JPH0562459B2 - - Google Patents
Info
- Publication number
- JPH0562459B2 JPH0562459B2 JP58231497A JP23149783A JPH0562459B2 JP H0562459 B2 JPH0562459 B2 JP H0562459B2 JP 58231497 A JP58231497 A JP 58231497A JP 23149783 A JP23149783 A JP 23149783A JP H0562459 B2 JPH0562459 B2 JP H0562459B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- film device
- planarization
- etching
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23149783A JPS60124825A (ja) | 1983-12-09 | 1983-12-09 | 薄膜デバイスの平担化方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23149783A JPS60124825A (ja) | 1983-12-09 | 1983-12-09 | 薄膜デバイスの平担化方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60124825A JPS60124825A (ja) | 1985-07-03 |
JPH0562459B2 true JPH0562459B2 (enrdf_load_stackoverflow) | 1993-09-08 |
Family
ID=16924413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23149783A Granted JPS60124825A (ja) | 1983-12-09 | 1983-12-09 | 薄膜デバイスの平担化方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60124825A (enrdf_load_stackoverflow) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5882536A (ja) * | 1981-11-10 | 1983-05-18 | Fujitsu Ltd | 半導体装置の製造方法 |
-
1983
- 1983-12-09 JP JP23149783A patent/JPS60124825A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60124825A (ja) | 1985-07-03 |
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