. In addition, the conductive particles 12
There is also a method in which the anisotropic conductive adhesive resin is manufactured by finally transferring the conductive particles 12 to the adhesive resin layer 11 without mixing the resin and the adhesive resin 11.

In this embodiment, a sheet-like material is used as the adhesive resin layer 11, and a method utilizing this transfer is used. As the adhesive resin layer 11, a sheet having a thickness of about 20 μm manufactured by using a conventional technique was used. On the other hand, a support such as a substrate or a roll is charged by corona discharge or the like so as to have a charge opposite to that of the conductive particles 12. The support is composed of an insulating layer, which is charged almost uniformly over the entire surface, selectively charged by patterning the conductive layer and insulating layer, and irradiated with light after corona discharge such as selenium. By doing so, a material that can be selectively charged is used.

Next, the conductive particles 12 are transferred onto the charged support by electric attraction. Further, since the support can be selectively charged, the conductive particles can be transferred in a substantially desired distribution, for example, in a portion corresponding to the electrode of the semiconductor element, rather than randomly. Next, the adhesive resin layer
The conductive particles 12 transferred to the support by applying a stronger charge than the support on the back surface of the support 11 are transferred again to the adhesive resin layer 11 side. By heating the conductive particles 12 thus transferred and pressing them against the adhesive resin 11, it is possible to manufacture an anisotropic conductive adhesive resin layer having a high sheet-shaped resolution.

Here, the conductive particles 12 may be made of any material as long as the back surface exhibits conductivity. For example, metal particles such as gold, nickel, solder, and copper, and insulating materials such as resin particles and glass particles may be coated with a metal such as nickel, gold, and silver to maintain conductivity. Since the insulator coated with a metal has a lighter mass than the metal particles, it has characteristics that conductive particles are easily dispersed without contacting each other, transfer is easily performed after charging, and particle diameters can be made uniform. The size of the conductive particles 13 may be arbitrary, but FIG.
Considering the configuration of (a), in this embodiment, 7.5 ± 2.5 μm conductive particles in which resin particles are nickel-coated are used.

Using this sheet-shaped anisotropic conductive adhesive resin layer, a semiconductor element and a substrate were connected as shown in FIG.
That is, as shown in FIG. 2 (a), the anisotropic conductive adhesive resin layer is sandwiched between the semiconductor element 13 and the substrate 15, and the semiconductor element 13 and the substrate 15 are pressed against each other as shown in FIG. 2 (b).
The protruding electrode 14 and the wiring 16 of the substrate 15 were connected. Specifically, the semiconductor element 13 having an electrode pitch of 100 μm was heated to 150 ° C. and connected to the glass substrate 15 at a pressure of 30 kg / chip and a time of 2 minutes, whereby a semiconductor device free from short circuit or open could be obtained. The glass substrate 15 is the same as that used for the liquid crystal panel, and the ITO wiring 16 is formed.

Similarly, by using a sheet-like anisotropic conductive adhesive resin layer, as shown in FIG. 3, the wiring 16 on the substrate 15 and the wiring 18 on another substrate 17 are interposed via this sheet. Connected. In this embodiment, a flexible printed circuit board having a copper wiring 16 is used as the substrate 15, and an ITO wiring 18 is formed on the glass substrate, which is the same as that used for a liquid crystal panel, as the substrate 17. I used one. The wiring pitch of these substrates is 100 μm. Bonding pressure is 20kg
f, the bonding tool temperature was 150 ° C. Also in this case, it was possible to obtain a semiconductor device without a short circuit or an open. Although the glass substrate is used in the above embodiments, many insulating substrates such as a glass epoxy substrate, an alumina substrate, and an araside substrate can also be used. Although ITO is used as the wiring, many metal wirings such as Au, Ni, Al, and Cu can be used.

As described above, in the present embodiment, since the conductive particles 12 are dispersed in the adhesive resin layer 11 without agglomerating and contacting the conductive particles with each other, there are no conductive particles in the connection electrode portion. It is possible to eliminate an open that occurs and, conversely, a short circuit between adjacent electrodes that occurs when conductive particles are too dense. Therefore, fine pitch connection is possible, the device can be mounted thinner and smaller than the semiconductor device, and its usefulness is great. <Example 2>

FIG. 4 is a diagram schematically showing a conductive particle transfer device used in the second embodiment method of the present invention. In the figure, 21 is a container filled with conductive particles 12, and the conductive particles 12 in this container 21 are charged by friction or the like. The conductive particles 12 in the container 21 are attached to the drum 22 which is charged opposite to the conductive particles 12, and the conductive particles 12 attached to the roller (support) 22 are transferred onto the adhesive resin layer 11. ing.

The anisotropic conductive adhesive resin layer is composed of a thin adhesive sheet-like resin layer and fine conductive particles. Here, as the material of the adhesive resin layer 11, a thermoplastic resin or a thermosetting resin can be used as in the first embodiment, but in this embodiment, epoxy resin is used as the main component of the adhesive resin layer. Resin was used. The adhesive resin layer 11 was manufactured in the same manner as in the first embodiment. Further, the conductive particles 12 may be made of any material as long as the surface has conductivity, but in the present embodiment, nickel particles having an average particle size of 7.5 ± 2.5 μm were used. Next, a specific method for manufacturing the anisotropic conductive adhesive resin layer according to this embodiment will be described.

First, using the apparatus shown in FIG. 4, the conductive particles 12 in the container 21 are charged by friction or the like. by this,
The conductive particles repel each other and disperse at regular intervals proportional to the amount of charge. On the other hand, the drum 22 as a support is uniformly charged by corona discharge or the like having an electric charge opposite to that of the conductive particles 12. The conductive particles 12 are transferred to the thus charged drum 22 by an electric attraction force.

Then, a stronger charge than that of the drum 22 is applied to the back surface of the adhesive resin layer 11 and the conductive particles 12 transferred to the drum 22 are transferred again to the adhesive resin layer side. As a result, as shown in FIG. 5A, the conductive particles 12 are evenly distributed on the adhesive resin layer 11.

Here, the support is not limited to a rotating body such as a drum of a copying machine, and a substrate or a roll made of an insulating layer can be used. In addition, the support is not limited to one that is substantially uniformly charged over the entire surface, and one that is selectively charged by patterning the conductive layer and insulating layer, or that is irradiated with light after corona discharge such as selenium. It is also possible to use the one that is selectively charged with. When the support is selectively charged, the conductive particles can be transferred in a substantially desired distribution, for example, in a portion corresponding to the electrode of the semiconductor element, rather than randomly.

Next, the conductive particles 12 are pressed against the adhesive resin layer 11 with an apparatus having a heated head,
As shown in FIG. 5B, the conductive particles 12 are embedded in the adhesive resin layer 11 in a dispersed state.

Using the anisotropic conductive adhesive resin layer thus produced, the semiconductor element and the substrate were connected as shown in FIG. That is, as shown in FIG. 2 (a), the anisotropic conductive adhesive resin layer is sandwiched between the semiconductor element 13 and the substrate 15, and the semiconductor element 13 and the substrate 15 are pressed against each other as shown in FIG. 2 (b). The protruding electrode 14 and the wiring 16 of the substrate 15 were connected. As a result, it was possible to obtain a semiconductor device free from short circuits and opens.

Further, an anisotropic conductive adhesive resin layer is manufactured in the same manner as described above, and as shown in FIG. 3, the wiring 16 on the substrate 15 and the other substrate 17 are provided via this adhesive resin layer. The wiring 18 was connected. Also in this case, it was possible to obtain a semiconductor device without a short circuit or an open.

As described above, according to this embodiment, the conductive particles 12
Are pre-charged and the repulsive force between the conductive particles is utilized to transfer the conductive particles 12 to the adhesive resin layer 11 in a uniformly dispersed state. Therefore, it is possible to form an anisotropic conductive adhesive resin layer in which the conductive particles 12 in the adhesive resin layer 11 are evenly dispersed. Then, using this anisotropic conductive adhesive resin layer, when the semiconductor element and the substrate or the substrates are connected to each other, the conductive particles 12
Since they are evenly distributed, good connection can be made without causing short circuit or open.

In this embodiment, the conductive particles are once dispersedly deposited on a member (support) different from the adhesive resin layer, and then the conductive particles are transferred to the adhesive resin layer. The particles may be directly dispersed and deposited on the adhesive resin layer. Alternatively, the resin for forming the adhesive resin layer and the electrically conductive particles that have been charged may be kneaded and then spread into a sheet. Also in this case, the uniform dispersion is improved by the repulsive force between the conductive particles rather than using the uncharged conductive particles. Further, the adhesive resin is not necessarily limited to the organic polymer material, and any insulating material can be used. <Example 3>

FIG. 6 is a sectional view showing an anisotropic conductive adhesive resin layer according to the third embodiment of the present invention. The anisotropic conductive adhesive resin layer is composed of a thin adhesive resin layer 11 made of an organic polymer and fine conductive particles 12. And the conductive particles 12
Has a structure protruding from one surface of the adhesive resin layer 11 in a protruding shape.

Here, as the material of the adhesive resin layer 11, a thermoplastic resin or a thermosetting resin can be used as in the first embodiment, but in this embodiment, the main component of the adhesive resin is used. An epoxy resin was used as. The manufacturing process of the adhesive resin layer 11 was the same as that of the first embodiment, and the thickness was 20 μm. The conductive particles 12 may be made of any material as described in the first embodiment as long as the surface has conductivity. The size of the conductive particles 12 may be arbitrary, but in consideration of the configuration of FIG. 6, it is set to 25 ± 3 μm in this embodiment.

The method for dispersing the conductive particles 12 in the adhesive resin layer 11 was as follows. First, the conductive particles 12
Is charged by friction charging. As a result, the conductive particles repel each other and are dispersed at a constant interval proportional to the charge amount. On the other hand, a support such as a substrate or a roll is charged by corona discharge or the like so as to have a charge opposite to that of the conductive particles 12. The support is composed of an insulating layer, and it is charged substantially uniformly over the entire surface, selectively charged with a conductive layer and an insulating layer patterned, and selenium, etc. A material that can be selectively charged by irradiation is used. In this example, a conductive particle transfer device as shown in FIG. 8 was used. In this apparatus, charged conductive particles 12 are filled in a container 21, and the conductive particles 12 are transferred onto the peripheral surface of the drum 22 by rotating the drum 22 as a support. By selectively charging the drum 22 as described above, the conductive particles 12 can be selectively transferred.

In this way, the conductive particles 12 are transferred to the drum 22 which is selectively charged by the electric attraction force. Also,
Conductive particles that can be selectively charged
The 12 can be transferred in a substantially desired distribution, for example, in a non-random manner, for example, in a corresponding portion of an electrode of a semiconductor element. Further, the conductive particles 12 do not necessarily have to separate the adjacent conductive particles in all, and there is no problem even if they are in contact with each other. In this example, the conductive particles 12 were dispersed in the portions corresponding to the electrodes of the semiconductor element.

Then, a stronger charge than that of the drum 22 is applied to the back surface of the adhesive resin layer 11, and the conductive particles 12 transferred to the drum 22 are transferred again to the adhesive resin layer 11 side. As a result, the conductive particles 12 are selectively dispersed and arranged on the adhesive resin layer 11.

Next, the conductive particles 12 are heated to form an adhesive resin layer.
By being pressed against 11, the conductive particles 12 are embedded in the adhesive resin layer 11 as shown in FIG. Here, by controlling the pressing amount, it is possible to form an anisotropic conductive adhesive resin layer in which the conductive particles 12 on one surface perpendicular to the axis where at least conduction is obtained protrude from the adhesive resin layer 11 in a protruding shape. You can Further, by increasing the particle size of the conductive particles 12 depending on the thickness of the adhesive resin layer 11, it is possible to easily form the anisotropic conductive adhesive resin layer protruding from at least one surface of the adhesive resin layer 11.

Using this anisotropic conductive adhesive resin layer, a semiconductor element and a substrate were connected as shown in FIG. That is, by sandwiching the anisotropic conductive adhesive resin layer, the semiconductor element 13 and the substrate 15 are opposed to each other, and these are pressed, whereby the semiconductor element 13 is pressed.
The electrode 14a of and the wiring 16 of the substrate 15 were connected. Specifically, a semiconductor element 13 having an electrode pitch of 130 μm and no protruding electrode is provided.
The connection temperature is 150 ° C, the pressure is 5kg / chip, and the board is 15 minutes after 2 minutes.
It was possible to obtain a semiconductor device which was free from short circuit and open by connecting with.

At this time, it was possible to establish the connection without further forming the protruding electrode 14 on the electrode 14a of the semiconductor element 13 as in the conventional case. This is because the electrode 14a is an adhesive resin layer.
This is because the electrode 14a and the conductive particles 12 can be electrically connected by hitting the conductive particles 12 protruding from 11, and the conductive particles 12 and the wiring 16 on the substrate 15 can be electrically connected by further applying pressure.

Further, the applied pressure can be made lower than that using the conventional anisotropically conductive adhesive resin layer. At this time, there are no electrodes in which continuity cannot be obtained, and the semiconductor element is not damaged and is reliably connected. I can do it. Furthermore, by selectively dispersing the conductive particles as described above,
Opening caused by the absence of conductive particles in the connection electrode portion and conversely, short circuit between adjacent electrodes caused by the conductive particles being too dense were eliminated. Then, the adhesive resin layer was cured under constant conditions, whereby a semiconductor device having a sealed structure could be obtained.

In this embodiment, the conductive particles are projected from one surface of the adhesive resin layer, but they may be projected from both surfaces. Further, the conductive particles need not necessarily be selectively arranged in correspondence with the electrode position or the like, and may be evenly dispersed. Further, when the conductive particles are not selectively arranged, the charging of the conductive particles can be omitted.

[0046]

As described above in detail, the present invention (Claim 1)
According to the method, the conductive particles are set to have a size equal to or larger than the film thickness of the adhesive resin layer, and the conductive particles are projected from at least one surface of the adhesive resin layer. Directional connections can be enabled. Furthermore, an anisotropic conductive adhesive resin layer that can connect the semiconductor element and the substrate without forming a protruding electrode on the semiconductor element and can achieve a sufficient connection even if the bonding load is reduced. It can be realized.

According to the present invention (claims 2 and 3),
By uniformly dispersing the conductive particles in the adhesive resin layer, it is possible to prevent occurrence of short-circuit or open at the time of connection due to dispersion or aggregation of the conductive particles. Further, by charging the conductive particles, a repulsive force acts on the conductive particles, and the conductive particles can be more uniformly dispersed by the repulsive force. Therefore, it becomes possible to perform the connection with a finer pitch with high reliability.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an anisotropic conductive adhesive resin layer according to a first embodiment.

FIG. 2 is a cross-sectional view showing how a semiconductor element and a substrate using the anisotropic conductive adhesive resin layer of FIG. 1 are connected.

FIG. 3 is a cross-sectional view showing how the substrates are connected using the anisotropic conductive adhesive resin layer of FIG.

FIG. 4 is a schematic diagram showing a conductive particle transfer device used in a second embodiment.

FIG. 5 is a cross-sectional view showing a process of manufacturing an anisotropic conductive adhesive resin layer according to the second embodiment.

FIG. 6 is a cross-sectional view showing an anisotropic conductive adhesive resin layer according to a third embodiment.

FIG. 7 is a cross-sectional view showing a state of connection between a semiconductor element and a substrate using the anisotropic conductive adhesive resin layer of FIG.

FIG. 8 is a schematic view showing a conductive particle transfer device used for manufacturing the anisotropic conductive adhesive resin layer of FIG.

FIG. 9 is a cross-sectional view for explaining a problem of a conventional anisotropic conductive adhesive resin layer.

FIG. 10 is a cross-sectional view for explaining problems of the conventional anisotropic conductive adhesive resin layer.

FIG. 11 is a cross-sectional view for explaining problems of the conventional anisotropic conductive adhesive resin layer.

[Explanation of symbols]

11 ... Adhesive resin layer, 12 ... Conductive particles, 13 ... Semiconductor element, 14 ... Projection electrode, 14a ... Electrode,
15, 17 ... Substrate, 16, 18 ... Wiring, 21 ... Container, 22 ... Roller.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification number Office reference number FI technical display location H01R 43/00 H 9174-5E H05K 1/14 J 8727-4E // H05K 3/32 B 9154- 4E

Claims (3)

[Claims] 1. In an anisotropic conductive adhesive resin layer in which conductive particles are dispersed in an insulating adhesive resin layer so that conduction can be achieved only in the thickness direction of the adhesive resin layer, the diameter of the conductive particles can be adjusted. The thickness is set equal to or larger than the thickness of the adhesive resin layer, and the conductive particles are projected on at least one surface of the adhesive resin layer more than the surface of the adhesive resin layer. One-way conductive adhesive resin layer. 2. A method for producing an anisotropic conductive adhesive resin layer in which conductive particles are dispersed in an insulating adhesive resin layer so that conduction can be achieved only in the thickness direction of the adhesive resin layer, A method for producing an anisotropic conductive adhesive resin layer, which comprises charging the particles in advance before dispersing the particles in the adhesive resin layer. 3. A step of charging electrically conductive particles, a step of dispersing the charged particles on the surface of a support, a step of attaching the dispersed particles to the surface of an organic polymer adhesive resin layer, and a step of attaching the particles. And a step of embedding the particles in the adhesive resin layer.