JPH0564859B2 - - Google Patents

Info

Publication number
JPH0564859B2
JPH0564859B2 JP7430185A JP7430185A JPH0564859B2 JP H0564859 B2 JPH0564859 B2 JP H0564859B2 JP 7430185 A JP7430185 A JP 7430185A JP 7430185 A JP7430185 A JP 7430185A JP H0564859 B2 JPH0564859 B2 JP H0564859B2
Authority
JP
Japan
Prior art keywords
tab
lead
resist
lead frame
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP7430185A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61234062A (ja
Inventor
Hiroshi Shimazu
Yasuo Yamashita
Masayoshi Suzuki
Eiji Sakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Ltd
Original Assignee
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Maxell Ltd filed Critical Hitachi Maxell Ltd
Priority to JP7430185A priority Critical patent/JPS61234062A/ja
Publication of JPS61234062A publication Critical patent/JPS61234062A/ja
Publication of JPH0564859B2 publication Critical patent/JPH0564859B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP7430185A 1985-04-10 1985-04-10 半導体装置のリ−ドフレ−ム製造方法 Granted JPS61234062A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7430185A JPS61234062A (ja) 1985-04-10 1985-04-10 半導体装置のリ−ドフレ−ム製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7430185A JPS61234062A (ja) 1985-04-10 1985-04-10 半導体装置のリ−ドフレ−ム製造方法

Publications (2)

Publication Number Publication Date
JPS61234062A JPS61234062A (ja) 1986-10-18
JPH0564859B2 true JPH0564859B2 (cs) 1993-09-16

Family

ID=13543169

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7430185A Granted JPS61234062A (ja) 1985-04-10 1985-04-10 半導体装置のリ−ドフレ−ム製造方法

Country Status (1)

Country Link
JP (1) JPS61234062A (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2521417B2 (ja) * 1994-08-22 1996-08-07 九州日立マクセル株式会社 電鋳方法

Also Published As

Publication number Publication date
JPS61234062A (ja) 1986-10-18

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees