JPH0560258B2 - - Google Patents

Info

Publication number
JPH0560258B2
JPH0560258B2 JP60075647A JP7564785A JPH0560258B2 JP H0560258 B2 JPH0560258 B2 JP H0560258B2 JP 60075647 A JP60075647 A JP 60075647A JP 7564785 A JP7564785 A JP 7564785A JP H0560258 B2 JPH0560258 B2 JP H0560258B2
Authority
JP
Japan
Prior art keywords
die
bonding
arm
point
collet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP60075647A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61234040A (ja
Inventor
Kazuyuki Funatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60075647A priority Critical patent/JPS61234040A/ja
Publication of JPS61234040A publication Critical patent/JPS61234040A/ja
Publication of JPH0560258B2 publication Critical patent/JPH0560258B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/073—
    • H10W72/07337—

Landscapes

  • Die Bonding (AREA)
JP60075647A 1985-04-10 1985-04-10 ダイボンデイング装置 Granted JPS61234040A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60075647A JPS61234040A (ja) 1985-04-10 1985-04-10 ダイボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60075647A JPS61234040A (ja) 1985-04-10 1985-04-10 ダイボンデイング装置

Publications (2)

Publication Number Publication Date
JPS61234040A JPS61234040A (ja) 1986-10-18
JPH0560258B2 true JPH0560258B2 (enExample) 1993-09-01

Family

ID=13582257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60075647A Granted JPS61234040A (ja) 1985-04-10 1985-04-10 ダイボンデイング装置

Country Status (1)

Country Link
JP (1) JPS61234040A (enExample)

Also Published As

Publication number Publication date
JPS61234040A (ja) 1986-10-18

Similar Documents

Publication Publication Date Title
JPH09298210A (ja) ダイボンディング装置
US20010000057A1 (en) Semiconductor mounting apparatus with a chip gripper traveling back and forth
JP2004363607A (ja) コンポーネント用の複式配送デバイスを備えた半導体装置
KR20180100364A (ko) 전자 부품 실장 장치
JPH0132654B2 (enExample)
JP3497078B2 (ja) ダイボンダ
JPH10163252A (ja) フリップチップの実装装置
JP2000094232A (ja) 高さ調整機構及びそれを用いたチップ実装装置
JPH0560258B2 (enExample)
JP4981426B2 (ja) ボンディング装置のボンディングヘッド
JP4862872B2 (ja) 部品実装装置
KR100252317B1 (ko) 리드 프레임의 다이 본딩장치
JP2617249B2 (ja) リードフレームに対する半導体チップの供給装置
CN1630465A (zh) 粘片机引线框架供送空间凸轮机构组合装置
JP2715538B2 (ja) 電子部品吸着用ノズルのθ方向回転駆動機構
JP3341762B2 (ja) ダイボンディング装置およびダイボンディング方法
JP4752889B2 (ja) 部品実装装置
KR100919791B1 (ko) 범프 본딩 장치
US5599159A (en) Pellet conveying device
KR910006240B1 (ko) 다이 본딩 장치
JP2568649B2 (ja) ダイボンディング装置
JPH08773Y2 (ja) レーザダイオード用チップボンディング装置における位置決め機構
JP2826250B2 (ja) ボンディング装置及びボンディング方法
JP2775553B2 (ja) ワイヤボンディング装置及びワイヤボンディング方法
KR900008863Y1 (ko) 다이본딩장치

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees