JPH0564968B2 - - Google Patents

Info

Publication number
JPH0564968B2
JPH0564968B2 JP10386988A JP10386988A JPH0564968B2 JP H0564968 B2 JPH0564968 B2 JP H0564968B2 JP 10386988 A JP10386988 A JP 10386988A JP 10386988 A JP10386988 A JP 10386988A JP H0564968 B2 JPH0564968 B2 JP H0564968B2
Authority
JP
Japan
Prior art keywords
formula
epoxy resin
organopolysiloxane
parts
polyalkylene oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP10386988A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01275625A (ja
Inventor
Kenichi Yanagisawa
Koichi Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP10386988A priority Critical patent/JPH01275625A/ja
Publication of JPH01275625A publication Critical patent/JPH01275625A/ja
Publication of JPH0564968B2 publication Critical patent/JPH0564968B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Sealing Material Composition (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP10386988A 1988-04-28 1988-04-28 半導体封止用エポキシ樹脂組成物 Granted JPH01275625A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10386988A JPH01275625A (ja) 1988-04-28 1988-04-28 半導体封止用エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10386988A JPH01275625A (ja) 1988-04-28 1988-04-28 半導体封止用エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPH01275625A JPH01275625A (ja) 1989-11-06
JPH0564968B2 true JPH0564968B2 (enrdf_load_stackoverflow) 1993-09-16

Family

ID=14365445

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10386988A Granted JPH01275625A (ja) 1988-04-28 1988-04-28 半導体封止用エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPH01275625A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3392068B2 (ja) * 1999-01-26 2003-03-31 松下電工株式会社 光半導体封止用エポキシ樹脂組成物及び光半導体装置

Also Published As

Publication number Publication date
JPH01275625A (ja) 1989-11-06

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Legal Events

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LAPS Cancellation because of no payment of annual fees