JPH0561792B2 - - Google Patents
Info
- Publication number
- JPH0561792B2 JPH0561792B2 JP3053789A JP3053789A JPH0561792B2 JP H0561792 B2 JPH0561792 B2 JP H0561792B2 JP 3053789 A JP3053789 A JP 3053789A JP 3053789 A JP3053789 A JP 3053789A JP H0561792 B2 JPH0561792 B2 JP H0561792B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- conductive layer
- copper
- thickness
- plastic film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002985 plastic film Substances 0.000 claims description 23
- 229920006255 plastic film Polymers 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 19
- 238000001704 evaporation Methods 0.000 claims description 18
- 230000008020 evaporation Effects 0.000 claims description 18
- 238000009713 electroplating Methods 0.000 claims description 12
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 230000000903 blocking effect Effects 0.000 claims description 7
- 238000007738 vacuum evaporation Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000001771 vacuum deposition Methods 0.000 claims description 5
- 239000010408 film Substances 0.000 description 47
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 23
- 229910052802 copper Inorganic materials 0.000 description 20
- 239000010949 copper Substances 0.000 description 20
- 239000010410 layer Substances 0.000 description 17
- 229920001721 polyimide Polymers 0.000 description 10
- 239000010409 thin film Substances 0.000 description 10
- 238000007740 vapor deposition Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 238000010894 electron beam technology Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 238000009835 boiling Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229920001646 UPILEX Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3053789A JPH02209797A (ja) | 1989-02-09 | 1989-02-09 | フレキシブルプリント回路用基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3053789A JPH02209797A (ja) | 1989-02-09 | 1989-02-09 | フレキシブルプリント回路用基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02209797A JPH02209797A (ja) | 1990-08-21 |
| JPH0561792B2 true JPH0561792B2 (fr) | 1993-09-07 |
Family
ID=12306548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3053789A Granted JPH02209797A (ja) | 1989-02-09 | 1989-02-09 | フレキシブルプリント回路用基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02209797A (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102145822B1 (ko) * | 2012-01-13 | 2020-08-28 | 아르조 위긴스 파인 페이퍼즈 리미티드 | 시트의 제조방법 |
-
1989
- 1989-02-09 JP JP3053789A patent/JPH02209797A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02209797A (ja) | 1990-08-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |